An optical coupling system includes a substrate, an electronic die comprising a plurality of coupling holes for passing light, an optical element die attached to a bottom surface of the electronic die, the electronic die attached to the substrate such that the electronic die covers a cavity in the substrate and the optical element die resides within the cavity of the substrate. The system may also include a thermally conductive lid that covers and contacts the electronic die and the substrate and has a coupling aperture that enables light that passes through the coupling holes to pass through the thermally conductive lid. The system may also include an optical cable coupler comprising a coupling section that laterally fits within the coupling aperture and a body section disposed above the coupling section that is laterally larger than the coupling section. A method for providing the above system is also disclosed herein.

An optical coupling system includes a substrate, an electronic die comprising a plurality of coupling holes for passing light, an optical element die attached to a bottom surface of the electronic die, the electronic die attached to the substrate such that the electronic die covers a cavity in the substrate and the optical element die resides within the cavity of the substrate. The system may also include a thermally conductive lid that covers and contacts the electronic die and the substrate and has a coupling aperture that enables light that passes through the coupling holes to pass through the thermally conductive lid. The system may also include an optical cable coupler comprising a coupling section that laterally fits within the coupling aperture and a body section disposed above the coupling section that is laterally larger than the coupling section. A method for providing the above system is also disclosed herein.

Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed and may comprise in an integrated circuit comprising a driver: amplifying a received signal in a plurality of partial voltage domains, and generating the partial voltage domains by controlling a voltage domain boundary value between two partial voltage domains utilizing a differential amplifier that samples an output voltage of a cascade amplifier that is an input to the driver and controls a current supplying said cascade amplifier. A series of diodes may be driven in differential mode via the amplified signals. An optical signal may be modulated via the diodes, which may be integrated in a Mach-Zehnder modulator or a ring modulator. The diodes may be connected in a distributed configuration. The amplified signals may be communicated to the diodes via transmission lines, which may be even-mode coupled.

Methods and systems for split voltage domain receiver circuits are disclosed and may include amplifying complementary received signals in a plurality of partial voltage domains. The signals may be combined into a single differential signal in a single voltage domain. Each of the partial voltage domains may be offset by a DC voltage from the other partial voltage domains. The sum of the partial domains may be equal to a supply voltage of the integrated circuit. The complementary signals may be received from a photodiode. The amplified received signals may be amplified via stacked common source amplifiers, common emitter amplifiers, or stacked inverters. The amplified received signals may be DC coupled prior to combining. The complementary received signals may be amplified and combined via cascode amplifiers. The voltage domains may be stacked, and may be controlled via feedback loops. The photodetector may be integrated in the integrated circuit.

A semiconductor package includes a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

A fiber alignment or fiberposer device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Provided is a mounting component for an optical fiber that allows a laser device and an optical fiber to be aligned with higher precision while providing protection for the laser device mounted on a substrate. The a mounting component is a component formed from silicon for optically coupling a laser device to an optical fiber by being bonded to a mounting substrate on which the laser device is mounted, and includes a groove portion for fixedly holding the optical fiber so that a core of the optical fiber is positioned at a predetermined depth with respect to a bonding surface to be bonded to the mounting substrate, and a recessed portion, formed continuous with the groove portion, for accommodating the laser device, wherein a thickness of the mounting component, measured in a direction perpendicular to the bonding surface, is chosen so that a position of the laser device can be detected using an infrared transmission image when the laser device is accommodated in the recessed portion by placing the bonding surface in contact with the mounting substrate.

A light-emitting device includes a board holding an end of a connection terminal and on which an electronic component is mounted, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover mounted in the support member. The cover includes a main cover body that is of a plate shape and covers the light-emitting element, and first engaging portions that are convex and formed on the main cover body. A light guide passes therethrough light emitted from the light-emitting element and is disposed on the main cover body. The support member includes a chamber that is defined therein and accommodates the board and the main cover body, second engaging portions that are formed therein and engage with the first engaging portions, and the first engaging portions are provided near the light guide.

A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.

An optical system can include a optical receiver comprising an optical waveguide, an optical lid adjacent the waveguide, and a reflective surface proximate an output of the optical waveguide to direct light from the waveguide towards an output of the optical lid. The optical system can also include a photodetector (PD) die comprising a substrate, a concave mirror, and a photodetector. The concave mirror is formed on a first side of the substrate and the photodetector is disposed on a second side of the substrate, the first side opposite the second side, wherein the photodetector is disposed on the second side of the PD die offset from the optical axis of the optical element.