The invention concerns a lighting module for a motor vehicle including a bearing plate, a light source arranged on the bearing plate, a driver module for the light source arranged on the bearing plate, a light guide designed to cooperate with the light source, a reception casing for the light guide that is rigidly connected to the bearing plate including a first opening that is designed to receive the light guide, at least one aperture that is designed to receive an anchoring tab of a locking part, the locking part including a main body, at least one anchoring tab projecting from the main body that is designed to lock the light guide in the reception casing.

Methods and systems for split voltage domain receiver circuits are disclosed and may include amplifying complementary received signals in a plurality of partial voltage domains. The signals may be combined into a single differential signal in a single voltage domain. Each of the partial voltage domains may be offset by a DC voltage from the other partial voltage domains. The sum of the partial domains may be equal to a supply voltage of the integrated circuit. The complementary signals may be received from a photodiode. The amplified received signals may be amplified via stacked common source amplifiers, common emitter amplifiers, or stacked inverters. The amplified received signals may be DC coupled prior to combining. The complementary received signals may be amplified and combined via cascode amplifiers. The voltage domains may be stacked, and may be controlled via feedback loops. The photodetector may be integrated in the integrated circuit.

A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

A fiber alignment or fiberposer device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

A light-emitting device includes a board holding an end of a connection terminal and on which an electronic component is mounted, a light-emitting element mounted on a surface of the board, a support member on which the board is placed, and a cover mounted in the support member. The cover includes a main cover body that is of a plate shape and covers the light-emitting element, and first engaging portions that are convex and formed on the main cover body. A light guide passes therethrough light emitted from the light-emitting element and is disposed on the main cover body. The support member includes a chamber that is defined therein and accommodates the board and the main cover body, second engaging portions that are formed therein and engage with the first engaging portions, and the first engaging portions are provided near the light guide.

Provided is a mounting component for an optical fiber that allows a laser device and an optical fiber to be aligned with higher precision while providing protection for the laser device mounted on a substrate. The a mounting component is a component formed from silicon for optically coupling a laser device to an optical fiber by being bonded to a mounting substrate on which the laser device is mounted, and includes a groove portion for fixedly holding the optical fiber so that a core of the optical fiber is positioned at a predetermined depth with respect to a bonding surface to be bonded to the mounting substrate, and a recessed portion, formed continuous with the groove portion, for accommodating the laser device, wherein a thickness of the mounting component, measured in a direction perpendicular to the bonding surface, is chosen so that a position of the laser device can be detected using an infrared transmission image when the laser device is accommodated in the recessed portion by placing the bonding surface in contact with the mounting substrate.

A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

A surface emitting element including a semiconductor substrate and a casing. The substrate includes an optical element having a photoelectric conversion function. First and second terminal electrodes are disposed on the substrate. The casing has a depression for accommodating the substrate. Moreover, first and second connection electrodes are formed in the casing. The first and second terminal electrodes are formed so as to protrude from the side surfaces of the substrate. The first and second connection electrodes are formed so as to protrude toward the depression side in the casing. The first terminal electrode and the first connection electrode are in contact with each other, and the second terminal electrode and the second connection electrode are in contact with each other.

An optical module includes optical transmission member, optical element, substrate, electrode pad between the optical element and external circuit, and optical block including optical transmission member mounting portion. The optical transmission member mounting portion is formed on the optical block in optical axis direction such that optical transmission efficiency is the maximum. A manufacturing method of the optical module includes mounting and electrically connecting the optical element on one face of the substrate, calculating a position on a 2-dimensional plane of optical input/output point of the optical element, forming base material of the optical block to impregnate the optical element onto the substrate, forming the optical transmission member mounting portion at the position on the 3-dimensional plane of the optical input/output point calculated in the former step on the base material, and mounting the optical transmission member on the optical transmission member mounting portion.

A semiconductor package including: a chip including a pad; an optical device including a pad; a mold configured to encapsulate the optical device and the chip; a wiring pattern configured to electrically connect the optical device and the chip; and an external connection terminal configured to electrically connect the semiconductor package to the outside. The chip includes at least one of: an amplifier circuit configured to process an electrical signal supplied from the optical device; and a driver circuit configured to supply the electrical signal to the optical device.