Patent classifications
G11C11/408
Write operation techniques for memory systems
Methods, systems, and devices for write operation techniques for memory systems are described. In some memory systems, write operations performed on target memory cells of the memory device may disturb logic states stored by one or more adjacent memory cells. Such disturbances may cause reductions in read margins when accessing one or more memory cells, or may cause a loss of data in one or more memory cells. The described techniques may reduce aspects of logic state degradation by supporting operational modes where a host device, a memory device, or both, refrains from writing information to a region of a memory array, or inhibits write commands associated with write operations on a region of a memory array.
HIGH CAPACITY MEMORY SYSTEM USING STANDARD CONTROLLER COMPONENT
The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.
DECODING ARCHITECTURE FOR MEMORY DEVICES
Methods, systems, and devices for a decoding architecture for memory devices are described. Word line plates of a memory array may each include a sheet of conductive material that includes a first portion extending in a first direction within a plane along with multiple fingers extending in a second direction within the plane. Two word line plates in a same plane may be activated via a shared electrode. Memory cells coupled with the two word line plates sharing the electrode, or a subset thereof, may represent a logical page for accessing memory cells. A memory cell may be accessed via a first voltage applied to a word line plate coupled with the memory cell and a second voltage applied to a pillar electrode coupled with the memory cell. Parallel or simultaneous access operations may be performed for two or more memory cells within a same page of memory cells.
MEMORY SUBWORD DRIVER CIRCUITS WITH COMMON TRANSISTORS AT WORD LINES
Memory subword driver circuits with common transistors are disclosed. In some examples, a subword driver block of a memory device includes a plurality of subword drivers each having an output configured to be coupled to a word line coupled to a plurality of memory cells. The outputs of a first subword driver and a second subword driver of the plurality of subword drivers are coupled to a common transistor and a common word driver line, where the first subword driver and the second subword driver are respectively coupled to a first main word line and a second main word line. In such configuration, the first and second subword drivers are coupled in cascade connection so that, responsive to an active first main word line and an inactive common word driver line, a non-active potential is provided to the first subword driver from the second subword driver via the common transistor.
MEMORY SUBWORD DRIVER CIRCUITS WITH COMMON TRANSISTORS AT WORD LINES
Memory subword driver circuits with common transistors are disclosed. In some examples, a subword driver block of a memory device includes a plurality of subword drivers each having an output configured to be coupled to a word line coupled to a plurality of memory cells. The outputs of a first subword driver and a second subword driver of the plurality of subword drivers are coupled to a common transistor and a common word driver line, where the first subword driver and the second subword driver are respectively coupled to a first main word line and a second main word line. In such configuration, the first and second subword drivers are coupled in cascade connection so that, responsive to an active first main word line and an inactive common word driver line, a non-active potential is provided to the first subword driver from the second subword driver via the common transistor.
Semiconductor device including transistors with different channel-formation materials
An object of one embodiment of the present invention is to propose a memory device in which a period in which data is held is ensured and memory capacity per unit area can be increased. In the memory device of one embodiment of the present invention, bit lines are divided into groups, and word lines are also divided into groups. The word lines assigned to one group are connected to the memory cell connected to the bit lines assigned to the one group. Further, the driving of each group of bit lines is controlled by a dedicated bit line driver circuit of a plurality of bit line driver circuits. In addition, cell arrays are formed on a driver circuit including the above plurality of bit line driver circuits and a word line driver circuit. The driver circuit and the cell arrays overlap each other.
High capacity memory system using standard controller component
The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.
Dual row-column major dram
A memory device includes an array of 2T1C DRAM cells and a memory controller. The DRAM cells are arranged as a plurality of rows and columns of DRAM cells. The memory controller is internal to the memory device and is coupled to the array of DRAM cells. The memory controller is capable of receiving commands input to the memory device and is responsive to the received commands to control row-major access and column-major access to the array of DRAM cells. In one embodiment, each transistor of a memory cell includes a terminal directly coupled to a storage node of the capacitor. In another embodiment, a first transistor of a memory cell includes a terminal directly coupled to a storage node of the capacitor, and a second transistor of the 2T1C memory cell includes a gate terminal directly coupled to the storage node of the capacitor.
Apparatuses, systems, and methods for analog accumulator for determining row access rate and target row address used for refresh operation
Embodiments of the disclosure are drawn to apparatuses, systems, and methods for analog row access rate determination. Accesses to different row addresses may be tracked by storing one or more received addresses in a slice of stack. Each slice includes an accumulator circuit which provides a voltage based on charge on a capacitor. When a row address is received, it may be compared to the row addresses stored in the stack, and if there is a match, the charge on the capacitor in the associated accumulator circuit is increased. Each slice may also include a voltage to time (VtoT) circuit which may be used to identify the highest of the voltages provided by the accumulator circuits. The row address stored in the slide with the highest voltage may be refreshed.
Apparatuses, systems, and methods for analog accumulator for determining row access rate and target row address used for refresh operation
Embodiments of the disclosure are drawn to apparatuses, systems, and methods for analog row access rate determination. Accesses to different row addresses may be tracked by storing one or more received addresses in a slice of stack. Each slice includes an accumulator circuit which provides a voltage based on charge on a capacitor. When a row address is received, it may be compared to the row addresses stored in the stack, and if there is a match, the charge on the capacitor in the associated accumulator circuit is increased. Each slice may also include a voltage to time (VtoT) circuit which may be used to identify the highest of the voltages provided by the accumulator circuits. The row address stored in the slide with the highest voltage may be refreshed.