Patent classifications
G11C11/4093
Techniques to couple high bandwidth memory device on silicon substrate and package substrate
Techniques to couple a high bandwidth memory device on a silicon substrate and a package substrate are disclosed. Examples include selectively activating input/out (I/O) or command and address (CA) contacts on a bottom side of a logic layer for the high bandwidth device based on a mode of operation. The I/O and CA contacts are for accessing one or more memory devices include in the high bandwidth memory device via one or more data channels.
Techniques to couple high bandwidth memory device on silicon substrate and package substrate
Techniques to couple a high bandwidth memory device on a silicon substrate and a package substrate are disclosed. Examples include selectively activating input/out (I/O) or command and address (CA) contacts on a bottom side of a logic layer for the high bandwidth device based on a mode of operation. The I/O and CA contacts are for accessing one or more memory devices include in the high bandwidth memory device via one or more data channels.
PARALLEL-TO-SERIAL CONVERSION CIRCUIT, PARALLEL-TO-SERIAL CONVERSION CIRCUIT LAYOUT, AND MEMORY
A parallel-to-serial conversion circuit includes: parallel branches, each including first input end, second input end, control ends and output end, where first input end is configured to receive high level signal, second input end is configured to receive low level signal, control ends are connected to selection unit and output end is connected to serial wire, and selection unit is configured to receive selection signal and at least two branch signals and configured to select, based on selection signal, one branch signal and transmit it to parallel branch; serial wire configured to organize signals output by parallel branches into serial signal; and drive units connected in parallel with each other and connected to serial wire for enhancing drive capability of serial wire, output ends of drive units being connected with each other and configured to output serial signal, and each drive unit being disposed adjacent to a respective parallel branch.
PARALLEL-TO-SERIAL CONVERSION CIRCUIT, PARALLEL-TO-SERIAL CONVERSION CIRCUIT LAYOUT, AND MEMORY
A parallel-to-serial conversion circuit includes: parallel branches, each including first input end, second input end, control ends and output end, where first input end is configured to receive high level signal, second input end is configured to receive low level signal, control ends are connected to selection unit and output end is connected to serial wire, and selection unit is configured to receive selection signal and at least two branch signals and configured to select, based on selection signal, one branch signal and transmit it to parallel branch; serial wire configured to organize signals output by parallel branches into serial signal; and drive units connected in parallel with each other and connected to serial wire for enhancing drive capability of serial wire, output ends of drive units being connected with each other and configured to output serial signal, and each drive unit being disposed adjacent to a respective parallel branch.
FREQUENCY DIVIDER AND MEMORY DEVICE INCLUDING THE SAME
Disclosed is a frequency divider which includes a frequency dividing core circuit that includes a plurality of transistors and is configured to generate at least one division clock signal based on a clock signal and an inverted clock signal, a controller that is configured to generate a body bias control signal based on clock frequency information, and an adaptive body bias (ABB) generator that is configured to generate at least one body bias based on the body bias control signal and configured to apply the at least one body bias to a body of one or more of the plurality of transistors.
FREQUENCY DIVIDER AND MEMORY DEVICE INCLUDING THE SAME
Disclosed is a frequency divider which includes a frequency dividing core circuit that includes a plurality of transistors and is configured to generate at least one division clock signal based on a clock signal and an inverted clock signal, a controller that is configured to generate a body bias control signal based on clock frequency information, and an adaptive body bias (ABB) generator that is configured to generate at least one body bias based on the body bias control signal and configured to apply the at least one body bias to a body of one or more of the plurality of transistors.
SIGNAL LINE STRUCTURE, SIGNAL LINE DRIVING METHOD, AND SIGNAL LINE CIRCUIT
The present disclosure provides a signal line structure, a signal line driving method, and a signal line circuit. The signal line structure includes a plurality of parallel signal lines, where each of the signal lines is maintained in a drive state at any time.
SIGNAL LINE STRUCTURE, SIGNAL LINE DRIVING METHOD, AND SIGNAL LINE CIRCUIT
The present disclosure provides a signal line structure, a signal line driving method, and a signal line circuit. The signal line structure includes a plurality of parallel signal lines, where each of the signal lines is maintained in a drive state at any time.
Apparatuses and methods for configurable memory array bank architectures
Apparatuses and methods for configurable memory array bank architectures are described. An example apparatus includes a mode register configured to store information related to bank architecture and a memory array including a plurality of memory banks. The plurality of memory banks are configured to be arranged in a bank architecture based at least in part on the information related to bank architecture stored in the mode register.
Synchronous dynamic random access memory (SDRAM) dual in-line memory module (DIMM) having increased per data pin bandwidth
An apparatus is described. The apparatus includes logic circuitry to multiplex on a data bus a first data burst, a second data burst, a third data burst and a fourth data burst having different respective base target addresses that respectively target a first memory rank, a second memory rank, a third memory rank and a fourth memory rank. A first data transfer for the first data burst occurs on a first edge of a first pulse of a data strobe signal for the data bus and a second data transfer for the second data burst occurs on a second edge of the first pulse of the data strobe signal. A third data transfer for the third data burst occurs on a first edge of a second pulse of the data strobe signal for the data bus and a fourth data transfer for the fourth data burst occurs on a second edge of the second pulse. The second pulse immediately follows the first pulse on the data strobe signal. The first memory rank, the second memory rank, the third memory rank and the fourth memory rank are on a same memory module.