A smart card with two read-write modes includes antenna layer, and an antenna and a chip module circuits on the antenna layer, wherein the antenna and the chip module circuit are electrically connected via an elastic conductive device. The invention also provides a manufacturing method of the aforesaid smart card with two read-write modes, which includes steps of: embedding an antenna on a back side or a front side of an antenna layer; after completing embedding on the antenna layer, add bedding sheets, printed sheets and protection films respectively above and underneath the antenna layer, then laminating to obtain a card base carrier; cutting card from the treated whole-sheet card base carrier to obtain a card base, and milling slots on the obtained card base, then finally encapsulating.

A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

The invention relates to a chip card manufacturing method. According to this method, there are produced on the one hand, a module including a substrate supporting contacts on one face, and bonding pads on the other, on the other hand, an antenna on a support. The ends of the antenna are linked to lands of connection lands receiving a drop of soldering material on a connection portion. In order to make the soldered electrical connection between the module and the antenna reliable, the bonding pads extend over a zone covering a surface area less than that of the connection portions. The invention relates also to a chip card whose module includes bonding pads extending over a zone covering a surface area less than that of the connection portions.

A security device includes a body and a contact interface including an external connection for external communication and an internal connection for internal communication. The body includes at least a first substrate and a second substrate lying in respective parallel planes. The contact interface is electrically connected to the first substrate and to the second substrate by the internal connection. The security device is a chip card, for example a bank card, or an identity document.

Embodiments are directed to assembling an RFID tag through wire bonding techniques. In some examples, the RFID tag may be assembled by wire bonding of an RFID integrated circuit (IC) to an antenna through a hole in a substrate. In other examples, methods for assembling RFID tags from a singulated IC or diced ICs still on a dicing frame may be disclosed. The disclosed methods may use a single metal layer for producing RFID tags with multi-turn loop antenna.

A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

The invention relates to a method for producing a module having an electronic chip including metallizations which are accessible from a first side of the metallizations and an integrated circuit chip which is arranged on the second side of the metallizations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallizations, directly connecting the chip, and are arranged on the second side of the metallizations. The invention also relates to a module corresponding to the method and to a device comprising said module.

Example implementations relating to a modular radio frequency identification (RFID) device are described. For example, the modular RFID device includes a modular circuit pad and a modular transmission pad coupled to the modular circuit pad. The modular circuit pad includes a processing circuit to process data and the processing circuit includes multiple circuit electrical contacts. Further, the modular transmission pad includes a transmission circuit to transmit the data. The transmission circuit includes multiple transmission electrical contacts detachably connected to the multiple circuit electric contacts.

The method of manufacturing a functional inlay, comprises at least the steps of: (1) providing a substrate with a wire antenna embedded therein and with an aperture wherein two wire antenna portions are positioned over said aperture; (2) acquiring the positions and the dimensions of said wire antenna portions and of said aperture; (3) determining if the acquired positions and dimensions meet predetermined tolerances; (4) if the acquired dimensions and positions meet said tolerances, then placing a chip in fie aperture so that said wire portions are positioned over connections pads of said chip and then bonding said wire portions to said connection pads.

Various embodiments of RFID switch devices are disclosed herein. Such RFID switch devices advantageously enable manual activation/deactivation of the RF module. The RFID switch device may include a RF module with an integrated circuit adapted to ohmically connect to a substantially coplanar conductive trace pattern, as well as booster antenna for extending the operational range of the RFID device. The operational range of the RFID switch device may be extended when a region of the booster antenna overlaps a region of the conductive trace pattern on the RF module via inductive or capacitive coupling. The RFID switch device may further include a visual indicator displaying a first color if the RFID switch device is in an active state and/or a second color if the RFID switch device is in an inactive state.