A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

A conduction inspection jig includes a first member having first openings and a flexural strength of 300 MPa or higher, a second member having second openings and positioned above the first member, a support member positioned between the first member and the second member such that the support member is forming a space between the first member and the second member, and a probe that is positioned in one of the first openings in the first member and one of the second openings in the second member such that the probe penetrates through the one of the first openings, the space formed between the first member and the second member, and the one of the second openings and has a first end portion protruding from the first member and a second end portion protruding from the second member on the opposite side with respect to the first end portion.

The instant disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a metal main portion, a covering layer and an insulating layer. The metal main portion has a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first and the second end portions and a surrounding surface surrounding the first end portion, the second end portion and the connecting portion. The covering layer includes a first covering layer disposed on a surrounding surface located on the first end portion, a second covering layer disposed on a surrounding surface located on the second end portion and a third covering layer disposed on a surrounding surface located on the connecting portion. The insulating layer is disposed on the third covering layer for exposing the first and second covering layer.

A testing head comprises at least one guide provided with a plurality of guide holes, and a plurality of contact elements housed in the plurality of guide holes. Suitably, the at least one guide comprises a plurality of conductive layers, each conductive layer: including holes of a corresponding plurality of group of the plurality of guide holes and electrically connecting a corresponding group of contact elements housed in the guide holes of the group, contact elements of a group being adapted to carry a same type of signal. The at least one guide is a multilayer comprising a plurality of non-conductive layers, and the conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers.

A testing head comprises a plurality of contact probes, and a guide having a plurality of guide holes for housing the contact probes and including a conductive portion. Each contact probe includes a first end region and a second end region, and a body which extends between the first and second end regions. Suitably, the conductive portion includes a group of the guide holes and electrically connects contact probes of a first group of the contact probes. The contact probes of the first group slide in the guide holes in the conductive portion and are adapted to carry a same signal, and each contact probe of a second group of the plurality of contact probes is surrounded by an insulating coating layer that extends along the body of each contact probe of the second group, thereby insulating the contact probes of the second group from the conductive portion.

A probe card of a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane. Suitably, the testing head is arranged between the support plate and a first portion of the flexible membrane, which is connected to the support plate through a second portion thereof, the probe card further comprising a plurality of contact tips arranged on a first face of the flexible membrane at the first portion thereof, the second end portion of each contact element being apt to abut onto a second face of the flexible membrane, opposite to the first face, the number and distribution of the contact elements being different to the number and distribution of the contact tips.

A probe card for a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis (H-H) between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane which comprises a first face and a second and opposite face. Conveniently, the first portion of the flexible membrane is arranged on at least one support and comprises a plurality of strips extending between a proximal end and a distal end, the probe card further including a plurality of micro contact probes comprising a body extending along the longitudinal axis (H-H) between a first end portion and a second end portion, the second end portion of each contact element abutting onto the first face of the flexible membrane at the distal end of a respective strip, and the first end portion of each micro contact probe abutting onto the second face of the flexible membrane at a respective contact element, the flexible membrane being electrically connected to the support plate through a second portion thereof, the second end portion of the micro contact probes being apt to contact the contact pads of a device to be tested, wherein the at least one support is provided with a plurality of guide holes for the housing of the plurality of micro contact probes.

An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact whilst compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.

Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.