An interposer for coupling an optical conduit to an optical component, said interposer comprising: (a) an optical component; (b) a first lens component having a first lens; (c) a second lens component having a second lens, said first and second lenses being configured to define an expanded-beam coupling therebetween; (d) at least one reflective surface optically coupled with said second lens; (e) a first optical path at least partially defined between said optical component and said first lens to accommodate a diverging light beam from said optical component to said first lens; (f) a second optical path at least partially defined between said second lens and said at least one reflective surface to accommodate a converging light beam from said second lens and said at least one reflective surface; and (g) a separable interface along said second optical path or at said expanded-beam coupling.

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

A system for stabilizing optical parameters of a fiber Bragg grating (FBG) includes a mechanical mount, a heating element coupled to the mechanical mount, and a base plate coupled to the heating element. The base plate comprises a longitudinal groove. The system also includes a fiber anchor coupled to the mechanical mount and a fiber including the FBG mechanically attached to the fiber anchor. The FBG of the fiber is disposed in the longitudinal groove.

Provided is an optical element module comprising: a mold body having a first surface formed on an upper portion thereof and a second surface formed on a lower portion thereof; an external connection terminal formed on the first surface and electrically connected to the outside; an optical engine embedded and sealed between the first surface and the second surface and having a connection pad exposed to the second surface; a conductive vertical via formed to penetrate the first surface and the second surface and having one end portion electrically connected to the external connection terminal; a wiring layer formed on the second surface to interconnect the other end of the conductive vertical via and the connection pad of the optical engine; and a reflective surface integrally formed on the wiring layer and transmits an optical signal generated by the optical engine or received by the optical engine.

Embodiments disclosed herein include electronic packages with photonics modules. In an embodiment, a photonics module comprises a carrier substrate and a photonics die over the carrier substrate. In an embodiment, the photonics die has a first surface facing away from the carrier substrate and a second surface facing the carrier substrate, and a plurality of V-grooves are disposed on the first surface proximate to an edge of the photonics die. In an embodiment, the photonics module further comprises a fiber connector attached to the photonics die, where the fiber connector couples a plurality of optical fibers to the photonics die. In an embodiment, individual ones of the plurality of optical fibers are positioned in the V-grooves.

A manufacturing method for an image pickup apparatus for endoscope includes forming a plurality of insertion holes in a first wafer and forming, in a second wafer, a plurality of through-holes including guide surfaces, bonding the first wafer and the second wafer to produce a bonded wafer, cutting the bonded wafer to thereby produce ferrules to which guide members are bonded, and mounting an optical element on each of the ferrules and fixing optical fibers with resin in a state in which the optical fibers are inserted into the insertion holes by passing through the guide members.

An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.

An optical transducer for endoscope includes an optical element, an optical fiber, and a ferrule, the ferrule including a semiconductor substrate and a glass substrate, in which: the semiconductor substrate has an insertion hole penetrating therethrough; an optical fiber is inserted into the insertion hole; the semiconductor substrate has a trench connected with the insertion hole and having an opening in a side surface; the trench has a convex on a bottom surface; and when a distal end surface of the optical fiber is observed from an opening of side surface of the tech, at least a part of the distal end surface is shielded by the convex.

Manufacturing a semiconductor chip package with optical fiber attach capability includes preparing a photonic integrated circuit by etching a v-groove in a front side fiber coupling region; assembling the photonic integrated circuit on an organic redistribution layer; etching the organic redistribution layer; and attaching an optical fiber to the front side fiber coupling region.

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate