Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

An implementation of a system disclosed herein includes a decompressor logic with the capability to vary a level of decompression of a scanning input signal based on value of compression program bits and a compressor logic to generate a scanning output signal, the compressor logic including a plurality of XOR logics, wherein the output of the plurality of XOR logics is selected based on the compression program bits.

A system is provided that includes a memory configured to store test patterns. A first lockstep core and a second lockstep core are configured to receive the same set of test patterns. First scan outputs are generated from the first lockstep core, and second scan outputs are generated from the second lockstep core during a reset of the first lockstep core and the second lockstep core. A comparator can be coupled to the first lockstep core and the second lockstep core and is configured to compare the first scan outputs to the second scan outputs. The first and second lockstep cores can be initialized to a similar state if the first and second scan outputs are the same. The first and second lockstep cores can comprise non-resettable flip flops.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

A system is provided that includes a memory configured to store test patterns. A first lockstep core and a second lockstep core are configured to receive the same set of test patterns. First scan outputs are generated from the first lockstep core, and second scan outputs are generated from the second lockstep core during a reset of the first lockstep core and the second lockstep core. A comparator can be coupled to the first lockstep core and the second lockstep core and is configured to compare the first scan outputs to the second scan outputs. The first and second lockstep cores can be initialized to a similar state if the first and second scan outputs are the same. The first and second lockstep cores can comprise non-resettable flip flops.

A circuit comprises a plurality of scan chains configured to perform scan shifting in two opposite directions and a register configured to store a first signal. The first signal determines whether the plurality of scan chains operate in a first mode or a second mode. The plurality of scan chains operating in the first mode is configured to perform, based on a second signal, either scan shifting in a first direction in the two opposite directions or scan capturing during a test; the plurality of scan chains operating in the second mode is configured to perform, based on the second signal, scan shifting in the first direction or a second direction in the two opposite directions.

A system is provided that includes a memory configured to store test patterns. A first lockstep core and a second lockstep core are configured to receive the same set of test patterns. First scan outputs are generated from the first lockstep core, and second scan outputs are generated from the second lockstep core during a reset of the first lockstep core and the second lockstep core. A comparator can be coupled to the first lockstep core and the second lockstep core and is configured to compare the first scan outputs to the second scan outputs. The first and second lockstep cores can be initialized to a similar state if the first and second scan outputs are the same. The first and second lockstep cores can comprise non-resettable flip flops.

An implementation of a system disclosed herein includes a decompressor logic with the capability to vary a level of decompression of a scanning input signal based on value of compression program bits and a compressor logic to generate a scanning output signal, the compressor logic including a plurality of XOR logics, wherein the output of the plurality of XOR logics is selected based on the compression program bits.

Monolithic three-dimensional integration can achieve higher device density compared to 3D integration using through-silicon vias. A test solution for M3D integrated circuits (ICs) is based on dedicated test layers inserted between functional layers. A structure includes a first functional layer having first functional components of the IC with first test scan chains and a second functional layer having second functional components of the IC with second test scan chains. A dedicated test layer is located between the first functional layer and the second functional layer. The test layer includes an interface register controlling signals from a testing module to one of the first test scan chains and the second test scan chains, and an instruction register connected to the interface register. The instruction register processes testing instructions from the testing module. Inter-layer vias connect the first functional components, the second functional components, and the testing module through the test layer.

The invention relates to a microchip with a multiplicity of reconfigurable test structures, wherein the microchip has a test input (TDI) and a test output (TDO), wherein the multiplicity of test structures can be connected to the test input (TDI) and the test output (TDO), wherein one intermediate memory is provided for each of the multiplicity of test structures, wherein each of the multiplicity of test structures can be tested separately and concurrently with the aid of the respective intermediate memory and a corresponding individual control.