A probe card device including a probe structure is provided. Probes respectively pass through multiple through holes on at least two guide plates that are stacked and separated from each other, and each of the probes includes a main body, a contacting portion, a head portion, and a neck portion. The contacting portion is exposed under a lowermost guide plate. The head portion is exposed above an uppermost guide plate. The neck portion is connected between the main body and the head portion, and a part of the neck portion protrudes opposite thereof to form a protrusion portion. The protrusion portion and the main body form an included angle, the protrusion portion abuts against an upper surface of the uppermost guide plate, and a spacing between any two of the probes that are adjacent to each other is less than twice the thickness of the protrusion portion.

Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.

Provided is a probe card, comprising a guide plate and a shielding structure of single-layer or multi-layer. The guide plate comprises an upper surface, a lower surface, and at least one guide hole passing through the upper surface and the lower surface, and the guide hole is provided with an inner wall surface. At least one layer of the shielding structure is made of an electromagnetic absorption material or an electromagnetic reflection material, and the shielding structure is not connected to a ground. Each layer of the shielding structure is formed on the inner wall surface of the guide hole by means of atomic layer deposition or atomic layer etching, and a thickness of each layer is less than 1000 nm.

An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.

A rectangular probe of a probe card device includes an upper positioned segment, an upper contacting segment, a deformable segment, a lower positioned segment, and a lower contacting segment. The upper positioned segment includes an offset portion, a first positioned portion extending from the offset portion along a first direction, and a second positioned portion extending from a second direction being parallel to and opposite to the first direction. In a width direction perpendicular to the first direction, a width of the first positioned portion is 25%-95% of a width of the offset portion, and a width of the second positioned portion is 25%-95% of the width of the offset portion. The upper contacting segment extends from the first positioned portion along the first direction. The deformable segment, the lower positioned segment, and the lower contacting segment sequentially extend from the second positioned portion along the second direction.

An embodiment includes an apparatus comprising: a substrate including a surface that comprises first, second, and third apertures; and first, second, and third probes comprising proximal ends that are respectively included within and project from the first, second, and third apertures; wherein the first, second, and third probes: (a)(i) intersect a plane that is generally coplanar with the surface, (a)(ii) include distal ends configured to contact electrical contacts of a device under test (DUT), and (a)(iii) are generally linear and each include a major axis that is non-orthogonal to the plane. Other embodiments are described herein.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

A probe head includes a first die, a second die, and a plurality of rectangular probes. Each rectangular probe includes a deformable segment arranged between the first and the second dies, a first positioned segment, and a second positioned segment, the latter two of which respectively extend from two opposite ends of the deformable segment and are respectively arranged in a first rectangular wall of the first die and a second rectangular wall of the second die. Each first rectangular wall and the corresponding second rectangular wall have a longitudinal offset and a width offset so as to press the first and second positioned segments of the corresponding rectangular probe, so that the deformable segment of the corresponding rectangular probe is compressed to be in a curved and deformed shape. A ratio of the longitudinal offset to the width offset is within a range of 10 to 1.

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer comprises a plurality of contact elements, each comprising a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements, the guide comprising a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.