An automatic test equipment (ATE) contactor adapter compatible with at least one test board. The contactor adapter includes a contactor adapter body having a first side and a second side. The contactor adapter body includes: 1) a first set of contact components disposed on the first side in an arrangement to contact conductive pads of the at least one test board; and 2) a second set of contact components disposed on the second side and coupled to the first set of contact points. The contactor adapter also includes an adapter interface disposed on the contactor adapter body. The adapter interface includes a third set of contact components coupled to the second set of contact components. The ATE contactor adapter is configured to convey signals between a device under test (DUT) and the at least one test board via the first, second, and third sets of contact components.

An interface device is provided between a test head and a DUT. In the interface device, each pin electronics IC is coupled to a DUT via an FPC cable.

An interface apparatus is provided between a test head and a DUT. The interface apparatus includes a frontend module configured of multiple pin electronics ICs in the form of a module.

An interface device is provided between a test head and a device under test (DUT). A socket board includes sockets each configured to mount a DUT, and a socket PCB having a first face that mounts the sockets and a second face provided with multiple back face electrodes. An interposer has a first face provided with multiple deformable electrodes and a second face provided with multiple non-deformable electrodes and is configured such that the multiple deformable electrodes are in contact with the multiple back face electrodes of the socket PCB. An FPC cable has multiple electrode pads to be coupled with the multiple non-deformable electrodes on the second face of the first interposer.

An interface device is provided between a test head and a DUT. The interface device includes pin electronics ICs, RAM, a pin controller, and nonvolatile memory. The RAM stores data based on a device signal received from the DUT by means of the multiple pin electronics ICs. The pin controller controls the multiple pin electronics ICs according to a control signal from the test head. The multiple pin electronics ICs, the RAM, and the pin controller are mounted on a pin electronics PCB.

Disclosed is a test and measurement probe. The test and measurement probe includes a probe tip to connect to a Device Under Test (DUT). The probe tip includes a Resistor Capacitor (RC) probe tip network coupled to a test signal channel. The test and measurement probe also includes at least one variable resistor coupled to the test signal channel. The at least one variable resistor is set to provide an adjustable resistance to compensate for frequency variation in the RC probe tip network.

A test device for a printed circuit board assembly is disclosed. The test device includes a test platform for securing a printed circuit board assembly to be tested and a positioning platform located above the test platform and for securing a plurality of test probes. The plurality of test probes are secured at the bottom of the positioning platform and the secured positions in the positioning platform thereof are adjustable to align the test points on the printed circuit board assembly to be tested.

A testing system for semiconductor chips having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. The DUT PCB is quickly and easily removed and replaced by moving the locking posts between an engaged position and a disengaged position. In this way, a single testing system can be used to test a great variety of semiconductor chips thereby reducing capital equipment costs and space needed in cleanrooms.

The present invention relates to a testing device and to a method for testing circuit boards, in particular un-equipped or partially-equipped circuit boards. The testing device is a flying probe with a shuttle or two sub-shuttles, which can displace a circuit board to be tested to a test area in an alternating manner. In addition, the sub-shuttles can be used for commonly holding a large circuit board.

Disclosed is a fixture including: a base including a bearing surface for bearing a T-CON board, and a limit mechanism for limiting displacement of the T-CON board in a direction parallel to the bearing surface; and a probe assembly for jointing with an upgrading lead port of the T-CON board, wherein the probe assembly is installed on the base and has an adjustable relative position with the bearing surface in a direction perpendicular to the bearing surface. When in upgrading, the T-CON board is arranged on the bearing surface of the base firstly, the position of the T-CON board is fixed by the limit mechanism, and the probe assembly is aligned with the upgrading lead port of the T-CON board, and is adjusted and moved in the direction perpendicular to the bearing surface so as to joint with the upgraded lead port of the T-CON board.