Disclosed herein is an antenna device that includes a substrate, a conductor pattern formed on the substrate, and a magnetic sheet formed on the substrate. The conductor pattern includes a spiral or loop-shaped antenna coil and a spiral or loop-shaped coupling coil connected to the antenna coil and having a diameter smaller than that of the antenna coil. The antenna coil overlaps the magnetic sheet. The magnetic sheet has a first opening at a position overlapping the coupling coil such that an inner diameter area of the coupling coil completely overlaps the first opening in a plan view.

RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.

A secure RFID device is provided. The RFID device includes a switch module mounted in a recess of a device body. The switch module includes a switching portion configured to electrically connect terminal ends of an RFID antenna embedded in the switch body. In particular, forming the recess and mounting the switch module including the switching portion to the RFID device after final lamination of the same allows for the use of manufacturing techniques that result in RFID cards having high durability and required ISO qualities.

A system and a method for testing a wireless tag that has an antenna for wireless communication and employs a low energy wireless communication protocol. The system includes a near field antenna; and a fixture for positioning the wireless tag to be tested so that the at least one antenna for wireless communication of the at least one wireless tag to be tested is within a near field of the near field antenna of the system; wherein when the wireless tag is positioned by the fixture, it is within an at least a partly open chamber. The method comprises supplying, via the near field antenna of the system, a test signal for receipt by the antenna of the wireless tag; and comparing a received signal strength of a response from the wireless tag in response to the test signal to an expected benchmark.

RFID devices comprising (i) a transponder chip module (TCM) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

RFID tag RFIC modules are provided with each module including an RFIC, an antenna connection first electrode, an antenna connection second electrode, an RFIC connection first electrode, an RFIC connection second electrode, an impedance matching circuit that matches impedance between the RFIC and an antenna, and a rectangular substrate. A first coil and a second coil of the impedance matching circuit are juxtaposed in/on the substrate, and a straight line passing through center of gravity of the coil opening of the first coil and center of gravity of the coil opening of the second coil is inclined with respect to one side of the substrate, and directions of this inclination are different between the first RFIC module and the second RFIC module.

A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via.

RFID tag RFIC modules are provided with each module including an RFIC, an antenna connection first electrode, an antenna connection second electrode, an RFIC connection first electrode, an RFIC connection second electrode, an impedance matching circuit that matches impedance between the RFIC and an antenna, and a rectangular substrate. A first coil and a second coil of the impedance matching circuit are juxtaposed in/on the substrate, and a straight line passing through center of gravity of the coil opening of the first coil and center of gravity of the coil opening of the second coil is inclined with respect to one side of the substrate, and directions of this inclination are different between the first RFIC module and the second RFIC module.

A micro radio frequency identification tag for use on an article, the micro radio frequency identification tag comprises a substrate having a first surface and a second surface, each surface including a width and a longitudinal length, the longitudinal length being greater than the width; a chip anchor having a first chip attachment pad and a second chip attachment pad; a radio frequency identification chip operatively retained on the first surface by the chip anchor; a component anchor having a first component attachment pad and a second component attachment pad; a passive component operatively retained on the first surface by the component anchor; a continuous planar antenna operatively retained on the second surface; a first conductive trace interconnect segment connected to the continuous planar antenna and the first chip attachment pad; a second conductive trace interconnect segment connected to the continuous planar antenna and the second chip attachment pad; a third conductive trace interconnect segment connected to the continuous planar antenna and the first component attachment pad; a fourth conductive trace interconnect segment connected to the continuous planar antenna and the second component attachment pad.