Method and apparatus for tuning a resonant circuit using a laser

Abstract

An electronic communications device includes a body of semiconductor material with an integrated electronic circuit, an inductive element, and a capacitive element. The capacitive element is formed by a first electrode and a second electrode positioned between the inductive element and the integrated electronic circuit. Tuning of the device circuitry is accomplished by energizing the inductive/capacitive elements, determining resonance frequency, and using a laser trimming operation to alter the structure of one or more of the first electrode, second electrode or inductive element and change the resonance frequency.

Claims

1. A system for tuning a resonant circuit comprised of an inductive circuit portion and a capacitive circuit portion of an integrated circuit communications device, comprising: a transparent substrate separate from the integrated circuit communications device; a test antenna supported by the transparent substrate; an automated test equipment circuit coupled to the test antenna and configured to apply a variable signal to said test antenna for communication to said resonant circuit of the separate integrated circuit communications device to identify a resonant frequency of said resonant circuit; and a trimming laser configured to emit a laser beam directed through said transparent substrate and towards said separate integrated circuit communications device to effectuate a trimming of a structure of at least one of the inductive circuit portion and the capacitive circuit portion for adjusting the resonant frequency of said resonant circuit.

2. The system of claim 1, wherein said test antenna is formed in a ring shape defining a central open region, and wherein said emitted laser beam passes through said central open region.

3. The system of claim 1, wherein said inductive circuit portion includes one or more stub structures, said trimming laser configured to use said laser beam to sever a selected one or more of the stub structures in adjusting the resonant frequency.

4. The system of claim 1, wherein said capacitive circuit portion includes one or more comb-fingered structures, said trimming laser configured to use said laser beam to sever a selected one or more of the comb-fingered structures in adjusting the resonant frequency.

5. The system of claim 1, wherein said automated test equipment circuit applies the variable signal while the trimming laser emits the laser beam to trim the structure of the inductive circuit portion or capacitive circuit portion to adjust the resonant frequency.

6. A system for tuning a resonant circuit comprised of an inductive circuit portion and a capacitive circuit portion, wherein the capacitive circuit portion comprises a first plate and a second plate that are coplanar with each other and connected to a circuit element and said inductive circuit portion, with no portion of the first plate disposed over any portion of the second plate, comprising: a transparent substrate; a test antenna supported by the transparent substrate; an automated test equipment circuit coupled to the test antenna and configured to apply a variable signal to said test antenna for communication to said resonant circuit to identify a resonant frequency of said resonant circuit; and a trimming laser configured to emit a laser beam through said transparent substrate to effectuate a trimming of a structure of at least one of the inductive circuit portion and the capacitive circuit portion for adjusting the resonant frequency.

7. The system of claim 6, wherein the inductive circuit portion comprises an antenna, and wherein the first and second plates are disposed between the circuit element and the antenna.

8. The system of claim 7, wherein the antenna is formed in a ring shape defining a central open region, and wherein said emitted laser beam passes through said central open region.

9. The system of claim 7, wherein an extent of the first and second plates equals or exceeds an extent of the antenna.

10. The system of claim 7, wherein the capacitive circuit portion comprises a third plate coplanar with antenna of the inductive circuit portion.

11. The system of claim 10, wherein the antenna is formed in a ring shape defining a central open region, and wherein said third plate is provided in said central open region.

12. The system of claim 11, said trimming laser configured to use said laser beam on a structure of the third plate in adjusting the resonant frequency.

13. A method, comprising: energizing a resonant circuit comprised of an inductive circuit portion and a capacitive circuit portion of an integrated circuit communications device; identifying a resonant frequency of said resonant circuit from said energizing; and emitting a laser beam to effectuate a trimming of a structure of at least one of the inductive circuit portion and the capacitive circuit portion for adjusting the resonant frequency; wherein energizing comprises applying a varying signal to a test antenna supported by a transparent substrate that is separate from the integrated circuit communications device but positioned in proximity to said resonant circuit.

14. The method of claim 13, wherein emitting comprises emitting the laser beam to pass through the transparent substrate supporting the test antenna.

15. The method of claim 14, wherein the test antenna is formed in a ring shape defining a central open region, and wherein emitting further comprises emitting the laser beam to pass through the central open region.

16. The method of claim 13, wherein applying a varying signal and emitting the laser beam occur at a same time.

17. The method of claim 13, wherein said inductive circuit portion includes one or more stub structures, and wherein emitting comprises using said laser beam to sever a selected one or more of the stub structures in adjusting the resonant frequency.

18. The method of claim 13, wherein said capacitive circuit portion includes one or more comb-fingered structures, and wherein emitting comprises using said laser beam to sever a selected one or more of the comb-fingered structures in adjusting the resonant frequency.

19. The system of claim 6, wherein said test antenna is formed in a ring shape defining a central open region, and wherein said emitted laser beam passes through said central open region.

20. The system of claim 6, wherein said inductive circuit portion includes one or more stub structures, said trimming laser configured to use said laser beam to sever a selected one or more of the stub structures in adjusting the resonant frequency.

21. The system of claim 6, wherein said capacitive circuit portion includes one or more comb-fingered structures, said trimming laser configured to use said laser beam to sever a selected one or more of the comb-fingered structures in adjusting the resonant frequency.

22. The system of claim 6, wherein said automated test equipment circuit applies the variable signal while the trimming laser emits the laser beam to trim the structure of the inductive circuit portion or capacitive circuit portion to adjust the resonant frequency.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) One or more embodiments are now described, purely by way of non-limiting example and with reference to the attached drawings, wherein:

(2) FIG. 1 shows a cross section of an electronic communications device of a known type;

(3) FIGS. 2a-2f show top plan views of examples of electromagnetic shields of a known type;

(4) FIG. 3 shows a perspective view of the electronic communications device shown in FIG. 1;

(5) FIGS. 4 and 8 show cross sections of embodiments of an electronic device;

(6) FIG. 5 shows a cross section of the embodiment shown in FIG. 4;

(7) FIG. 6 shows a top plan view with portions removed of an embodiment of an electronic device;

(8) FIGS. 7a and 7b show equivalent circuit diagrams of embodiments of an electronic device;

(9) FIGS. 9 and 10 show cross sections of the embodiment shown in FIG. 8;

(10) FIGS. 11 and 12 show cross sections of a different embodiment of an electronic device;

(11) FIGS. 13a and 13b show cross sections of a further embodiment of an electronic device;

(12) FIG. 13c shows an equivalent electrical circuit of the embodiment the cross sections of which are shown in FIGS. 13a and 13b;

(13) FIGS. 13d and 13e show cross sections of a further embodiment of an electronic device;

(14) FIG. 13f shows an equivalent electrical circuit of an embodiment of an electronic device;

(15) FIG. 14 is a perspective view of an embodiment of an electronic device and of an automatic measurement and calibration system;

(16) FIG. 15 is a perspective view with portions removed of a further embodiment of an electronic device; and

(17) FIG. 16 is a schematic illustration of a communications system comprising an embodiment of an electronic device.

DETAILED DESCRIPTION

(18) FIG. 4 shows an embodiment of an electronic communications device, which is designated by 30 and which will be referred to in what follows, for reasons of simplicity, as “communications device 30”.

(19) In detail, the communications device 30 comprises: a body of semiconductor material 32, which defines a first top surface 32a and comprises in turn a substrate of semiconductor material (not shown) possibly set on top of which are one or more epitaxial layers (not shown); a top region 34, which extends on the first top surface 32a and defines a second top surface 34a; an electromagnetic shield 36, which extends on the second top surface 34a; a dielectric layer 38 (for example, made of silicon oxide), which extends on the electromagnetic shield 36 and defines a third top surface 38a; a plurality of metal turns 40, which may be, for example, of a circular or polygonal shape, and which are coplanar and concentric, extend above and in contact with the dielectric layer 38, and form, as a whole, an antenna 42; and a possible protective layer 44, which extends on the dielectric layer 38, and extending within which are the aforementioned metal turns 40. Alternatively, the metal turns 40 of the antenna 42 may be formed within the dielectric layer 38, for example in contact with the top surface 38a (case not shown) in such a way that the protective layer 44 protects the antenna 42.

(20) In still greater detail, formed within the body of semiconductor material 32 is at least one electronic circuit. In addition, the top region 34 may comprise dielectric layers and conductive paths formed by metallizations and vias, these conductive paths being generally coupled to the body of semiconductor material 32 so as to enable connection of the electronic circuit with the antenna 42, as described hereinafter.

(21) In particular, set between the electronic circuit and the antenna 42 is hence the electromagnetic shield 36, which, in the embodiment illustrated, comprises a first electrode 50 and a second electrode 52, coplanar and comb-fingered to one another, hence not in ohmic contact, as shown in FIG. 5. In practice, the first and second electrodes 50, 52, and hence the electromagnetic shield 36 itself, form a capacitor C.

(22) Both the first electrode 50 and the second electrode 52 are coupled to the electronic circuit present in the body of semiconductor material 32, respectively, through at least one first metal connection 51 and a second metal connection 53, which extend in the top region 34 and may comprise dielectric layers and metallizations. In particular, both the first metal connection 51 and the second metal connection 53 may comprise pads 51a, 53a, in direct contact with the first electrode 50 and the second electrode 52, respectively.

(23) Furthermore, both the first electrode 50 and the second electrode 52 are coupled to the antenna 42 by means of a first metal via 54 and a second metal via 56, respectively, which extend through the dielectric layer 38. In particular, the first metal via 54 is in ohmic contact with the first electrode 50 and with a first point of contact 60 of the antenna 42, while the second metal via 56 is in ohmic contact with the second electrode 52 and a second point of contact 62 of the antenna 42, for example, at a maximum distance from the first point of contact 60, where this distance is measured along the metal turns 40 of the antenna 42 itself. In other words, in the example shown, the first and second points of contact 60, 62 coincide with the terminals of the antenna 42. In addition, the capacitor C is set in parallel with respect to the antenna 42.

(24) As shown in FIG. 6, the first and second electrodes 50, 52 may have shapes different from the ones previously shown. In particular, if we define a reference system x, y, z fixed with respect to the communications device 30, and with the electromagnetic shield 36 lying parallel to the plane xy, the first and second electrodes 50, 52 may have comb-fingered shapes comprising, respectively, first and second elongated portions 41a and 41b, parallel to one another and inclined, for example by forty-five degrees, with respect to the plane xz or yz. Further and yet other geometrical shapes are in any case possible for the first and second electrodes 50, 52.

(25) The capacitor C, and hence the first and second electrodes 50, 52, are coupled to the electronic circuit formed within the body of semiconductor material 32. As shown by way of example in FIG. 7a, this electronic circuit may comprise a number of sub-circuits, such as, for example, a transceiver circuit 70 and a converter circuit 72 of an AC/DC type. In this case, once again by way of example, the transceiver circuit 70 may be coupled to the first and second electrodes 50, 52, respectively, through the first and second metal connections 51, 53, as well as through the first and second pads 51a, 53a. Likewise, the converter circuit 72 may be coupled to the first and second electrodes 50, 52, respectively, through a third metal connection 74 and a fourth metal connection 76, which may comprise, respectively, a third pad 74a and a fourth pad 76a, in direct contact with the first and second electrodes 50, 52, respectively.

(26) Alternatively, as shown by way of example in FIG. 7b, the fourth metal connection 76 may share the second pad 53a with the second metal connection 53. In either case, it may be possible, for example prior to forming the antenna 42 and the capacitor C, to contact the first, second, third, and possibly fourth pads 51a, 53a, 74a, 76a, for example with the terminals of probes coupled to an automatic measurement system. By means of this automatic measurement system, it may hence be possible to test the electronic circuit easily; in particular, it may be possible to carry out independently the test on possible sub-circuits of the electronic circuit, such as, for example, the transceiver circuit 70 and the converter circuit 72.

(27) According to another embodiment, illustrated in FIGS. 8-10, one between the first and second electrodes 50, 52 of the capacitor C extends beyond the electromagnetic shield 36. In particular, in FIG. 8, the first electrode 50 is formed by a first portion 50a and a second portion 50b. As shown in FIG. 9, the first portion 50a is coplanar to the second electrode 52, from which it is ohmically uncoupled, and forms with the second electrode 52 the electromagnetic shield 36. Instead, as shown in FIG. 10, the second portion 50b may be set coplanar with respect to the antenna 42, and may be set, for example, within an internal portion 43 defined by the metal turns 40. For example, the second portion 50b may extend above the third top surface 38a, possibly within the protective layer 44.

(28) In greater detail, the first and second portions 50a, 50b are set in ohmic contact with one another in order to form the first electrode 50. The ohmic contact may be provided by coupling the first and second portions 50a, 50b by means of a third metal via 80, which extends through the dielectric layer 38.

(29) Purely by way of example, in the embodiment shown in FIGS. 8-10, the second electrode 52 has an elongated element 82, departing from which, in a direction orthogonal to the elongated element 82 itself, are a first plurality and a second plurality of horizontal elements, which are designated, respectively, by 84a and 84b and are in ohmic contact with the elongated element 82. The first and second horizontal elements 84a, 84b extend, respectively, on opposite sides with respect to the elongated element 82 and in such a way that each first horizontal element 84a is in ohmic contact with, and is specular to, a corresponding second horizontal element 84b, with respect to the elongated element 82. Between pairs of first contiguous horizontal elements 84a and pairs of second contiguous horizontal elements 84b, respective gaps are present.

(30) The first portion 50a of the first electrode 50 surrounds the second electrode 52 and has a complementary shape so as to be comb-fingered with the second electrode 52. In particular, the first portion comprises a metal path 86, for example of a rectangular shape (to a first approximation), which surrounds the second electrode 52 and departing from which are third horizontal elements 88, ohmically coupled to the metal path 86 and arranged within the gaps defined by the second electrode 52. The rectangular metal path 86 is open in order to prevent onset of parasitic currents in the turn that would be created if the rectangular metal path 86 were closed.

(31) As regards, instead, the second portion 50b of the first electrode 50, it may have, for example, a shape similar to that of the second electrode 52, except as regards the proportions. In particular, if we designate by 92, 94a and 94b, respectively, the elongated element and the first and second pluralities of horizontal elements of the second portion 50b, one between the horizontal elements 94a may present, at its own end not coupled to the elongated element 92, a radiusing portion 96, which departs from the end parallel to the elongated element 92 and contacts the third metal via 80.

(32) In practice, in this embodiment, the second portion 50b contacts the first portion 50a through the third metal via 80, and the first portion 50a contacts in turn the antenna 42 through the first metal via 54.

(33) Likewise possible are embodiments (not shown) in which both the first electrode 50 and the second electrode 52 of the capacitor C extend beyond the electromagnetic shield 36 and comprise respective portions coplanar to the antenna 42. These coplanar portions may be arranged within the internal portion 43 defined by the metal turns 40 and may moreover form a further comb-fingered capacitor.

(34) Likewise possible are embodiments of the type illustrated in FIGS. 11 and 12, in which the aforementioned third metal via 80 is not present. In particular, the second portion 50b is in direct contact with the antenna 42, i.e., without interposition of any metal via. In detail, the second portion 50b is in direct contact with the innermost metal turn of the antenna 42. In practice, in this embodiment, the second portion 50b is formed by a plurality of conductive elements 100, each of which is ohmically coupled to a corresponding point of the aforementioned innermost metal turn. Given that it is in ohmic contact with the antenna 42, and since the first metal via 54 is coupled, not only to the antenna 42, but also to the first portion 50a, the first and second portions 50a, 50b define once again the first electrode 50. Again, the first portion 50a has a shape such as to prevent formation of closed loops, inside which parasitic currents may flow.

(35) As shown in FIGS. 13a-13b, it is likewise possible for the electromagnetic shield 36 to comprise further electrodes, such as, for example, a third electrode 58. As shown in FIG. 13a, the first, second, and third electrodes 50, 52, 58 may be coplanar and form a comb-fingered structure, in which the third electrode 58 is ohmically uncoupled from the first and second electrodes 50, 52, and the first electrode 50 is surrounded at least in part by the second and third electrodes 52, 58.

(36) In this case, the first, second, and third electrodes 50, 52, 58 may be coupled, respectively, to a reference potential GND, to a first potential V1, and to a second potential V2. In addition, the third electrode 58 may be coupled to the antenna 42. In particular, the third electrode 58 may be ohmically coupled to the antenna 42 through a third-electrode via 55. In this embodiment, the first metal via 54 contacts (in addition to the first electrode 50) the antenna 42 in a point comprised, for example, between the points of the antenna 42 of contact, respectively, with the second metal via 56 and with the third-electrode via 55.

(37) As shown by way of example in FIG. 13b (where in this embodiment the first electrode 50 is without the second portion 50b), these points of the antenna 42 of contact, respectively, with the second metal via 56 and with the third-electrode via 55 may coincide with the terminals of the antenna 42 itself, and the point in which the first metal via 54 contacts the antenna 42 may be equidistant with respect to the terminals of the antenna 42, measuring the distances along the metal turns 40. In these conditions, the equivalent electrical circuit of the antenna 42 and of the electromagnetic shield 36 is the one shown in FIG. 13c. It is, however, also possible that, in this embodiment, the first metal via 54 is absent.

(38) In practice, the antenna 42 of the embodiments shown in FIGS. 13a, 13b is a differential antenna. Consequently, to optimize operation of the communications device 30, it may be possible to create the antenna 42 in such a way that it has a shape having a high degree of symmetry, as shown for example in FIG. 13e, moreover providing the first, second, and third electrodes 50, 52, 58 in such a way that the electromagnetic shield 36 will also have a high degree of symmetry. In particular, as shown in FIG. 13e, the antenna 42 may be formed on two metallization levels, which may be coupled by metal vias, and hence a portion (not shown) of the antenna 42 may possibly be coplanar with the electromagnetic shield 36, in particular as regards the cross-over points (also generally known as “under-pass points”), in which there occurs cross-over between two different metal turns of the antenna 42. With reference to the antenna 42 shown in FIG. 13e, it may be likewise possible to provide within the internal portion 43 defined by the metal turns 40, an additional electrode (not shown), for example having a shape that is the same as that of the aforementioned second portion 50b illustrated in FIG. 10, and to remove the first metal via 54. The additional electrode is set in a way coplanar with respect to the antenna 42 and may be coupled in a way in itself known to a point of contact of the antenna 42, the point of contact being set, for example, on the outermost metal turn 40 of the antenna 42, in such a way that the antenna 42 is still of a differential type. In this way, an electrical circuit of the type shown in FIG. 13f is obtained, i.e., provided, with respect to what is shown in FIG. 13c, with an additional capacitor Cx formed by the additional electrode and by the first electrode 50.

(39) An embodiment of the communications device 30 may be tested and calibrated in a convenient way. In particular, as is known, the connection between the capacitor C and the antenna 42 means that the communications device 30 may be optimized for transmitting at a certain resonant frequency, which depends upon the inductance L associated with the antenna 42 and upon the capacitance of the capacitor C, i.e., upon the shape and arrangement of the first and second electrodes 50, 52. The resonant frequency may be measured by means of automatic test equipment (ATE) 102 (FIG. 14) coupled to a transmitter card 104, which is provided with a support 105 and a respective test antenna 106 set on the support 105. Operatively, it may be possible to transmit through the test antenna 106a querying signal at a test frequency, and receive a corresponding signal of response from the communications device 30, for example once again by means of the test antenna 106. By repeating the procedure for different values of the test frequency, and detecting, for example, the amplitudes of the corresponding response signals, it is possible to determine the resonant frequency, equal to the value of the test frequency to which, for example, the response signal with maximum amplitude corresponds.

(40) As has been mentioned, it may be likewise possible to vary the resonant frequency of the communications device 30, as shown once again in FIG. 14, which illustrates an embodiment in which the second portion 50b of the first electrode 50 is coplanar to the antenna 42. In fact, it may be possible to focus a laser beam W, for example, by means of a lens 108, in such a way that it will cut the geometrical shape of the second portion 50b modifying the geometry (for example, disconnecting a portion), and hence modifying the geometry of the portion 50b of the first electrode 50, with consequent variation of the capacitance of the capacitor C. In this way, also the resonant frequency of the communications device 30 may be varied. In addition, the cutting operation may be performed simultaneously with the aforementioned operations aimed at determining the resonant frequency, for example using a transparent support 105 for the laser beam W, and focusing the laser beam W in such a way that it will traverse the transmitter board 104 before impinging upon the communications device 30. In this way, it may be possible to verify step by step the effect that operations of change of the shape of the second portion 50b have on the resonance frequency. Possibly, the support 105 may have an opening through which the laser beam W may pass.

(41) Purely by way of example, if we assume that the second portion 50b has the shape shown in FIG. 12, and hence is formed by the aforementioned plurality of conductive elements 100, it may be possible to uncouple ohmically one or more of these conductive elements 100 from the turns 40 of the antenna 42.

(42) In a way altogether similar, it may be possible to act on at least one element from among: the first and second portions 50a, 50b of the first electrode 50; the second electrode 52; the third electrode 58; and the additional capacitor Cx. For this purpose, it is expedient for these elements to be electromagnetically accessible to the laser beam W. Consequently, the dielectric layer 38 may be at least in part transparent for the laser beam W.

(43) In order to vary the resonance frequency of the communications device 30, it may likewise be possible to cause the laser beam W to impinge on the metal turns 40 of the antenna 42, so as to vary the inductance thereof.

(44) By way of example, FIG. 15 shows an embodiment, in which the outermost turn of the antenna 42, designated by 40 x, has a side 40 k, departing from which are, in a direction orthogonal to the side 40 k itself, a plurality of conductive segments (also known as “stubs”), each of which terminates coupled ohmically up to a corresponding additional via. By way of example, in FIG. 15 a first stub, a second stub, a third stub, a fourth stub, and a fifth stub 110a-110 e are shown, which depart from corresponding points of the turn 40 x, have increasing distances from the innermost point of the metal turns 40 (which is designated by V and coupled to which is, by way of example, the second metal via 56), and are, respectively, coupled to a first additional via, a second additional via, a third additional via, and a fourth additional via 112a-112 d, and the first metal via 54. As already described for the first metal via 54, also the first, second, third, and fourth additional vias 112a-112 d are ohmically coupled to the first electrode 50, as shown schematically in FIG. 15. In the case where the first electrode 50 is formed by the first and second portions 50a, 50b arranged in a non-coplanar way, the first, second, third, and fourth additional vias 112a-112 d contact the first portion 50a, which, as has been said, forms the electromagnetic shield 36.

(45) Given the communications device 30, it may be possible to vary the inductance of the antenna 42 by cutting, with the laser beam W, one or more of the stubs 110a-110d, starting from the stub 110a up to the stub 110d, i.e., by ohmically uncoupling one or more from among the first, second, third, and fourth additional vias 112a-112 d. For example, in the case where the first, second, third, fourth, and fifth stubs 110a-110 e are all coupled to the side 40k, the inductance L of the antenna 42 is proportional to the distance, measured along the metal turns 40, between the point V and the first additional metal via 112a. Instead, if the first metal stub 110a is uncoupled from the side 40k, the inductance L of the antenna 42 increases in so far as it is proportional to the distance, measured along the metal turns 40, between the point V and the second additional metal via 112b, and so forth.

(46) As illustrated in FIG. 16, an embodiment of the present electronic communications device may be integrated in a communications system 200 formed, not only by at least one single electronic communications device, here designated by 230, but also by an electronic subsystem 210 (for example, an RFID reader) coupled to a querying antenna 220, which may transmit and receive data to/from the antenna of the electronic communications device 230. A communications system of this sort may find wide use, for example, in the field of RFID applications or of so-called Smart Cards.

(47) Advantages that one or more embodiments of the above-described communications device affords emerge clearly from the foregoing discussion. In practice, it enables reduction of the encumbrance, integrating at least part of the capacitor coupled to the antenna in the electromagnetic shield, without impairing the capacity of the electromagnetic shield to protect the antenna and the integrated circuit underlying the electromagnetic shield itself by mutual interference.

(48) In addition, one or more embodiments of the present communications device may be calibrated easily, in particular as regards the resonant frequency of the antenna, without any need to resort to probes that ohmically contact the communications device, and hence preventing the risk of damage to the communications device.

(49) Finally, it is clear that modifications and variations may be made to the communications device described and illustrated herein.

(50) In the first place, the first and second electrodes 50, 52 may couple up to the antenna 42 in such a way that the capacitor C is coupled to the antenna 42 not in parallel, but in series.

(51) As regards, instead, the shapes of the first and second electrodes 50, 52 of the capacitor C, the shapes of possible other electrodes, and possibly the shapes of the first and second portions 50a, 50b of the first electrode 50, they may differ from what has been described and illustrated so far. In addition, one between the first and second electrodes 50, 52 may be coupled to ground.

(52) Again, the first and second electrodes 50, 52, as likewise the antenna 42, may be made either totally or in part of polysilicon or other conductive materials (for example metal), materials having ferromagnetic characteristics, such as for example nickel and corresponding alloys, or cobalt and corresponding alloys. For example, the first electrode 50 and/or the second electrode 52, as well as possible other electrodes, may be formed either totally or in part by a layer of conductive material coated with a layer of ferromagnetic material, or else again they may be made either totally or in part of polysilicon.

(53) In addition, instead of the first and second metal vias 54, 56, it may be possible to resort to vias of any conductive material, not necessarily metal.

(54) As regards, in particular, the antenna 42, it may have a shape different from the ones described. For example, it may comprise two or more ohmically uncoupled conductive elements. Again, it may lie in a number of planes. It is likewise evident that the antenna 42 may be used both for transmitting and for receiving signals.

(55) Finally, the antenna 42 and the electromagnetic shield 36 of one or more embodiments of the present communications device 30 may be provided, in a non-integrated form, on a support/substrate, such as, for example, a printed-circuit board, and be coupled, for example, through conductive bumps to an integrated electronic device set on the support/substrate.

(56) It may likewise be possible for the support/substrate to be coupled to an additional antenna (not shown), for example set specular to the antenna 42 with respect to the electromagnetic shield 36, and hence underneath the electromagnetic shield 36, to which the additional antenna is coupled in a way similar to what has been described as regards the antenna 42.

(57) From the foregoing it will be appreciated that, although specific embodiments have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the disclosure. Furthermore, where an alternative is disclosed for a particular embodiment, this alternative may also apply to other embodiments even if not specifically stated.