A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.

A test probe module is provided. The test probe module includes a circuit substrate, an interposer and a probe assembly. The interposer is coupled to the circuit substrate, and includes a plurality of through holes. The probe assembly is coupled to the interposer. The probe assembly includes a plurality of probes. A first terminal of each of the probes passes through a corresponding through hole and is electrically connected to the circuit substrate. A second terminal of each of the probes is in contact with a test object. The interposer has the same material properties as the test object.

A probe card device is provided. The probe card device includes a circuit substrate, an interposer, an adapter board and a probe assembly. The interposer is coupled to the circuit substrate, and the adapter board is coupled to the interposer. The probe assembly is coupled to the adapter board, and the probe assembly is electrically connected to the circuit substrate through the interposer and the adapter board. One terminal of each of the probes is electrically connected to the circuit substrate. Another terminal of each of the probes is in contact with a test object. The interposer, the adapter board and the test object have the same material properties.

An electrical connection device includes: a wiring board in which lands are arranged on a main surface; and probes. Each of the probes has a distal end portion that contacts an object to be measured and a proximal end portion that contacts the land. A material of a surface film of the proximal end portion, which contacts the land, is a metal material different in composition from a material of the land that contacts the surface film.

A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.

An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a first end (23a) and a second end (23b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).

An electrical connecting device includes an insulating probe (10) including a bottom-side plunger (11), a top-side plunger (12), and a barrel (13), and a probe head (30) including a combined guide plate (30A) having a conductive region (301) made of a conductive material and an insulating region (302) made of an insulating material arranged adjacent to each other in a planar view. The bottom-side plunger (11) and the top-side plunger (12) are electrically connected to each other inside the barrel (13), and the bottom-side plunger (11) and the top-side plunger (12) are electrically insulated from the barrel (13). The probe head (30) holds the insulating probe (10) in a state in which the barrel (13) penetrates through the conductive region (301). The barrel (13) of the insulating probe (10) is connected to a ground potential via the conductive region (301) when an inspection object (4) is measured.

A detection device includes: a metal body having a plurality of main vias, a plurality of main through holes with insulators formed on the hole walls of the main vias, and a plurality of connecting elements disposed in the main through holes. Therefore, when testing a chip with I/O pins of high density with the detection device, the connecting elements contact the insulator only, without contacting the hole walls of the main vias, and the problem of short circuits can be avoided. A method of forming a detection device is also provided.

A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.