A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.

An example apparatus includes a connection module. The example connection module includes a connection interface and a connection matrix having a root transmission line to conduct signals to and from the connection interface. The connection matrix also includes branch transmission lines that are connectable electrically to the root transmission line to conduct the signals to and from the root transmission line. Each of the branch transmission lines is part of an electrical pathway between a device and the root transmission line. A housing encloses the connection matrix and enables access to the connection interface. The root transmission line and the branch transmission lines are each multi-conductor transmission lines that conduct the signals in transverse electromagnetic (TEM) mode.

Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.

A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages, and determine if one or more of the plurality of monitored current values exceeds one or more of a plurality of current thresholds.

A circuit board for testing and a method of operating the same are provided. A relay is installed on a body of a circuit board having a probe. At least one external conductive line is arranged between the probe and the relay. During high-frequency signal testing, a transmission route is to transmit high-frequency signals to a test machine by means of the external conductive line, but is not to transmit high-frequency signals to a test machine by means of the relay. Accordingly, the limitation of the bandwidth condition of the relay can be avoided.

A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, and monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages. The plurality of monitored current values are stored.

A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.

Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.

An apparatus is provided that is implemented to enable multiple tests of different types, such as a direct current (DC) test and/or a radio frequency (RF) test of a semiconductor device. The apparatus includes a microelectromechanical systems (MEMS) switch block coupled between the semiconductor device and automatic testing equipment (ATE). The apparatus is configured to enable/disable a DC path or an RF path to switch between a DC test and an RF test without reconfiguring the connections between the semiconductor device and the ATE. The DC path is used to perform a DC contact test for one or more pins of the semiconductor device. The RF path is used to perform an RF test for the semiconductor device.

A safety system for a needle probe card for test machines for high-voltage and high-current testing of power semiconductor electronic devices is provided. The needle probe card has a plurality of needles adapted to be placed in contact with a device under test (DUT), each needle being configured to allow a flow of electric current. The safety system has a control unit capable of determining the electric current flowing in every single needle, and a plurality of switching devices configured to selectively interrupt the electric current flowing in the needles. At least one switching device is associated with each needle of the needle probe card. The control unit is configured to drive every single switching device to selectively interrupt the flow of electric current in a corresponding needle.