A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

The present invention provides a conductive bonded assembly utilizing particles of Ni or an Ni alloy as conductive particles so as to enable firing under non-pressing conditions and further realize an excellent bonding strength, electron migration characteristic, and ion migration characteristic. The conductive bonded assembly of the present invention is a conductive bonded assembly of an electronic component which has a first bondable member (for example, electrode material), a second bondable member (for example, a semiconductor device on an Si or SiC substrate), and a conductive bonding layer bonding these bondable members together, where the bonding layer is an Ni sintered body formed by a sintered body of Ni particles which has a porosity of 30% or less, and, further, can be obtained by heating and sintering the Ni particles at the time of firing where the Ni sintered bonding layer is formed.

The present invention provides a stretchable film including: a cured product of a composition which contains (A) a (meth)acrylate compound having a siloxane bond, (B) a (meth)acrylate compound other than the component (A) having a urethane bond, and (C) an organic solvent having a boiling point in the range of 115 to 200° C. at atmospheric pressure; wherein the component (A) is localized in the direction of a surface of the film. The stretchable film of the present invention is excellent in stretchability and strength as well as repellency on the film surface.

The present invention provides a stretchable film including: a cured product of a composition which contains (A) a (meth)acrylate compound having a siloxane bond, (B) a (meth)acrylate compound other than the component (A) having a urethane bond, and (C) an organic solvent having a boiling point in the range of 115 to 200° C. at atmospheric pressure; wherein the component (A) is localized in the direction of a surface of the film. The stretchable film of the present invention is excellent in stretchability and strength as well as repellency on the film surface.

The present invention provides an anisotropic electrically conductive film with a structure, in which electrically conductive particles are disposed at lattice points of a planar lattice pattern in an electrically insulating adhesive base layer. A proportion of the lattice points, at which no electrically conductive particle is disposed, with respect to all the lattice points of the planar lattice pattern assumed as a reference region, is less than 20%. A proportion of the lattice points, at which plural electrically conductive particles are disposed in an aggregated state, with respect to all the lattice points of the planar lattice pattern, is not greater than 15%. A sum of omission of the electrically conductive particle and an aggregation of the electrically conductive particles is less than 25%.

The present invention provides an anisotropic electrically conductive film with a structure, in which electrically conductive particles are disposed at lattice points of a planar lattice pattern in an electrically insulating adhesive base layer. A proportion of the lattice points, at which no electrically conductive particle is disposed, with respect to all the lattice points of the planar lattice pattern assumed as a reference region, is less than 20%. A proportion of the lattice points, at which plural electrically conductive particles are disposed in an aggregated state, with respect to all the lattice points of the planar lattice pattern, is not greater than 15%. A sum of omission of the electrically conductive particle and an aggregation of the electrically conductive particles is less than 25%.

A manufacturing method of an embedded metal mesh flexible transparent electrode and application thereof; the method includes: directly printing a metal mesh transparent electrode on a rigid substrate by using an electric-field-driven jet deposition micro-nano 3D printing technology; performing conductive treatment on a printed metal mesh structure through a sintering process to realize conductivity of the metal mesh; respectively heating a flexible transparent substrate and the rigid substrate to set temperatures; completely embedding the metal mesh structure on the rigid substrate into the flexible transparent substrate through a thermal imprinting process; and separating the metal mesh completely embedded into the flexible transparent substrate from the rigid substrate to obtain the embedded metal mesh flexible transparent electrode. The mass production of the large-size embedded metal mesh flexible transparent electrode with low cost and high throughput by combining the electric-field-driven jet deposition micro-nano 3D printing technology with the roll-to-plane thermal imprinting technology.

A manufacturing method of an embedded metal mesh flexible transparent electrode and application thereof; the method includes: directly printing a metal mesh transparent electrode on a rigid substrate by using an electric-field-driven jet deposition micro-nano 3D printing technology; performing conductive treatment on a printed metal mesh structure through a sintering process to realize conductivity of the metal mesh; respectively heating a flexible transparent substrate and the rigid substrate to set temperatures; completely embedding the metal mesh structure on the rigid substrate into the flexible transparent substrate through a thermal imprinting process; and separating the metal mesh completely embedded into the flexible transparent substrate from the rigid substrate to obtain the embedded metal mesh flexible transparent electrode. The mass production of the large-size embedded metal mesh flexible transparent electrode with low cost and high throughput by combining the electric-field-driven jet deposition micro-nano 3D printing technology with the roll-to-plane thermal imprinting technology.

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.