Disclosed is a test and measurement probe. The test and measurement probe includes a probe tip to connect to a Device Under Test (DUT). The probe tip includes a Resistor Capacitor (RC) probe tip network coupled to a test signal channel. The test and measurement probe also includes at least one variable resistor coupled to the test signal channel. The at least one variable resistor is set to provide an adjustable resistance to compensate for frequency variation in the RC probe tip network.

A probe card includes a probe having a spring property and a probe head that holds the probe. The probe head includes a guide portion that holds the probe such that the probe can move in an axis direction Z. The guide portion includes a heat radiation structure that absorbs heat of the probe generated by energization and emits the heat to the outside of the probe.

A test device for electrically testing a component having a component body and one or more component contacts adjacent to or extending from a side of the component body orthogonal to a contact direction, the component contacts electrically connected to an electrical circuit disposed in the component body. The test device has two or more test terminals for being electrically connected to at least one of the component contacts, the two or more test terminals being arranged substantially parallel to each other and extending in a terminal direction different from the contact direction.

The radio frequency (RF) probe socket is disclosed. The probe socket includes a conductive noise shielding body configured to accommodate the plurality of signal probes to be parallel with one another while exposing opposite ends thereof, and shield noise; upper and lower noise shielding walls configured to be extended from the noise shielding body to some areas between the exposed opposite ends of the plurality of signal probes; and upper and lower holding members configured to be arranged on top and bottom sides of the noise shielding body, support the exposed opposite ends of the plurality of signal probes, and comprise accommodating grooves accommodate the noise shielding walls, respectively. With this, the noise shielding wall extended from the shielding block makes a shield between the signal probe pins passing through the upper and lower holding member, thereby preventing crosstalk between the signal probe pins.

A method includes measuring a first calibration kit in a wafer to obtain a first performance data. The wafer includes a substrate, and a plurality of dielectric layers over the substrate. The first calibration kit includes a first passive device over the plurality of dielectric layers, wherein substantially no metal feature is disposed in the plurality of dielectric layers and overlapped by the first passive device. The method further includes measuring a second calibration kit in the wafer to obtain a second performance data. The second calibration kit includes a second passive device identical to the first device and over the plurality of dielectric layers, and dummy patterns in the plurality of dielectric layers and overlapped by the second passive device. The first performance data and the second performance data are de-embedded to determine an effect of metal patterns in the plurality of dielectric layers to overlying passive devices.

A circuit structure, an electronic device, and a manufacturing method of the electronic device are provided. The circuit structure includes a support layer, a base layer, and a circuit layer. The base layer is disposed on the support layer. The circuit layer is disposed on the base layer and includes a first conductive layer, a first insulating layer, and a second conductive layer. The first conductive layer is disposed on the base layer. The first insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulating layer. The elongation of the support layer is smaller than the elongation of the base layer.

A probing apparatus for detection of an electric signal generated by a device-under-test. The probing apparatus comprises a rigid support structure having a contact surface adapted for sliding contact with the device-under-test, and a probing instrument adapted to contact the connector for tapping the electric signal. Magnets on the support structure are adapted to apply attracting force on a mating metal element on the device-under-test such that the probing instrument is aligned to contact the connector, wherein a gap is formed between each magnet and mating metal element when said contact surface touches the device-under-test.

A testing system for semiconductor chips having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. The DUT PCB is quickly and easily removed and replaced by moving the locking posts between an engaged position and a disengaged position. In this way, a single testing system can be used to test a great variety of semiconductor chips thereby reducing capital equipment costs and space needed in cleanrooms.

A test device for a printed circuit board assembly is disclosed. The test device includes a test platform for securing a printed circuit board assembly to be tested and a positioning platform located above the test platform and for securing a plurality of test probes. The plurality of test probes are secured at the bottom of the positioning platform and the secured positions in the positioning platform thereof are adjustable to align the test points on the printed circuit board assembly to be tested.

Embodiments of the present disclosure provide techniques and configurations for a package testing system. In some embodiments, the system may comprise a printed circuit board (PCB), including one or more sensors disposed adjacent to a corner of the PCB to face a package to be tested, to detect an electrical edge of the package. The PCB may include a contactor array disposed to face respective interconnects of the package. The system may further include a controller coupled with the one or more sensors, to process an input from the one or more sensors, to identify the electrical edge of the package, and initiate an adjustment of a position of the PCB relative to the package, based at least in part on the electrical edge of the package, to substantially align contacts of the contactor array with the respective interconnects of the package. Other embodiments may be described and/or claimed.