Voltage-to-current converters that include two current mirrors are disclosed. In an example voltage-to-current converter each current mirror is a complementary current mirror in that one of its input and output transistors is a P-type transistor and the other one is an N-type transistor. Such voltage-to-current converters may be implemented using bipolar technology, CMOS technology, or a combination of bipolar and CMOS technologies, and may be made sufficiently compact and accurate while operating at sufficiently low voltages and consuming limited power.

An example current mirror arrangement includes a current mirror circuit, configured to receive an input current signal at an input transistor Q1 and output a mirrored signal at an output transistor Q2. The arrangement further includes a buffer amplifier circuit, having an input coupled to Q1 and an output coupled to Q2. The offset of the buffer amplifier circuit can be adjusted by including circuitry for an input or an output side offset adjustment or by implementing the buffer amplifier circuit as a diamond stage with individually controlled current sources for each of the transistors of the diamond stage. Providing an adjustable offset buffer in a current mirror arrangement may advantageously allow benefiting from the use of a buffer outside of a feedback loop of a current mirror, while being able to reduce the buffer offset due to mismatch between master and slave sides of the current mirror circuit.

An integrated circuit device having insulated gate field effect transistors (IGFETs) having a plurality of horizontally disposed channels that can be vertically aligned above a substrate with each channel being surrounded by a gate structure has been disclosed. The integrated circuit device may include a temperature sensor circuit and core circuitry. The temperature senor circuit may include at least one portion formed in a region other than the region that the IGFETs are formed as well as at least another portion formed in the region that the IGFETs having a plurality of horizontally disposed channels that can be vertically aligned above a substrate with each channel being surrounded by a gate structure are formed. By forming a portion of the temperature sensor circuit in regions below the IGFETs, an older process technology may be used and device size may be decreased and cost may be reduced.

A bandgap reference circuit includes first through fourth bipolar junction transistors (BJTs). The base and collector of the first BJT are shorted together. The second BJT is coupled to the first BJT via a first resistor. The base of the third BJT is coupled to the base of the first BJT. The base and collector of the fourth BJT are coupled together and also are coupled to the base of the second BJT. A second resistor is coupled to the fourth emitter of the fourth BJT. A third resistor is coupled to the second resistor and to the emitter of the second BJT. An operational amplifier has a first input coupled to the first resistor and the collector of the second BJT, a second input coupled to the emitter of the third BJT and the collector of the fourth BJT, and an output coupled to the collectors of the first and third BJTs.

An example current mirror arrangement includes a current mirror circuit, configured to receive an input current signal at an input transistor Q1 and output a mirrored signal at an output transistor Q2. The arrangement further includes a semi-cascoding circuit that includes transistors Q3, Q4, and a two-terminal passive network. The transistor Q3 is coupled to, and forms a cascode with, the output transistor Q2. The transistor Q4 is coupled to the transistor Q3. The base/gate of the transistor Q3 is coupled to a bias voltage Vref, and the base/gate of the transistor Q4 is coupled to a bias voltage Vref1 via the two-terminal passive network. Nonlinearity of the output current from such a current mirror arrangement may be reduced by selecting appropriate impedance of the two-terminal passive network and selecting appropriate bias voltages Vref and Vref1.

Disclosed is a bandgap reference circuit, which includes a first current generator that generates a first current proportional to a temperature, a second current generator that outputs a second current obtained by mirroring the first current to a first node at which a reference voltage is formed, a first resistor that is connected with the first node and is supplied with the second current, and a first bipolar junction transistor (BJT) that includes an emitter node connected with the first resistor, a base node supplied with a first power, and a collector node supplied with a second power different from the first power.

An integrated circuit device having insulated gate field effect transistors (IGFETs) having a plurality of horizontally disposed channels that can be vertically aligned above a substrate with each channel being surrounded by a gate structure has been disclosed. The integrated circuit device may include a temperature sensor circuit and core circuitry. The temperature senor circuit may include at least one portion formed in a region other than the region that the IGFETs are formed as well as at least another portion formed in the region that the IGFETs having a plurality of horizontally disposed channels that can be vertically aligned above a substrate with each channel being surrounded by a gate structure are formed. By forming a portion of the temperature sensor circuit in regions below the IGFETs, an older process technology may be used and device size may be decreased and cost may be reduced.

A bandgap voltage reference core circuit includes: a generating circuit, a first voltage dividing circuit and a second voltage dividing circuit. The generating circuit is configured to generate a positive temperature coefficient voltage and a negative temperature coefficient voltage, and obtain a positive temperature coefficient current and a negative temperature coefficient current based on the positive temperature coefficient voltage and the negative temperature coefficient voltage. The first voltage dividing circuit is connected to the generating circuit and the second voltage dividing circuit respectively, and is configured to generate an initial current based on the positive temperature coefficient current and the negative temperature coefficient current. The second voltage dividing circuit is configured to determine a reference voltage based on the initial current. The first voltage dividing circuit and the second voltage dividing circuit affect a voltage dividing proportion of the reference voltage.

A bandgap reference circuit includes an amplifier, a first transistor, a second transistor, a third transistor, a first resistor, and a second resistor. The amplifier is configured to generate a bandgap voltage. The first transistor is coupled to the amplifier, and passes a first PTAT current. The second transistor is coupled to the amplifier, and passes a second PTAT current. The first resistor is coupled to the amplifier and the second transistor, and passes the second PTAT current to the second transistor. The third transistor is coupled to the amplifier, and passes a third PTAT current that bypasses the first resistor and the second transistor. The second resistor is coupled to the first transistor, the second transistor, and the third transistor, and passes the first PTAT current, the second PTAT current, and the third PTAT current.

Voltage-to-current converters that include two current mirrors are disclosed. In an example voltage-to-current converter each current mirror is a complementary current mirror in that one of its input and output transistors is a P-type transistor and the other one is an N-type transistor. Such voltage-to-current converters may be implemented using bipolar technology, CMOS technology, or a combination of bipolar and CMOS technologies, and may be made sufficiently compact and accurate while operating at sufficiently low voltages and consuming limited power.