A Scan test in a single-wire bus circuit is described in the present disclosure. The single-wire bus circuit has only one external pin for connecting to a single-wire bus. Given that multiple physical pins are required to carry out the Scan test, the single-wire bus circuit must provide additional pins required by the Scan test. In embodiments disclosed herein, the single-wire bus circuit includes a communication circuit under test, and a driver circuit coupled to the communication circuit via multiple internal pins. The driver circuit uses a subset of the internal pins as input pins and another subset of the internal pins as output pins to carry out the Scan test in the communication circuit. As a result, it is possible to perform the Scan test without adding additional external pins to the single-wire bus circuit, thus helping to reduce complexity and footprint of the single-wire bus circuit.

A stack type semiconductor apparatus may be provided. The stack type semiconductor apparatus may include a plurality of semiconductor chips stacked and configured for transferring signals through through-hole vias. Each of the plurality of stacked semiconductor chips may include an error detection circuit configured to perform a down scan for transferring a signal to a lower direction and an up scan for transferring a signal to an upper direction through through-hole vias in a column direction among the through-hole vias, and to determine whether the through-hole vias have failed according to a down scan result value and an up scan result value.

A method includes executing a test against a first structure and a second structure of a built-in self-test circuit. Each of the first and second structures include a plurality of latches arranged as a plurality of stump chains. The method also includes unloading a first result of the test from the plurality of stump chains of the first structure and a second result of the test from the plurality of stump chains of the second structure. The method further includes determining that the plurality of stump chains of the first structure includes a faulty latch based on the first result not matching the second result.

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

Provided are scan device and method of diagnosing scan chain fault. The scan device for diagnosing a fault includes a scan partition including a plurality of scan chains which include path control scan flipflops connected to scan flipflops in cascade. In the scan partition, connection paths of the scan flipflops are controllable. The connection paths of the path control scan flipflops are controlled to detect a position of a fault such that a fault range in the scan partition is reduced to diagnose the fault.

In one example, an integrated circuit comprises a die. The die has a first surface and a second surface, the second surface opposite to the first surface. The die also includes: a first contact on the first surface and a second contact on the second surface; a through silicon via having a first end and a second end, the first end coupled to the first contact and the second end coupled to the second contact; and a scan cell having a control input, a response input, and a stimulus output, the response input coupled to the first end and the stimulus output coupled to the second end.

A method includes executing a test against a first structure and a second structure of a built-in self-test circuit. Each of the first and second structures include a plurality of latches arranged as a plurality of stump chains. The method also includes unloading a first result of the test from the plurality of stump chains of the first structure and a second result of the test from the plurality of stump chains of the second structure. The method further includes determining that the plurality of stump chains of the first structure includes a faulty latch based on the first result not matching the second result.

Techniques are disclosed for software development on utility devices. In an example, a utility device, responsive to validating a manufacturer signature, transitions to an isolated development mode. When in the isolated development mode, the utility device is restricted from joining a network and receives an application from a development computing system. The utility device validates a network signature and transitions to a network testing mode. When in the network testing mode, the utility device joins the network, registers with a head end system via the network, and executes the application. After a threshold amount of time has lapsed the utility device transitions to the isolated development mode.

Techniques are disclosed for software development on utility devices. In an example, a utility device, responsive to validating a manufacturer signature, transitions to an isolated development mode. When in the isolated development mode, the utility device is restricted from joining a network and receives an application from a development computing system. The utility device validates a network signature and transitions to a network testing mode. When in the network testing mode, the utility device joins the network, registers with a head end system via the network, and executes the application. After a threshold amount of time has lapsed the utility device transitions to the isolated development mode.