This disclosure relates generally to test equipment, apparatuses, and systems for a device under test, such as, but not limited to, a semiconductor device. More specifically, this disclosure relates to test equipment, apparatuses, and systems that are portable for use in atypical testing environments.

A probe card in an automated test equipment (ATE) and methods for operating the same for testing electronic devices. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins. The probe card has a pad geometry that compensates for misalignment with corresponding probe pins due to manufacturing error or a mismatch of coefficient of thermal expansion, enabling reliable operation of the ATE over a wide range of test temperatures. The pad array may have a plurality of elongated pads, each of uniquely designed size, tilt angle, and/or center location, with the characteristics of each pad being dependent on a distance between each pad and a centroid of the pad array, such that a probe pin to pad location errors can be mitigated.

A probe head for a test equipment of electronic devices comprises a plurality of contact probes inserted in guide holes provided in at least one upper guide and one lower guide, a bending area for the contact probes being defined between the upper and lower guides, each contact probe having at least one first terminal portion which protrudes of a first length from the lower guide and ends with a contact tip (22A) adapted to abut onto a respective contact pad of a device to be tested, as well as a second terminal portion which protrudes of a second length from the upper guide and ends with a contact head adapted to abut onto a contact pad of a board for connecting or interfacing with the test equipment, suitably comprising at least one protection structure projecting from the upper guide in direction of a longitudinal development axis of the contact probes towards the board, the protection structure thus extending in correspondence of the contact heads of the contact probes.

A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

A circuit board includes an insulating substrate including a wiring conductor and a first resin substrate that is made of a resin different from the insulating substrate and is laminated on the insulating substrate. The first resin substrate has a plurality of internal conductors located from a surface thereof facing the insulating substrate to a surface on a side opposite to the insulating substrate. Each of the plurality of internal conductors includes a part that is inclined with respect to a perpendicular to the surface facing the insulating substrate. Intervals at which the plurality of internal conductors are located on the side opposite to the insulating substrate are narrower than intervals at which the plurality of internal conductors are located on an insulating substrate side.

The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface. The space transformer is arranged on the second surface corresponding to the through hole and has a probe setting surface opposite to the second surface. The first coaxial cable has a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface.

A probe card in an automated test equipment (ATE) is disclosed. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins, with vertical vias in the circuit board interconnecting various conductive elements. Disclosed herein is a transposed via arrangement within a circuit board for a probe card, where adjacent vias are offset towards each other such that the inductance between the adjacent vias may be reduced to provide a desirable impedance during high frequency signal and/or power transmission.

A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

An inspection jig includes contact terminals and a pitch conversion unit electrically connected to the contact terminals and configured to convert a first pitch between adjacent two of the contact terminals into a second pitch different from the first pitch. The contact terminals each include a tubular body that extends in an axial direction of the contact terminal and is electrically conductive, and a conductor that is electrically conductive and has a stick shape. The tubular body includes a spring portion that has a helical shape along a peripheral surface of the tubular body. The conductor includes an uninserted portion that protrudes from the tubular body toward a first side in the axial direction, and an inserted portion that is disposed in the tubular body and is fixed to a first axial end portion of the tubular body. The pitch conversion unit includes a board portion and a protruding portion.

A board-like connector, a dual-ring bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-ring bridges spaced apart from each other and an insulating layer. Each of the dual-ring bridges includes two carrying rings, two cantilevers respectively extending from and being coplanar with the two carrying rings, two abutting columns respectively extending from the two cantilevers along two opposite directions, and a bridging segment that connects the two carrying rings. The insulating layer connects the two carrying rings of the dual-ring bridges, and the two abutting columns of the dual-ring bridges respectively protrude from two opposite sides of the insulating layer. The two abutting columns of each of the dual-ring bridges are configured to be respectively abutted against two boards.