The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

Provided is an aluminum alloy for a cable conductor. Specifically, the present invention relates to an aluminum alloy for a cable conductor, which is excellent in both mechanical properties, such as tensile strength, at room temperature and high temperatures and elongation, and electrical conductivity, is simple to manufacture at low costs, and is eco-friendly.

Provided is an aluminum alloy for a cable conductor. Specifically, the present invention relates to an aluminum alloy for a cable conductor, which is excellent in both mechanical properties, such as tensile strength, at room temperature and high temperatures and elongation, and electrical conductivity, is simple to manufacture at low costs, and is eco-friendly.

A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 .Math.m to 1.0 .Math.m, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5 % or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M = {(h1 - h2)/h1} x 100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.

A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 .Math.m to 1.0 .Math.m, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5 % or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M = {(h1 - h2)/h1} x 100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.

Preparation containing: (A) 30 to 90% by weight of at least one organic solvent; (B) 10 to 70% by weight of at least one platinum complex of the type [L1L2Pt[O(CO)R1]X].sub.n, wherein L1 and L2 represent the same or different monoolefin ligands, or together represent a compound L1L2 acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide, and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 represent the same or different C6-C18 non-aromatic monocarboxylic acid groups, or together represent a C8-C18 non-aromatic dicarboxylic acid group —O(CO)R1 R2(CO)O—, wherein they are mononuclear platinum complexes with n=1, or wherein, if L1L2 and/or —O(CO)R1 R2(CO)O— are present, they may be polynuclear platinum complexes with a whole number n>1, and (C) 0 to 10% by weight of at least one additive.

The invention relates to a system for producing Cu-Graphene composite wire that can replace copper cables used in transmission lines, electrical machines, transformers and households, and a method for said production system.

The invention relates to a system for producing Cu-Graphene composite wire that can replace copper cables used in transmission lines, electrical machines, transformers and households, and a method for said production system.