Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.

Illustrative embodiments disclosed herein pertain to a testing apparatus for performing in-circuit tests upon a printed circuit board assembly. Each of these tests may require the use of a set of probes arranged in a customized layout. This is traditionally accomplished by using a set of predefined probe plates, some or all of which may include probes that are either redundant or duplicated amongst the various probe plates, thereby introducing an undesirable cost penalty. A testing apparatus in accordance with the disclosure incorporates a configurable probe fixture that includes a docking plate configured to support a first set of probe modules for carrying out a first test upon a printed circuit board assembly. Some or all of the probe modules can then be selectively removed or replaced by other probe modules for reconfiguring the testing apparatus to carry out other tests upon the printed circuit board assembly.

A ceramic according to the present invention includes, in mass %, BN: 20.0 to 55.0%, SiC: 5.0 to 40.0%, ZrO.sub.2 and/or Si.sub.3N.sub.4: 3.0 to 60.0%. The ceramic has a coefficient of thermal expansion at 50 to 500 C. of 1.010.sup.6 to 5.010.sup.6/ C., is excellent in low electrostatic properties (10.sup.6 to 10.sup.14 .Math.cm in volume resistivity) and free-machining properties, and is thus suitable to be used for, for example, a probe guiding member for guiding probes of a probe card, and a socket for package inspection.

A rectangular probe includes two broad side surfaces and two narrow side surfaces each parallel to a longitudinal direction of the rectangular probe. The rectangular probe includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments, and a stroke structure arranged on the middle segment, the first contacting segment, or the second contacting segment. A longitudinal thru-hole of the stroke structure is formed by penetrating through the two broad side surfaces. Two transverse grooves of the stroke structure are respectively recessed in the two broad side surfaces. The two transverse grooves are configured to move in two directions away from each other so as to reduce a length of the rectangular probe.

An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a first end (23a) and a second end (23b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).

The inspection jig includes a rod-shaped probe in which one end portion is brought into press contact with an inspection target; and a plate-shaped first support having a support hole which supports the probe. The support hole includes a first taper hole portion having a diameter that increases from a side of one wall surface of the first support toward a side of a plate-thickness-direction middle portion of the first support.

The present invention is intended to provide a vertical probe and a jig which has sufficient flexibility for contact reaction force from the electrical contact to be inspected, easy insertion and assembly of the probe even with narrow pitch, and enables cost reduction and delivery time reduction, wherein means for driving and positioning relative positions of upper and lower hole plates is provided, the straight pins as materials of vertical probes are inserted into the upper and lower hole plates, plastic deformation is applied to the straight pin by driving and positioning the relative position of the upper and lower hole plates, a symmetrical arched shape is provided, and a bending point is formed in the vicinity of the lower side of the upper hole plate and in the vicinity of the upper side of the lower hole plate.

There is provided a probe device for inspecting a wafer. The probe device includes: an upper camera provided in a wafer alignment unit; a lower camera provided in a stage; a target member provided in any one of the wafer alignment unit and the stage; and a control circuit configured to control each operation of the upper and lower camera. The target member has an end surface on which a target mark is provided, wherein any of the upper and lower camera is configured to capture an image of the target mark. The control circuit is configured to acquire a captured image of the target mark using any of the upper camera and the lower camera; and calculate a correspondence between a specific physical parameter and a value represented in the captured image for a parameter represented in the captured image among physical parameters, based on the acquired captured image.

A probe card device and a rectangular probe are provided. The rectangular probe includes a metallic pin, an insulating film, and an insulating latch. The metallic pin includes a connecting portion, a detecting portion, and a middle segment arranged between the connecting portion and the detecting portion. The insulating film covers entirely outer surfaces of the middle segment. The insulating latch is in a ring shape and is arranged around at least part of the insulating film. A bottom of the insulating latch is arranged adjacent to the detecting portion. A length of the insulating latch is less than or equal to that of the insulating film, and a thickness of the insulating latch is larger than that of the insulating film and is at least 10 m.

A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.