A biological sample storage container and a dual chip wireless identification tag thereof are provided. The dual chip wireless identification tag includes a substrate, an antenna structure, a first chip, and a second chip. The antenna structure is disposed on the substrate, and includes two radiation parts and two matching parts. The two matching parts are connected between the two radiation parts, the first chip is coupled to one of the matching parts, and the second chip is coupled to the other one of the matching parts.

RFID-enabled composite metal transaction cards may include a security layer comprising a hologram or diffraction grating on a metal layer having a slit. The metal layer may reside on a front or rear face, or as a core layer in the construction of the card. The security layer, with or without a carrier layer, may be hot stamped to the metal layer with a protective hard coating, to camouflage the existence of a discontinuity in the metal layer. The metal layer with slit or slits may be coated with a baked-on-ink to provide color and to partially fill the slit or slits. A metal foil, holofoil or a holographic metal film may be provided with a discontinuity in the form of a slit and may be a decorative foil mounted to a card body containing a metal layer with a slit.

Methods of RFID tag assembly include affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.

A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is configured to transmit and receive RFID signals. Further, the antenna and the interconnects of the circuitry are formed of a same metal, and fabricated using a same semiconductor process.

The present invention concerns an electronic device (318) including: at least one radio frequency identification tag (302), coated with a resin block (304); a cover (316) forming, with the resin block, at least one notch (320a, 320b); and at least one contacting element (314a, 314b), located at the surface of the resin block inside of the notch.

A transaction card for dual interface communication of a transaction includes a card body, a chip opening, a discontinuity, and a transponder chip. The card body includes a first metal layer having an outer peripheral edge, a first metal face, and a second metal face. The chip opening includes a first chip hole transversely extending from the first metal face toward the second metal face thereby defining a first metal edge surrounding a predetermined hole shape. The discontinuity extends from the outer peripheral edge to the first metal edge. The transponder chip module has a module antenna and is configured to be received within the chip opening. The module antenna defines an outer antenna edge surrounding a predetermined antenna shape such that the predetermined antenna shape is the same as the predetermined hole shape for improved inductive coupling via the discontinuity during use.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

Apparatus and method for producing contact, contactless and dual-interface metal transaction cards that provides enhanced durability and aesthetics, with increased production efficiency. The cards may include (i) a metal core subassembly comprising a metal layer or layers (metal inlay) having a slit (S) allowing for contactless functionality, and (ii) a UV hard coat on a release-carrier layer disposed on one or both sides of the metal core subassembly, and (iii) everything may be laminated together in a single step, providing a metal face smartcard. The hard coat provides a durable, scratch-resistant surface, and protects underlying layers while allowing the passage of a laser beam to write on or within the underlying layer(s), such as a transparent laser-reactive layer. Techniques for hiding or camouflaging the slit provide a more aesthetically pleasing appearance to the metal transaction card.

A modular RFID device includes a modular circuit pad, a modular transmission pad, and a device connection layer. The modular circuit pad includes a processing circuit to process data, the processing circuit having circuit electrical contacts. The modular transmission pad includes a transmission circuit to wirelessly transmit the data, the transmission circuit having transmission electrical contacts connected to the circuit electric contacts and over which the data is received from the modular circuit pad. The device connecting layer is between the modular circuit pad and the modular transmission pad and is separate from the transmission and circuit electrical contacts to attach the modular circuit pad with the modular transmission pad.

Embodiments are directed to assembling an RFID tag through wire bonding techniques. In some examples, the RFID tag may be assembled by wire bonding of an RFID integrated circuit (IC) to an antenna through a hole in a substrate. In other examples, methods for assembling RFID tags from a singulated IC or diced ICs still on a dicing frame may be disclosed. The disclosed methods may use a single metal layer for producing RFID tags with multi-turn loop antenna.