A coil component includes coils in a multilayer body with a rectangular or substantially rectangular parallelepiped shape. The coil component includes outer electrodes, a first coil, and second coils. The first coil includes conductor patterns and via conductors. When the multilayer body is divided by a bisecting line into first and second regions in a longitudinal direction of the multilayer body when viewed in the stacking direction, the first coil is located in the first region. When viewed in the stacking direction, straight lines connecting the via conductors with a first outer electrode and a fourth outer electrode at a minimum distance cross an opening region of the first coil.

A device configured for making a wire aerial of an element of radio frequency identification (RFID), which device comprises: a main body, extending along a longitudinal direction and having a longitudinal seat adapted to house a wire; a putting-wire head arranged at one end of the main body and constrained to the main body, the putting-wire head comprising: a guide element adapted to engage the wire and to deposit it onto a substrate, and which guide wire has a translational degree of freedom along the longitudinal direction with respect to the main body; and a wire-restraining element adapted to selectively abut on the guide element, wherein the putting-wire head is adapted to assume a first rest configuration,
wherein the restraining element is abutted onto the guide element and the wire is retained between the restraining element and the guide element, and a second operative configuration.

An RFID tag 10 attachable to an article in use that includes an RFIC module including an RFIC chip and a helical coil connected to the RFIC chip, and an antenna member that is a threadlike conductor having a portion helically wound on the RFIC module around a winding axis extending parallel to an extending direction of a coil axis of the helical coil.

A method is provided for testing a card body with a metallic core layer for a contactless or dual-interface chip card, and a method is provided for manufacturing a contactless or dual-interface chip card. The method involves testing the functionality of the card body before the chip module employed for testing, or a corresponding chip module, is fixed into the cavity of the card body. A card body having impurities, a partial closure or full closure in the slot of its metallic core layer fails the test and is not used at all for fixing the chip module and for the subsequent manufacturing steps.

A noncontact communication medium includes an antenna coil that is formed on a substrate having a through-hole and induces power with application of a magnetic field from an outside, and a processing circuit that operates using the power induced by the antenna coil. The processing circuit is inserted in the middle of the antenna coil. The antenna coil is wound in a loop shape along an outer periphery of the substrate. An outer peripheral end of the antenna coil is connected to the through-hole. A portion of the antenna coil on the substrate facing a position of the through-hole has a shape recessed to an inner peripheral side of the antenna coil in a winding direction.

Provided is a contactless information medium that achieves reduction in initial failure at the time of manufacture and obtains stable quality. A contactless information medium 1 includes a plurality of substrates 2a to 2d in a stacked state, an electric conductor 4, and an IC chip 5. The electric conductor 4 is integrally provided on each of the substrates 2a to 2d, and has a pre-formed conductive pattern 3. The IC chip 5 is mounted on any one of the substrates 2a to 2d, and is connected to the electric conductor 4. The conductive pattern 3 partially includes spiral patterns 31a to 31d formed in a spiral shape. The spiral patterns 31a to 31d are arranged at different positions among the substrates 2a to 2d.

A RFID transponder including a chip, having an antenna to which the chip is connected for contactless communication, and including a plastic package (1) which accommodates these transponder components as integrated components, wherein the plastic package (1) forms a coil core (2) on its outer surface, on which a booster antenna having at least one coil winding (4) is arranged, wherein the coil winding (4) completely surrounds the integrated antenna in order to form an inductive coupling, and the two ends (5, 6) of the coil winding (4) form antenna wires of a dipole antenna for the UHF range.

Provided is a contactless information medium that achieves reduction in initial failure at the time of manufacture and obtains stable quality. A contactless information medium 1 includes a plurality of substrates 2a to 2d in a stacked state, an electric conductor 4, and an IC chip 5. The electric conductor 4 is integrally provided on each of the substrates 2a to 2d, and has a pre-formed conductive pattern 3. The IC chip 5 is mounted on any one of the substrates 2a to 2d, and is connected to the electric conductor 4. The conductive pattern 3 partially includes spiral patterns 31a to 31d formed in a spiral shape. The spiral patterns 31a to 31d are arranged at different positions among the substrates 2a to 2d.

Provided is a data carrier that comprises at least one carrier body, at least one electronic module, at least one antenna, and at least one metallic layer. The electronic module is at least partially arranged in the carrier body. The antenna is in connection with the electronic module. The metallic layer comprises at least one recess, and the antenna comprises an electrically conducting wire that is at least partially arranged in the recess. At least part of the metallic layer is part of the antenna. Other embodiments disclosed.

A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.