An electronic device may have a housing with a display. The display may be overlapped by an image transport layer such as a coherent fiber bundle or layer of Anderson localization material. The image transport layer may have an input surface that receives an image from the display and a corresponding output surface to which the image is transported. The input surface and output surface may have different shapes. During fabrication of the image transport layer, molding techniques, grinding and polishing techniques, and other processes are used to deform the image transport layer and the shape of the output surface. The area of peripheral portions of the output surface may expand relative to central portions. Optical uniformity across the output surface can be enhanced by maintaining uniformity in fiber core diameters and other attributes of the image transport layer across deformed and undeformed portions of the output surface.

A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.

The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.

A method of bonding a focusing lens with a fiber array is disclosed. A core end facet of a first optical fiber disposed on the fiber array is recognized by a camera. A projection of the core end facet of the first optical fiber on a bonding surface of the fiber array is specified by a processing unit to obtain a core end facet information. An alignment procedure is performed by a pickup component according to the core end facet information to make an optical axis of the focusing lens overlap with the projection of the core end facet of the first optical fiber. The focusing lens is attached to the bonding surface of the fiber array.

An optical transducer for endoscope includes an optical device, a ferrule including an opaque first holding member including a first principal surface, a second principal surface, and a through-hole, and a transparent second holding member including a third principal surface and a fourth principal surface, the third principal surface of the second holding member abutting on the second principal surface, the optical device being bonded to the fourth principal surface, the third principal surface including a recess including an opening and having a bottom, the recess having the bottom communicating with the through-hole, and an optical fiber provided in the recess through the through-hole.

An optical device includes: a base having first and second ends in first and second directions, respectively, and extends in the first direction; an optical module having a head adjacent to the base and is positioned close to the second end and a neck protruding from the head and is thinner than the head; a substrate attached on the base arranged with the head; and a pressing member having a first fixing portion fixed to the base, a second fixing portion fixed to the base, a first extension portion extending from the first fixing portion, a second extension portion extending from the second fixing portion, and a pressing portion provided in at least one of the first and the second extension portions and presses the head against the base.

An optical module includes a circuit board, an optical emission chip array, an optical receiver chip array, an optical fiber array, and a lens assembly. The lens assembly includes a body with a step provided at a bottom portion thereof, an emission lenses array, an optical fiber lenses array, and a receiving lenses array. The emission lenses array and the receiving lenses array are respectively arranged on two step surfaces of the step, such that focal points thereof respectively fall on an emission surface of the optical emission chip array and a light sensitive surface of the optical receiver chip array. A first groove for forming a first reflective surface and a second groove for arranging a light filter that refracts light towards the optical fiber lenses array or reflects light to the receiving lenses array are provided at a top portion of the body.

A light-emitting device includes a board, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover having a plate shaped main cover body covering the light-emitting element and a tubular portion which receives a light guide body that guides light emitted from the light-emitting element. The main cover body includes a base, a protrusion protruding from the base toward the board, and a ridge disposed on a protruded end of the protrusion. A step is formed by the protrusion and the ridge, and the protrusion and the ridge extend in a same direction along the base.

A light-emitting device includes a board, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover having a plate shaped main cover body covering the light-emitting element and a tubular portion which receives a light guide body that guides light emitted from the light-emitting element. The main cover body includes a base, a protrusion protruding from the base toward the board, and a ridge disposed on a protruded end of the protrusion. A step is formed by the protrusion and the ridge, and the protrusion and the ridge extend in a same direction along the base.