A design-for-test (DFT) architecture for testing a three dimensional (3D) integrated circuit, may comprise a two dimensional (2D) silicon layer n1 and a 2D silicon layer n connected together with a through silicon via (TSV) having a first side and a second side; scannable latch circuits on said first side and said second side of said TSV, wherein said scannable latch circuits: control flow of data between said layer n1 and said layer n and allow said TSV to be verified; allow launch and capture clocks to be applied with variable delay in order to perform an alternating current delay fault test between said layer n1 and said layer n; and have a quiescent state supply current (IDDq) test function built in which allows selection of an input load for a unidirectional signal connection between said layer n1 and said layer n.

Aspects include techniques for implementing a clock path technique for using on-chip circuitry to generate a correct encode pattern to test the on-chip circuitry for encoding and correction of a chip. A computer-implemented method may include initializing a scan of the chip including data and a set of check bits protecting the data; applying a global control bit to a latch on the chip; and applying an additional clock to the latch so the check bits are updated using the on-chip circuitry.

In one example a controller comprises logic, at least partially including hardware logic, configured to implement a first iteration of an interference test on a communication interconnect comprising a victim lane and a first aggressor lane by generating a first set of pseudo-random patterns on the victim lane and the aggressor lane using a first seed and implement a second iteration of an interference test by advancing the seed on the first aggressor lane. Other examples may be described.

A method for determining current return path integrity in an electric device with a plurality of signal lines and supply lines. A library with at least one reference signal pattern of a near end crosstalk signal on a defined signal line arising from an input signal on another defined signal line is provided, a predetermined signal to a selected signal line of the electric device is applied, the near end crosstalk signal on at least one further signal line of the electric device is detected, said near end crosstalk signal is compared with the corresponding reference signal pattern from the library, and if there is a deviation between the near end crosstalk signal and the corresponding reference signal pattern, an information that there is any defect in the electric device is displayed.

A network equipment test device provides a user interface for user specification of a test traffic source, a test traffic destination, SUT and waypoint topology and one or more test cases. In response to receiving the specified input from the user via the interface, the test traffic source is automatically configured to send the test traffic to the destination via the SUT. The waypoint is automatically configured to measure the test traffic. When the test is initiated, test traffic is sent from the test traffic source to the test traffic destination via the SUT and the at least one waypoint. Test traffic is measured at the waypoint, and traffic measurement results are displayed on a visual map of SUT topology.

A design-for-test (DFT) architecture for testing a three dimensional (3D) integrated circuit, may comprise a two dimensional (2D) silicon layer n1 and a 2D silicon layer n connected together with a through silicon via (TSV) having a first side and a second side; scannable latch circuits on said first side and said second side of said TSV, wherein said scannable latch circuits: control flow of data between said layer n1 and said layer n and allow said TSV to be verified; allow launch and capture clocks to be applied with variable delay in order to perform an alternating current delay fault test between said layer n1 and said layer n; and have a quiescent state supply current (IDDq) test function built in which allows selection of an input load for a unidirectional signal connection between said layer n1 and said layer n.

A scan flip-flop circuit includes first and second I/O nodes, a flip-flop circuit, a selection circuit configured to receive a scan direction signal and including input terminals coupled to the first and second I/O nodes and an output terminal coupled to an input terminal of the flip-flop circuit, and first and second drivers configured to receive the scan direction signal and a scan enable signal, each including an input terminal coupled to an output terminal of the flip-flop circuit and an output terminal coupled to a respective first or second input terminal of the selection circuit. Responsive to the scan direction and scan enable signals, one of the first driver is configured to output a first signal responsive to a second signal received at the second input terminal or the second driver is configured to output a third signal responsive to a fourth signal received at the first input terminal.

An eye-diagram index analytic method includes: calculating a transfer function of multiple coupled lines; converting the transfer function into a pulse response; calculating an eye-diagram index according to the pulse response; and correcting the eye-diagram index according to peak distortion analysis.

A method for determining current return path integrity in an electric device with a plurality of signal lines and supply lines. A library with at least one reference signal pattern of a near end crosstalk signal on a defined signal line arising from an input signal on another defined signal line is provided, a predetermined signal to a selected signal line of the electric device is applied, the near end crosstalk signal on at least one further signal line of the electric device is detected, said near end crosstalk signal is compared with the corresponding reference signal pattern from the library, and if there is a deviation between the near end crosstalk signal and the corresponding reference signal pattern, an information that there is any defect in the electric device is displayed.

The present disclosure describes systems and methods for forming scan chains. The system includes a memory and a processor communicatively coupled to the memory. The processor receives a circuit design that includes a plurality of scan cells. The plurality of scan cells includes a first scan cell and a first set of scan cells coupled logically to the first scan cell. The processor forms the plurality of scan cells into a first scan chain such that the first set of scan cells are placed outside an extended neighborhood of the first scan cell. The extended neighborhood of the first scan cell includes (i) scan cells that are downstream of the first scan cell in the first scan chain and (ii) a scan cell that is adjacent to and upstream of the first scan cell in the first scan chain.