Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 μm.

An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 μm.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

An anisotropic conductive sheet has an insulation layer having a plurality of through-holes and a plurality of conductive layers each arranged on an inner wall surface of each of the plurality of through-holes. Each of the conductive layers has a base layer arranged on the inner wall surface of each of the through-holes and a metal plating layer arranged so as to contact with metal nanoparticles or a metal thin film in the base layer or the metal thin film. The base layer includes metal nanoparticles or a metal thin film and a binder, wherein at least a portion of the binder is arranged between the inner wall of each of the through-holes and the metal nanoparticles or the metal thin film. The binder is a sulfur-containing compound having a thiol group, a sulfide group or a disulfide group.

An anisotropic conductive sheet has an insulation layer having a plurality of through-holes and a plurality of conductive layers each arranged on an inner wall surface of each of the plurality of through-holes. Each of the conductive layers has a base layer arranged on the inner wall surface of each of the through-holes and a metal plating layer arranged so as to contact with metal nanoparticles or a metal thin film in the base layer or the metal thin film. The base layer includes metal nanoparticles or a metal thin film and a binder, wherein at least a portion of the binder is arranged between the inner wall of each of the through-holes and the metal nanoparticles or the metal thin film. The binder is a sulfur-containing compound having a thiol group, a sulfide group or a disulfide group.

In an interposer, metal bodies are included in a resin layer and separated from each other. A dimension of each of the metal bodies in an upward-downward direction is greater than a dimension of each of the plurality of metal bodies in a direction orthogonal to the upward-downward direction. At least one of the metal bodies is located in a first electrode and at least one of the plurality of metal bodies is located in a second electrode to electrically couple together the first electrode and the second electrode.

In an interposer, metal bodies are included in a resin layer and separated from each other. A dimension of each of the metal bodies in an upward-downward direction is greater than a dimension of each of the plurality of metal bodies in a direction orthogonal to the upward-downward direction. At least one of the metal bodies is located in a first electrode and at least one of the plurality of metal bodies is located in a second electrode to electrically couple together the first electrode and the second electrode.