A light-emitting structure, a backlight module, a display module, and a display device are provided. The light-emitting structure includes a circuit substrate, including a first surface and a second surface sequentially arranged along a light-exiting direction of the light-emitting structure. The circuit substrate also includes a light-transparent substrate and a wiring structure located on a side of the light-transparent substrate in a thickness direction. The light-emitting structure also includes a plurality of light-emitting elements, arranged in an array on one of the first surface or the second surface of the circuit substrate. The plurality of the light-emitting elements is electrically connected to the wiring structure. The light-emitting structure also includes a heat sink, located on a side of the first surface of the circuit substrate. The heat sink is configured for dissipating heat generated by the plurality of the light-emitting elements.

A backlight module and a manufacturing method thereof are disclosed. The backlight module includes a frame, a thin-film thermoelectric device set, a first heat conductive layer, a light emitting diode (LED) light, a bulk thermoelectric device set, and a second heat conductive layer. The manufacturing method for backlight module includes a device preparing step, a thin-film thermoelectric device set mounting step, a first heat conductive layer preparing step, an LED light mounting step, a bulk thermoelectric device set mounting step, and a bulk thermoelectric device set mounting step. The technical effect of the invention is to realize the heat dissipation and the recovery and utilization function of the waste heat.

The present invention relates to a display apparatus that does not include a middle mold and a rear chassis, and is capable of supporting an internal configuration of a display apparatus such as a display panel and a light guide plate with only a front chassis and a rear cover. It is possible to effectively dissipate heat by including a separate heat sink. In addition, heat generated from the electrical component substrate can be dissipated through the plate coupled to the electrical component substrate, the electromagnetic wave can be shielded, and the heat sink and the plate can be connected to improve the heat dissipation and electromagnetic wave shielding efficiency.

A backplate having a folding region and an unfolding region adjacent to the folding region includes: first and second material layers corresponding to the folding and unfolding regions; and a third material layer between the first and second material layers, the third material layer is more rigid than the first and second materials layers, wherein the first and second material layers extend from the folding region to the unfolding regions such that a thickness of the first and second material layers is gradually reduced from the folding region to the unfolding region.

A backlight (100) for an image forming device (70) includes spaced-apart front and back optical reflectors (20, 10) defining an optical cavity (18) therebetween, and at least one light source (15) for emitting light into the optical cavity. The front optical reflector (20) is disposed between the image forming device and the back optical reflector (10). For substantially normally incident light and for non-overlapping first (e.g. visible light) and second (e.g. infrared) wavelength ranges, the front optical reflector (20) may transmit (80c) at least 70% of light (80a) for each wavelength in the first wavelength range, and may reflect (90b) at least 70% of light (90a) for each wavelength in the second wavelength range. The back optical reflector (10) may reflect (80b) at least 70% of light for each wavelength in the first wavelength range, and may transmit (90c) at least 70% of light (90b) for each wavelength in the second wavelength range. The light (80a, 90a) emitted by the at least one light source (15) has at least one wavelength in the first wavelength range and at least one wavelength in the second wavelength range.

Exemplary embodiments provide an electronic display assembly. One or more heat-generating components are preferably placed in thermal communication with a plate. One or more fans are placed to draw cooling air along the plate to remove the heat removed from the component. Some embodiments may place the plate behind the electronic image assembly, so that cooling air can remove heat from the plate as well as the electronic image assembly. Exemplary embodiments have power modules in thermal communication with optional conductive ribs. Conductive thermal communication is established between the optional ribs and the components in the exemplary embodiments.

A component for dissipating heat of a device, a backlight module, and a display panel are disclosed. The component for dissipating heat of the device includes a first elastic body and a heat dissipation apparatus, and a first temperature threshold is set. The component for dissipating heat of the device dissipates heat of the device and ensures heat insulation of the device by a physical method, and does not include a sensor or a logic circuit. Therefore, it has low cost and eco-friendly applications, and does not consume electrical power.

An ultrathin LCD module and a liquid crystal display are provided. The ultrathin LCD module has a printed circuit board, a liquid crystal panel connected with the printed circuit board through at least one flexible circuit board, and an array light source of light emitting diodes disposed between the printed circuit board and the liquid crystal panel, which has a plurality of light emitting diodes and a substrate to carry the light emitting diodes. A projection of the flexible circuit board projected on the substrate is not overlapped with the light emitting diodes.

A display device is provided, which includes a light emitter including an LED array; a current detector configured to detect current that flows through the LED array; a driving circuit configured to provide constant current to the LED array; and a cable including a first line configured to provide the constant current that is provided from the driving circuit to the light emitter, and a second line configured to connect a node, to which the current detector and the driving circuit are commonly connected, and the driving circuit to each other.

The present application discloses a liquid crystal display device and a backlight module thereof. The backlight module comprises a backboard, a separating plate, and a light source component; wherein the backboard has a base plate and a plurality of side plates, and the backboard is an injection molding board; the separating plate is mounted in an accommodating groove, a heat dissipation chamber is formed between the separating plate and the base plate, in the heat dissipation chamber, the backboard is provided with convection holes; the light source component comprises a plurality of lamp substrates and a plurality of LED lamps mounted on the lamp substrates, the lamp substrates are located within the heat dissipation chamber, and the separating plate is provided with transparent holes enabling light emitted by each of the LED lamps to penetrate the separating plate in a thickness direction of the separating plate.