Patent classifications
G02B6/4243
Optical transmission and receiving device for implementing passive alignment of components and method for passively aligning components
An optical device for implementing passive alignment of parts and a method therefor, more particularly an optical device and a method therefor that utilize an alignment reference part arranged on the substrate to passively align an optical element part with a lens-optical fiber connection part. For the passive alignment of parts, connection pillars of an alignment reference part are coupled to substrate holes, one or more light-emitting elements and one or more light-receiving elements are aligned in a row in a particular interval with respect to alignment holes arranged opposite each other in the alignment reference part, a lens-optical fiber connection part is aligned with respect to the alignment holes, and an optical fiber is aligned with the optical alignment point at a surface of a prism forming a portion of the lens-optical fiber connection part.
Reconfigurable pluggable transceiver
A pluggable transceiver is provided that may receive an electrical signal from a host device, convert the optical signal into an optical signal, and transmit the converted optical signal to one or more external cables. In one aspect, a pluggable transceiver may include a first transceiver connector for connecting to a host device, an optical module for converting an electrical signal to an optical signal and vice versa, and a second transceiver connector for transmitting the optical signal to external cables or devices.
OPTICAL MEMBER AND METHOD FOR PRODUCING SAME
The present invention is directed to an optical member including: a first layer that includes a first region having a refractive index n.sub.1 and a second region having a refractive index n.sub.3; and a second layer disposed on a first main surface of the first layer so as to be in contact with the first region and the second region, the second layer having a refractive index n.sub.2. The first layer includes a plurality of said second regions adjoining the first region along a planar direction of the first layer; the plurality of second regions constitute a geometric pattern; and n.sub.1 to n.sub.3 satisfy the relationship n1<n3<n2. When an optical member according to the present invention is integrated with a lightguide in use, excellent light extraction function is exhibited and leakage of light due to light scattering is suppressed, while attaining good mechanical strength at the same time.
Interposer
A silicon interposer. The silicon interposer including: a silicon layer, including one or more optical waveguides each connectable to an optical fiber; an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber; and one or more electrical interconnects, connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.
PHOTONIC INTEGRATED CIRCUIT AND OPTO-ELECTRONIC SYSTEM COMPRISING THE SAME
A photonic integrated circuit including an InP-based substrate that is provided with a first InP-based optical waveguide and a neighboring second InP-based optical waveguide, a dielectric planarization layer that is arranged at least between the first optical waveguide and the second optical waveguide. At least between the first optical waveguide and the neighboring second optical waveguide, the dielectric planarization layer is provided with a recess that is arranged to reduce or prevent optical interaction between the first optical waveguide and the second optical waveguide via the dielectric planarization layer. At the location of the recess, the dielectric planarization layer has a first sidewall that is arranged sloped towards the first optical waveguide, and a second sidewall that is arranged sloped towards the second optical waveguide. An opto-electronic system including said PIC.
BARRIER STRUCTURE WITH PASSAGE FOR WAVEGUIDE IN PHOTONIC INTEGRATED CIRCUIT
Embodiments of the disclosure provide a photonic integrated circuit (PIC) structure with a passage for a waveguide through a barrier structure. The PIC structure includes a barrier structure on a substrate, having a first sidewall and a second sidewall opposite the first sidewall. A passage is within the barrier structure, and extends from a first end at the first sidewall of the barrier structure to a second end at the second sidewall of the barrier structure. A shape of the passage includes a reversal segment between the first end and the second end. A waveguide within the passage and extends from the first end to the second end of the barrier structure.
OPTICAL DEVICE, OPTICAL PROCESSING DEVICE, AND METHOD OF PRODUCING THE OPTICAL DEVICE
An optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has a first to a third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along a first axis intersecting the first end surface. The third end surface is oblique with respect to the first axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers extend in the supporting block and is exposed to the third end surface. The reflecting plate is provided on the third end surface via the intermediate layer. Light from the optical fiber passes through the third end surface which has some roughness, and is reflected by a surface of the reflecting plate.
Optical transceiver and manufacturing method thereof
A structure including a photonic integrated circuit die, an electric integrated circuit die, a semiconductor dam, and an insulating encapsulant is provided. The photonic integrated circuit die includes an optical input/output portion and a groove located in proximity of the optical input/output portion, wherein the groove is adapted for lateral insertion of at least one optical fiber. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The semiconductor dam is disposed over the photonic integrated circuit die. The insulating encapsulant is disposed over the photonic integrated circuit die and laterally encapsulates the electric integrated circuit die and the semiconductor dam.
Optical module for optical fibers and method of manufacturing the same
An optical module is disclosed, which includes a substrate and an optical fiber bench attached to the substrate. The optical module also includes one or more optical fibers, each having an end placed on the optical bench. One or more optical devices are attached to the optical bench and in optical communication with the one or more fibers, respectively. An optical fiber alignment block is attached to the optical fiber bench with the one or more optical fibers therebetween. The optical fiber alignment block includes a reflecting surface that deflects an optical path between the one or more optical fibers and the one or more optical devices.
Optical module and method of manufacturing the same
There is provided an optical module, which includes a substrate; one or more optical devices disposed on the substrate; an integrated circuit (IC) device disposed on the substrate for driving the one or more optical devices; one or more optical fibers in optical communications with the one or more optical devices, respectively; an optical bench that attaches to the substrate and concentrates a direction of the light transmitted between the one or more optical devices and the one or more optical fibers; and a cover that attaches to the optical bench with the one or more optical fibers fixed therebetween. The optical bench changes a direction of the concentrated light.