Patent classifications
H01B13/30
Noble metal coated silver nanowires, methods for performing the coating
Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.
Electromagnetic interference shielding film having a laminated structure including a stack of metal nanoplates and a nano electrode including the same
An electromagnetic wave shielding film includes a substrate; and an electromagnetic wave shielding layer disposed on the substrate and including a laminated structure having a planar shape and including a stack of metal nanoplates, wherein each metal nanoplate of the stack of metal nanoplates is staggered with respect to one or more other metal nanoplate of the stack of metal nanoplates so that the laminated structure has pores defined therein and between laminated structures in a stack of laminates structures. An additional embodiment of an electromagnetic wave shielding film includes an electromagnetic wave shielding layer including a composite of a polymer resin matrix composed of a polymer and at least one metal nanoplate, wherein each metal nanoplate of the at least one metal nanoplate is staggered with respect to one or more other metal nanoplate of the at least one metal nanoplate so that the composite has pores defined therein.
Electromagnetic interference shielding film having a laminated structure including a stack of metal nanoplates and a nano electrode including the same
An electromagnetic wave shielding film includes a substrate; and an electromagnetic wave shielding layer disposed on the substrate and including a laminated structure having a planar shape and including a stack of metal nanoplates, wherein each metal nanoplate of the stack of metal nanoplates is staggered with respect to one or more other metal nanoplate of the stack of metal nanoplates so that the laminated structure has pores defined therein and between laminated structures in a stack of laminates structures. An additional embodiment of an electromagnetic wave shielding film includes an electromagnetic wave shielding layer including a composite of a polymer resin matrix composed of a polymer and at least one metal nanoplate, wherein each metal nanoplate of the at least one metal nanoplate is staggered with respect to one or more other metal nanoplate of the at least one metal nanoplate so that the composite has pores defined therein.
Dialkylzinc- and dialkylzinc partial hydrolysate-containing solution, and method for producing zinc oxide thin film using solution
A solution containing a diketone compound having an alkoxy group, a dialkylzinc represented by general formula (1) and/or a partial hydrolysate of the dialkylzinc, and a solvent is described. A method for producing a zinc oxide thin film involves applying the dialkylzinc solution or a solution containing a dialkylzinc partial hydrolysate to a base material.
ZnR.sup.10.sub.2 (1)
In the formula, R.sup.10 is a C.sub.1-6 linear or branched alkyl group. The solution containing dialkylzinc or dialkylzinc partial hydrolysate can be handled in air, making it possible to form a transparent thin film having high adhesiveness to a substrate even with film formation in air.
Dialkylzinc- and dialkylzinc partial hydrolysate-containing solution, and method for producing zinc oxide thin film using solution
A solution containing a diketone compound having an alkoxy group, a dialkylzinc represented by general formula (1) and/or a partial hydrolysate of the dialkylzinc, and a solvent is described. A method for producing a zinc oxide thin film involves applying the dialkylzinc solution or a solution containing a dialkylzinc partial hydrolysate to a base material.
ZnR.sup.10.sub.2 (1)
In the formula, R.sup.10 is a C.sub.1-6 linear or branched alkyl group. The solution containing dialkylzinc or dialkylzinc partial hydrolysate can be handled in air, making it possible to form a transparent thin film having high adhesiveness to a substrate even with film formation in air.
Porous carbon electrode manufacturing method
The present invention relates to a method of manufacturing a porous carbon electrode, the method including: applying a metal film or metal particles to one surface of a carbon electrode; heat treating the carbon electrode to which the metal film or the metal particles are applied; and forming one surface of the carbon electrode in a porous structure by making the metal film or the metal particles penetrate into one surface of the carbon electrode, and the efficiency of the carbon electrode as an electrode may be improved while increasing a surface area of a carbon structure.
Composition and method for inhibiting corrosion of an anodized material
A method for inhibiting corrosion of an anodized material including applying to the anodized material a corrosion inhibiting composition that includes a liquid carrier and an electrically conductive nanomaterial dispersed in the liquid carrier.
Composition and method for inhibiting corrosion of an anodized material
A method for inhibiting corrosion of an anodized material including applying to the anodized material a corrosion inhibiting composition that includes a liquid carrier and an electrically conductive nanomaterial dispersed in the liquid carrier.
METHODS FOR PREPARING A CARBON NANOTUBE CONDUCTIVE BALL AND A CARBON NANOTUBE BALL CONDUCTIVE ADHESIVE
The present disclosure provides a method for preparing a carbon nanotube conductive ball and a method for preparing a carbon nanotube ball conductive adhesive. The method for preparing the carbon nanotube conductive ball integrates the advantages of stability of polymer microsphere and SiO.sub.2 microsphere, and high conductivity of carbon nanotube, by applying polymer microsphere or SiO.sub.2 microsphere as matrix, and plating carbon nanotube material to obtain the spherical carbon nanotube conductive ball. The method is simple, low equipment requirements, abundant raw materials, low cost, and high efficiency, the particle size of the carbon nanotube conductive ball is controllable, the material stability and conductivity of the carbon nanotube conductive ball are excellent. The method for preparing the carbon nanotube ball conductive adhesive adopts carbon nanotube as an electrically conducting particle, which replaces the commonly used conductive gold ball in TFT-LCD field, the disadvantages in traditional conductive adhesive such as high filling content, expensive price, complicated preparation process, environmental pollution, and so on are solved. Besides, the carbon nanotube ball conductive adhesive also has a great prospect in ultra-fine circuit connections.
METHODS FOR PREPARING A CARBON NANOTUBE CONDUCTIVE BALL AND A CARBON NANOTUBE BALL CONDUCTIVE ADHESIVE
The present disclosure provides a method for preparing a carbon nanotube conductive ball and a method for preparing a carbon nanotube ball conductive adhesive. The method for preparing the carbon nanotube conductive ball integrates the advantages of stability of polymer microsphere and SiO.sub.2 microsphere, and high conductivity of carbon nanotube, by applying polymer microsphere or SiO.sub.2 microsphere as matrix, and plating carbon nanotube material to obtain the spherical carbon nanotube conductive ball. The method is simple, low equipment requirements, abundant raw materials, low cost, and high efficiency, the particle size of the carbon nanotube conductive ball is controllable, the material stability and conductivity of the carbon nanotube conductive ball are excellent. The method for preparing the carbon nanotube ball conductive adhesive adopts carbon nanotube as an electrically conducting particle, which replaces the commonly used conductive gold ball in TFT-LCD field, the disadvantages in traditional conductive adhesive such as high filling content, expensive price, complicated preparation process, environmental pollution, and so on are solved. Besides, the carbon nanotube ball conductive adhesive also has a great prospect in ultra-fine circuit connections.