A memory device includes a memory array having at least one memory bank, where the at least one memory bank includes a target memory array and a clone memory array. The clone memory array corresponds to the target memory array and is configured to store the same data as in the target memory array. When a command that is applied to the target memory array to perform an operation, the command is also applied to the clone memory array. An error detection method adapted to a memory device having at least one memory bank that comprises a target memory array and a clone memory array is also introduced.

Embodiments relate methods and computer program products for performance testing of a solid state memory devices. The method includes operating a first solid state memory device for a period of time and capturing state information of the first solid state memory device after the period of time. The method also includes storing the state information in a control file and loading the control file onto a second solid state memory device. Once the control file has been loaded into the second solid state memory device the state information can be adapted to fix any issues due to physical variation. Performance testing can then be preformed on the second solid state memory device without preconditioning the second solid state memory device.

A method is provided that includes performing a post-write read operation on a block of memory cells that includes a select gate transistor, and based on results of the post-write read operation selectively performing a select gate maintenance operation on the select gate transistor.

Provided are a multi-channel package capable of reducing a test cost while performing a test at a high speed, and a test apparatus and a test method of testing the multi-channel package. The multi-channel package includes: a package substrate; and at least two semiconductor chips mounted on the package substrate and having different channels, wherein each of the at least two semiconductor chips includes a built-in-self-test (BIST) circuit and operates in one of a self-test mode, a tester mode, and a target mode during a test, and in the tester mode or the target mode, the at least two semiconductor chips are configured to be inter-channel cross-tested through an external signal path of the package substrate.

A semiconductor package includes first through third memory chips. The first memory chip is arranged on a package substrate, the second memory chip is arranged on the first memory chip, and the third memory chip is arranged between the first memory chip and the second memory chip. Each of the first through third memory chips includes a memory cell array storing data, stress detectors, a stress index generator, and a control circuit. The stress detectors are formed and distributed in a substrate, and detect stacking stress in response to an external voltage to output a plurality of sensing currents. The stress index generator converts the plurality of sensing currents into stress index codes. The control circuit adjusts a value of a feature parameter associated with an operating voltage of a corresponding memory chip, based on at least a portion of the stress index codes.

A method is provided that includes performing a post-write read operation on a block of memory cells that includes a select gate transistor, and based on results of the post-write read operation selectively performing a select gate maintenance operation on the select gate transistor.

Embodiments relate methods and computer program products for performance testing of a solid state memory devices. The method includes operating a first solid state memory device for a period of time and capturing state information of the first solid state memory device after the period of time. The method also includes storing the state information in a control file and loading the control file onto a second solid state memory device. Once the control file has been loaded into the second solid state memory device the state information can be adapted to fix any issues due to physical variation. Performance testing can then be preformed on the second solid state memory device without preconditioning the second solid state memory device.

A memory device includes memory banks that each include a bank array having memory cells, a row decoder, and a column decoder. Each memory cell includes a capacitor and a transistor, a write circuit to store input data received at the memory device from a test device in the bank array, a read circuit to generate output data based on reading data stored in the bank array, a parity data management circuit to generate first parity data smaller than the input data using the input data, generate second parity data smaller than the output data using the output data, and generate third parity data using the first and second parity data, and an output circuit to output at least one of the first, second, and third parity data as verification data, in response to receipt of a request from the test device at the memory device.

A semiconductor package includes first through third memory chips. The first memory chip is arranged on a package substrate, the second memory chip is arranged on the first memory chip, and the third memory chip is arranged between the first memory chip and the second memory chip. Each of the first through third memory chips includes a memory cell array storing data, stress detectors, a stress index generator, and a control circuit. The stress detectors are formed and distributed in a substrate, and detect stacking stress in response to an external voltage to output a plurality of sensing currents. The stress index generator converts the plurality of sensing currents into stress index codes. The control circuit adjusts a value of a feature parameter associated with an operating voltage of a corresponding memory chip, based on at least a portion of the stress index codes.

An electronic device includes: a detection circuit configured to determine one or more operating data, one or more device sensor data, or a combination thereof associated with operation of the electronic device; a trigger circuit operably coupled to the circuit, the trigger circuit configured to generate a stress input based on detecting one or more target criteria from the one or more operating data, the one or more device sensor data, or a combination thereof; and a degradation sensor operably coupled to the trigger circuit, the degradation sensor having a threshold voltage and being configured to record the target criteria that occurs during operation of the electronic device, wherein the degradation sensor is configured to record the target criteria based on degradation of the threshold voltage according to the stress input.