The present application provides a testing apparatus. The testing apparatus includes a base; a first printed circuit board, disposed above the base; a stiffener, disposed adjacent to the base, located at a center of the base and passing through the first printed circuit board; a second printed circuit board, disposed at a center of the stiffener; and a probe card, one part thereof disposed adjacent to the stiffener and the other part thereof passing through the base, the first printed circuit board, the stiffener and the second printed circuit board. The base, the stiffener and the second printed circuit board are integrated and the base carries the first circuit board.

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

A semiconductor manufacturing method includes forming a first redistribution structure with a fine redistribution circuitry over a first temporary carrier; forming testing tips on a first surface of the fine redistribution circuitry; transferring the testing tips and the first redistribution structure to a second temporary carrier provided with a temporary adhesive layer, where the testing tips are embedded in the temporary adhesive layer with the second temporary carrier disposed on the temporary adhesive layer; releasing the first temporary carrier to expose a second surface of the fine redistribution circuitry; coupling a second redistribution structure with a coarse redistribution circuitry to the first redistribution structure through conductive joints, where the conductive joints are formed on the second surface of the fine redistribution circuitry; and releasing the second temporary carrier and the temporary adhesive layer from the testing tips and the first redistribution structure after coupling the second redistribution structure.

Structures and methods for directly testing a semiconductor wafer having micro-solder connections. According to one embodiment, a method forms a pattern of micro-solder connections coupled with a through substrate via (TSV) that can be directly tested by electrical probing, without the use of a testing interposer. According to another embodiment, a method tests the pattern of micro-solder connections. According to another embodiment, a novel electrical probe tip structure has contacts on the same pitch as the pattern of micro-solder connections.

The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

A probe card test apparatus including an insulating substrate; a conductive pattern on the insulating substrate; and a plurality of device under test (DUT) units on the conductive pattern, wherein each of the DUT units includes a merged-probe opening, a probe opening, and a detector in parallel, and an isolator surrounding the merged-probe opening, the probe opening, and the detector.

A probe card assembly includes a circuit board, a substrate, and at least one passive component. The substrate is disposed opposite and connected to the circuit board. The circuit board has a first opening facing the substrate and/or the substrate has a second opening facing the circuit board. The at least one passive component is disposed between the circuit board and the substrate and is at least partially accommodated in at least one of the first opening and the second opening.

The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.