The present disclosure discloses a probe card device and a rectangular probe. The rectangular probe includes a metallic pin, an insulating film, and an insulating latch. The metallic pin includes a connecting portion, a detecting portion, and a middle segment arranged between the connecting portion and the detecting portion. The insulating film covers entirely outer surfaces of the middle segment. The insulating latch is in a ring shape and is arranged around at least part of the insulating film. A bottom of the insulating latch is arranged adjacent to the detecting portion. A length of the insulating latch is less than or equal to that of the insulating film, and a thickness of the insulating latch is larger than that of the insulating film and is at least 10 m.

The present disclosure discloses a probe card device and a rectangular probe thereof. The rectangular probe includes a branch segment, a first contacting segment and a second contacting segment. The branch segment is ring-shaped and has a perforation, and the branch segment includes two branch arms respectively located at two sides of the perforation. The first contacting segment is located at a side of the branch segment and is pierced through a first through hole of a first guide plate. The second contacting segment is located at the other side of the branch segment. A maximum width portion of the branch segment has a variable width greater than a hole size of the first through hole, and the two branch arms of the branch segment are compressible to enable the variable width to be less than or equal to the hole size of the first through hole.

An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.

Disclosed is a test socket for inspecting an electronic device that is particular about properties. The test socket for inspecting electric properties of a subject includes a plurality of probes configured to be retractable in an inspection direction; a probe supporter configured to support the plurality of probes so that first ends of the plurality of probes protrudes to contact with an object contact point of a subject; and a printed circuit board (PCB) configured to be placed beneath the probe supporter, be mounted with electronic parts, be formed with holes through which second ends of the plurality of probes pass, include at least one first pad with which at least one second end of the plurality of probes comes into contact and at least one second pad formed on an opposite side to the first pad, and be formed with electric paths extended from the first pad and the second pad and connected to the mounted electronic parts.

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

The inspection jig includes a rigid substrate, a flexible substrate connected to the rigid substrate, a contactor block for supporting a part of the flexible substrate in a state that the part of the flexible substrate is protruded with respect to the rigid substrate, a contactor provided on a protruding portion of the flexible substrate, and a spring probe supported by the contactor block, one end of which is in contact with a contact pad provided on a lower surface of the rigid substrate, and the other end of which protrudes from a protruding portion of the flexible substrate.

Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.

Provided is an electric connecting apparatus 10 including a plurality of probes 20, a probe substrate 16 connected to base end portions 20b of the probes 20, and a probe support body 18, when tip end portions 20a of the probes 20 are pressed by a device under test, preventing the adjacent probes 20 from interfering. The probe support body 18 includes a plate-like guide portion 30 including guide holes through which the probes 20 pass. The guide portion 30 includes an upper guide portion 31, a lower guide portion 32, and a middle guide portion 33. The probes pass through the guide holes of the upper guide portion 31, the middle guide portion 33, and the lower guide portion 32 to be guided toward the device under test. The middle guide portion 33 is provided to be movable in a perpendicular direction X perpendicular to a thickness direction Y.

A probe card apparatus for wafer testing of a wafer under test, and a method of using the probe card for wafer testing. The probe card includes a printed circuit board having wafer testing circuitry. The probe card also includes a probe array including a slab having a plurality of probes, wherein each probe includes a volume of electrically-conductive fluid contained within a corresponding perforation of the slab that extends between a first surface and a second surface of the slab, wherein a first surface of each volume of electrically-conductive fluid substantially coincides with the first surface of the slab.

Methods and apparatus are described relating to a probe assembly having a probe head securing mechanism that includes a lock ring housing and a lock ring disposed in the lock ring housing. In an example, a probe assembly includes a rigid substrate, a circuit board coupled to the rigid substrate, and a probe head securing mechanism. The probe head securing mechanism includes a lock ring housing and a lock ring disposed within the lock ring housing. The circuit board has a surface. The lock ring housing is coupled to the rigid substrate. The circuit board is disposed between the lock ring housing and the rigid substrate. The lock ring is rotatable relative to the lock ring housing. Rotation of the lock ring is configured to move the lock ring in a direction perpendicular to the surface of the circuit board.