A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.

A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.

A skin layer of a superconducting tape has a woven mesh structure and is disposed on a surface of a superconducting tape. The skin layer of a superconducting tape solves the problem where a vapor layer generated when a superconductor is in a normal resistive state greatly reduces the efficiency of a heat exchange between the superconductor and liquid nitrogen. Further provided are the superconducting tape and a superconducting coil.

A thermal-insulated multi-walled pipe for superconducting power transmission comprises: a superconducting cable; a multi-walled pipe composed of a plurality of straight pipes and houses the superconducting cable; and a plurality of spacers that are located between adjacent two straight pipes of the plurality of straight pipes, wherein a cross-sectional shape of each spacer is a polygon having three or more vertices, each spacer has a through-hole at a center in the plane, an inner straight pipe is located to pass through the through-hole, a frictional coefficient μ.sub.i between each spacer and the inner straight pipe is 0.1 or less, a frictional coefficient μ.sub.o between each spacer and an outer straight pipe is 0.1 or less, and a ratio L.sub.d/d of a diagonal equivalent length L.sub.d of the polygon to an inner diameter d of the outer straight pipe of the adjacent two straight pipes is 0.9 or less.

The various embodiments described herein include methods, devices, and systems for fabricating and operating superconducting circuits. In one aspect, an electric circuit includes: (1) a first superconducting component having a first terminal, a second terminal, and a constriction region between the first terminal and the second terminal; (2) a second superconducting component having a third terminal and a fourth terminal; and (3) a first electrically-insulating component that thermally couples the first superconducting component and the second superconducting component such that heat produced at the constriction region is transferred through the first component to the second superconducting component.

The various embodiments described herein include methods, devices, and systems for fabricating and operating superconducting circuits. In one aspect, an electric circuit includes: (1) a first superconducting component having a first terminal, a second terminal, and a constriction region between the first terminal and the second terminal; (2) a second superconducting component having a third terminal and a fourth terminal; and (3) a first electrically-insulating component that thermally couples the first superconducting component and the second superconducting component such that heat produced at the constriction region is transferred through the first component to the second superconducting component.

A carrier is provided for quantum computer chips that allows easy implementation, connection, and communication to and from the quantum computer chips while minimizing the thermal perturbation and avoiding labor intensive manual connection as well as the human error in such manual connection. Methods for fabricating such carriers are also provided.

A carrier is provided for quantum computer chips that allows easy implementation, connection, and communication to and from the quantum computer chips while minimizing the thermal perturbation and avoiding labor intensive manual connection as well as the human error in such manual connection. Methods for fabricating such carriers are also provided.

Provided is a thermal-insulated multi-walled pipe for superconducting power transmission that highly prevents intrusion of external heat due to radiation and has excellent thermal insulation property without using a superinsulation and can be produced easily. A thermal-insulated multi-walled pipe for superconducting power transmission comprises: a superconducting cable; and a multi-walled pipe that houses the superconducting cable, wherein the multi-walled pipe is composed of a plurality of straight pipes, and at least one of the plurality of straight pipes has, at a surface thereof, a coating layer containing a metal powder.

Provided is a thermal-insulated multi-walled pipe for superconducting power transmission that highly prevents intrusion of external heat due to radiation and has excellent thermal insulation property without using a superinsulation and can be produced easily. A thermal-insulated multi-walled pipe for superconducting power transmission comprises: a superconducting cable; and a multi-walled pipe that houses the superconducting cable, wherein the multi-walled pipe is composed of a plurality of straight pipes, and at least one of the plurality of straight pipes has, at a surface thereof, a coating layer containing a metal powder.