An electronic communications device includes a body of semiconductor material with an integrated electronic circuit, an inductive element, and a capacitive element. The capacitive element is formed by a first electrode and a second electrode positioned between the inductive element and the integrated electronic circuit. Tuning of the device circuitry is accomplished by energizing the inductive/capacitive elements, determining resonance frequency, and using a laser trimming operation to alter the structure of one or more of the first electrode, second electrode or inductive element and change the resonance frequency.

Disclosed is an electronic document, such as an integrated circuit card, that includes a body having a cavity that opens into one of the faces of the body and is defined by walls. The body also includes: an antenna having at least one turn extending between two ends that terminate in a wall of the cavity, a module including a microprocessor and at least two connection terminals dedicated to the antenna and electronically connected by electrical connections firstly to the microprocessor and secondly to the ends of the antenna. The ends of the antenna are arranged in zigzag shapes and each of them is made up of at least two rectilinear portions that are connected together by a bend and in which the rectilinear portion terminating in the cavity is at an angle of inclination relative to the wall at which it terminates.

A method for manufacturing a carrier tape housing a plurality of electronic components with seal materials includes forming housing holes in tape-shaped main body with first and second principal surfaces along a longitudinal direction of the tape-shaped main body, the housing holes penetrating from the first principal surface to the second principal surface, affixing an adhesive layer of a tape-shaped seal material to the second principal surface of the tape-shaped main body to cover the housing holes, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions, and providing chip-shaped electronic component into each of the housing holes of the tape-shaped main body and fixing the electronic component to the adhesive layer of the seal material exposed in each of the housing holes.

The invention discloses an active RFID device of 13.56 MHz, including a main body on which an SE chip an interface and an internal antenna are deployed, and an RF front-end chip The interface includes a power interface, an ISO/IEC7816 interface for operating the SE chip and an SPI interface for setting parameters for a register of the RF front-end chip. The RF front-end chip is coupled to a reader antenna via the internal antenna or an external antenna or a combination of the internal antenna and the external antenna. The device optimizes its contactless function and therefore meets more requirements from different scenarios.

The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.

A modulation circuit includes a load and a transistor serving as a switch. The transistor has an oxide semiconductor layer in which hydrogen concentration is 5×10.sup.19/cm.sup.3 or less. The off-state current of the transistor is 1×10.sup.−13 A or less. A modulation circuit includes a load, a transistor serving as a switch, and a diode. The load, the transistor, and the diode are connected in series between the terminals of an antenna. The transistor has an oxide semiconductor layer in which hydrogen concentration is 5×10.sup.19/cm.sup.3 or less. An off-state current of the transistor is 1×10.sup.−13 A or less. On/off of the transistor is controlled in accordance with a signal inputted to a gate of the transistor. The load is a resistor, a capacitor, or a combination of a resistor and a capacitor.

A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object is provided. The process includes at least the following steps: Using a single-sided film consisting of one or more contact regions and a dielectric comprising one or more apertures, Using a substrate comprising one or more electrically conductive regions intended for the contactless communication of the object, Securing said single-sided film and said substrate together, Positioning an integrated circuit and connecting it to the contact regions of the single-sided film and at least to one terminal of at least one of said electrically conductive regions, Depositing a protective layer incorporating at least said integrated circuit.

Also provided is a module obtained by means of the process.

RFID devices are provided with an antenna coupled to an RFID chip by a direct or indirect connection. A data-carrying pattern that is visible at one or more wavelengths is incorporated into and/or onto the antenna. The pattern may comprise a plurality of apertures defined in the antenna or a material applied onto the antenna and having a property or properties different from a property or properties of the material used to form the antenna at one or more wavelengths. The pattern may carry data that is optically readable at one wavelength and quasi-optically readable at another wavelength. The pattern may include at least one sensing material configured to cause the pattern to present different data depending on whether a condition is existent or not. The antenna may include a plurality of layers, each with patterns or portions of a pattern or patterns that are visible at different wavelengths.

A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.

A transaction card comprises a piezoelectric chip configured to detect an impact applied to at least a portion of the transaction card, and generate an electrical pulse signal based on the detected impact. A processing circuitry of the transaction card is coupled to the piezoelectric chip. The processing circuitry, upon powering on, is configured to enable data exchange between the transaction card and a terminal device for executing a card-based transaction at the terminal device. The data exchange is enabled only when a magnitude of the electrical pulse signal exceeds a threshold value, thereby preventing unwanted data transfer from the transaction card.