A semiconductor memory device includes: a memory cell region including a plurality of cell mats in each of which a plurality of rows are disposed, each row coupled to normal cells and row-hammer cells; a repair control circuit suitable for generating a pairing flag denoting whether a cell mat in which an active row corresponding to an active address is disposed, is repaired with another cell mat; and a refresh control circuit suitable for: selecting, when an active command is inputted, a sampling address based on first and second data read from the row-hammer cells of the active row, refreshing, when a target refresh command is inputted, one or more adjacent rows to a target row corresponding to the sampling address, and selectively refreshing, when the target refresh command is inputted, one or more adjacent rows to a paired row of the target row according to the pairing flag.

Apparatuses and methods for generating multiple row hammer address refresh sequences. An example apparatus may include an address scrambler and a refresh control circuit. The address scrambler may receive a first address, output a second address in response to a first control signal, and output a third address in response to a second control signal. The second address may physically adjacent to the first address and the third address may physically adjacent to the second address. The refresh control circuit may perform a refresh operation on the second address when the first control signal is active and perform the refresh operation on the third address when the second control signal is active.

Disclosed herein is an apparatus that includes a plurality of memory sections each including a plurality of word lines, a predecoder circuit configured to generate predecoded section address signals to select one of the plurality of memory sections and predecoded word line address signals to select one of the word lines included in a selected one of the plurality of memory sections based on a row address, and a section address control circuit configured to retain the predecoded section address signals regardless of an update of the row address in a test operation mode.

The invention discloses a dynamic random access memory (DRAM) device and a method of fabricating such DRAM device. The DRAM device according to the invention includes a plurality of bit lines formed on a semiconductor substrate, a plurality of first isolation stripes, a plurality of second isolation stripes, a plurality of transistors formed between the first isolation stripes and the second isolation stripes, a plurality of word lines, and a plurality of capacitors formed above the first isolation stripes and the second isolation stripes. The semiconductor substrate defines a longitudinal direction, a transverse direction, a normal direction, a plurality of columns in the longitudinal direction, and a plurality of rows in the transverse direction. The first isolation stripes and the second isolation stripes extend in the longitudinal direction. Each transistor corresponds to one of the columns and one of the rows. The transistors on one side of each first isolation stripe and the transistors on the other side of said one first isolation stripe are staggeredly arranged. Each word line corresponds to one of the columns and connects the gate conductors of the transistors along the corresponding column. Each capacitor corresponds to one of the transistors and connects the source region of the corresponding transistor.

A memory device is provided. The memory device includes a plurality of memory chips that are stacked, wherein each of the memory chips includes a memory cell array, which includes a plurality of memory cell rows, a chip identifier generator configured to generate a chip identifier signal indicating a chip identifier of each of the memory chips, a refresh counter configured to generate a target row address for refreshing the memory cell rows in response to a refresh command, and a target row address generator, which receives the chip identifier signal and the target row address and outputs one of the target row address and an inverted target row address, obtained by inverting the target row address, as a refresh row address based on the chip identifier signal, and performs a refresh operation on a memory cell row corresponding to the refresh row address.

An example apparatus may perform concurrent threshold voltage compensation in a memory array with distributed row redundancy. The example apparatus may include a row decoder configured to configured to, in response to a determination that the prime row address matches a defective prime row address, concurrently initiate a threshold voltage compensation operation on both of a prime row of the respective plurality of prime rows of memory cells of a first row section of the plurality of row sections corresponding to the prime row address and the respective redundant row of a second row section of the plurality of row sections. The row decoder may be further configured to stop an access operation associated with the prime row from proceeding based on a comparison of subset of match signals from either the first or second pluralities of row sections.

Methods, systems, and devices for programmable column access are described. A device may transfer voltages from memory cells of a row in a memory array to respective digit lines for the memory cells. The voltages may be indicative of logic values stored at the memory cells. The device may communicate respective control signals to a set of multiplexers coupled with the digit lines, where each multiplexer is coupled with a respective subset of the digit lines. Each multiplexer may couple a digit line of the respective subset of digit lines with a respective sense component for that multiplexer based on the respective control signal for that multiplexer.

An example apparatus may perform concurrent threshold voltage compensation in a memory array with distributed row redundancy. The example apparatus may include a memory cell array having a mat having a plurality of row sections that each include respective prime memory cell rows and a respective redundant memory cell row. The example apparatus may further include a row decoder configured to receive an access command and a prime row address. The row decoder may be configured to, in response to a determination that the prime row address matches a defective prime row address, concurrently initiate a threshold voltage compensation operation on both of a prime row of the respective plurality of prime rows of memory cells of a first row section of the plurality of row sections corresponding to the prime row address and the respective redundant row of a second row section of the plurality of row sections.

A semiconductor memory device includes: memory units arranged in a first direction; first semiconductor layers arranged in the first direction and electrically connected to the memory units; first gate electrodes arranged in the first direction and opposed to the first semiconductor layers; a first wiring extending in the first direction and connected to the first semiconductor layers; second wirings arranged in the first direction, and connected to the first gate electrodes; second semiconductor layers arranged in the first direction and disposed at first end portions of the second wirings; second gate electrodes arranged in the first direction and opposed to the second semiconductor layers; third semiconductor layers arranged in the first direction and disposed at second end portions of the second wirings; and third gate electrodes arranged in the first direction and opposed to the third semiconductor layers.

Devices, systems and methods for improving a decoding operation in a non-volatile memory are described. An example method includes performing a first hard read to obtain a first set of values stored in a plurality of cells, storing the first set of values in a first buffer, performing a plurality of subsequent hard reads on the plurality of cells to obtain a plurality of subsequent sets of values, performing, for each subsequent set of values, the following operations: computing a quality metric, storing, in a second buffer, a difference between the subsequent set of values and the set of values stored in the first buffer, wherein the difference is stored in a compressed format, and storing, in response to the quality metric exceeding a threshold, the subsequent set of values in the first buffer, and generating, based on the first buffer and the second buffer, the log-likelihood ratio.