An RFID module includes a laminated body including thermoplastic resin layers, a passive element defined by a conductor pattern on the thermoplastic resin layers, and an RFID IC chip embedded in the laminated body. The RFID IC chip and the conductor pattern are connected to each other by joining an input and output terminal of the RFID IC chip and a pad electrode, and an insulator pattern overlapping the pad electrode is provided around the RFID IC chip in the laminated body in planar view.

A method for producing a foil which serves as a carrier of at least one electronic device and at least one contactless and/or contact-type interface, involves using a transparent foil as a foil and electrical conducting paths on the foil are printed by means of a transparent, electrically conductive material in order to electroconductively connect the electronic device with the interface. Further, the foil can be used for producing a portable data carrier.

The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).

A portable dual-interface data carrier contains a metal sheet which can be provided with low technical effort and especially no ferrite material is required. The resulting portable dual-interface data carrier is more heavy than a state of the art PVC smart card and provides contact based interface on one side, whereas contactless interfaces is working from both sides of the card. One application domain of the data carrier is to provide a so-called smartcard. The present invention is furthermore directed towards a dual-interface module as well as towards a method for providing a portable dual-interface data carrier. Moreover, a data carrier is suggested comprising instructions for performing the suggested method and for manufacturing the portable dual-interface data carrier.

A portable dual-interface data carrier contains a metal sheet which can be provided with low technical effort and especially no ferrite material is required. The resulting portable dual-interface data carrier is more heavy than a state of the art PVC smart card and provides contact based interface on one side, whereas contactless interfaces is working from both sides of the card. One application domain of the data carrier is to provide a so-called smartcard. The present invention is furthermore directed towards a dual-interface module as well as towards a method for providing a portable dual-interface data carrier. Moreover, a data carrier is suggested comprising instructions for performing the suggested method and for manufacturing the portable dual-interface data carrier.

A portable dual-interface data carrier contains a metal sheet which can be provided with low technical effort and especially no ferrite material is required. The resulting portable dual-interface data carrier is more heavy than a state of the art PVC smart card and provides contact based interface on one side, whereas contactless interfaces is working from both sides of the card. One application domain of the data carrier is to provide a so-called smartcard. The present invention is furthermore directed towards a dual-interface module as well as towards a method for providing a portable dual-interface data carrier. Moreover, a data carrier is suggested comprising instructions for performing the suggested method and for manufacturing the portable dual-interface data carrier.

Disclosed is an electronic document, a body of which includes an inlay, a part of which forms a spotface of a cavity, and which includes a connection land formed on the part forming the spotface, and a module of which includes an electrical circuit that includes both a first subcircuit configured to electrically connect a port of a chip to the connection land and a second subcircuit configured to electrically connect the connection land to an external electrical contact land of a carrier of the module.

Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.

The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.

A resin molded body with an RFIC package incorporated therein is insert-molded incorporating therein a metal core material and an RFIC element connected to the metal core material. The RFIC element includes a ceramic multi-layer substrate that incorporates therein a coil conductor, and an RFIC chip mounted on a mounting surface of the multi-layer substrate. The RFIC chip is connected to the coil conductor by nano-particle bonding or ultrasonic bonding. The coil conductor is coupled with the core material in a magnetic field coupling scheme.