A method for producing an anisotropic conductive sheet that can be used for an inspection of a semiconductor package or a high-frequency component part, in which the pitch of wiring is narrowed and the wiring itself has been subjected to wire thinning, and that can be easily produced. A method for producing an anisotropic conductive sheet, includes a molding step of molding a conductive filler material-containing composition including (A) a conductive filler material dispersed in an organic solvent and (B) a binder resin, into a sheet-like body, and an organic solvent volatilization step of heating one surface of the sheet-like body and thereby volatilizing the organic solvent through the other surface of the sheet-like body.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

This anisotropic conductive sheet includes: a plurality of conductive paths; and an insulation layer which is disposed to fill the space between the plurality of conductive paths and has a first surface and a second surface. Each of the conductive path extends in a thickness direction of the insulation layer and has a first end part on the first surface side and a second end part on the second surface side. When the conductive paths are seen through so that the center of the first end part overlaps the center of the second end part, at least a portion of the conductive paths does not overlap the first end part and the second end part.

A method of formulating and using pastes, inks or adhesives made of electrically conductive and magnetically polarizable materials bound by a polymeric matrix includes depositing a paste, ink or adhesive at a low temperature, and using the paste, ink or adhesive as an electrically and magnetically and thermally active component, either in a wet or dried state. The polymer matrix provides the deposited product with mechanical properties, which integrate with the electrical and magnetic functions expressed by the other materials in the product. The product can be deposited both on a flexible and a rigid substrate, and can be used directly on the substrate, or in a form released from the substrate. The deposited product may be used as an electromagnetic and thermal component and device, such as an electromagnetic welder, electromagnetic heater, multifunctional material and coating passivating a static electric charge, magnetoresistive sensor, electromechanical relay, or electromechanical actuator.

A method of formulating and using pastes, inks or adhesives made of electrically conductive and magnetically polarizable materials bound by a polymeric matrix includes depositing a paste, ink or adhesive at a low temperature, and using the paste, ink or adhesive as an electrically and magnetically and thermally active component, either in a wet or dried state. The polymer matrix provides the deposited product with mechanical properties, which integrate with the electrical and magnetic functions expressed by the other materials in the product. The product can be deposited both on a flexible and a rigid substrate, and can be used directly on the substrate, or in a form released from the substrate. The deposited product may be used as an electromagnetic and thermal component and device, such as an electromagnetic welder, electromagnetic heater, multifunctional material and coating passivating a static electric charge, magnetoresistive sensor, electromechanical relay, or electromechanical actuator.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

A manufacturing method of an anisotropic conductive film and an apparatus thereof are provided. The manufacturing method of an anisotropic conductive film includes steps of: (a) providing a first substrate having metal contacts; (b) disposing a resin layer on the first substrate and covering the metal contacts; (c) providing a press head having a suction pattern arranged corresponding to the metal contacts; (d) sucking the conductive particles by the press head; and (e) pressing the conductive particles into the resin layer by the press head. The conductive particles are disposed corresponding to the metal contacts of the substrate, so that the problem about the short circuit between contacts can be improved, and the product yield and reliability can also be improved.

A manufacturing method of an anisotropic conductive film and an apparatus thereof are provided. The manufacturing method of an anisotropic conductive film includes steps of: (a) providing a first substrate having metal contacts; (b) disposing a resin layer on the first substrate and covering the metal contacts; (c) providing a press head having a suction pattern arranged corresponding to the metal contacts; (d) sucking the conductive particles by the press head; and (e) pressing the conductive particles into the resin layer by the press head. The conductive particles are disposed corresponding to the metal contacts of the substrate, so that the problem about the short circuit between contacts can be improved, and the product yield and reliability can also be improved.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.