A tank including a fluid reservoir, a communication module, a controller, and at least one sensor. The fluid reservoir is configured to be in fluid communication with a cable segment. The communication module is configured to communicate with an external device. The sensor is configured to detect an injection parameter value, encode the injection parameter value in a sensor signal, and send the sensor signal to the controller. The controller is configured to automatically instruct the communication module to transmit information to the external device based on the injection parameter value.

A manufacturing method for a conductive substrate, with which a conductive substrate including a substrate and a conductive thin wire arranged on the substrate are manufactured, includes in the following order, a step 1 of forming a thin wire containing a metal on the substrate; a step 2 of bringing the thin wire into contact with a solution containing an organic acid; and a step 3 of subjecting the thin wire to a plating treatment to form a conductive thin wire.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

Embodiments described herein provide methods of processing an electronic component, comprising mixing a bio-based polymer having sulfur-reactive substituents with a sulfurization catalyst and a solvent to form a coating material; applying the coating material to an electronic component; and removing the solvent to form a sulfur-reactive polymer coating that is resistant to sulfur penetration. The bio-based polymer may be made by bacterial fermentation of unsaturated fatty acids.

Embodiments described herein provide methods of processing an electronic component, comprising mixing a bio-based polymer having sulfur-reactive substituents with a sulfurization catalyst and a solvent to form a coating material; applying the coating material to an electronic component; and removing the solvent to form a sulfur-reactive polymer coating that is resistant to sulfur penetration. The bio-based polymer may be made by bacterial fermentation of unsaturated fatty acids.

A tank including a fluid reservoir, a communication module, a controller, and at least one sensor. The fluid reservoir is configured to be in fluid communication with a cable segment. The communication module is configured to communicate with an external device. The sensor is configured to detect an injection parameter value, encode the injection parameter value in a sensor signal, and send the sensor signal to the controller. The controller is configured to automatically instruct the communication module to transmit information to the external device based on the injection parameter value.

A tank including a fluid reservoir, a communication module, a controller, and at least one sensor. The fluid reservoir is configured to be in fluid communication with a cable segment. The communication module is configured to communicate with an external device. The sensor is configured to detect an injection parameter value, encode the injection parameter value in a sensor signal, and send the sensor signal to the controller. The controller is configured to automatically instruct the communication module to transmit information to the external device based on the injection parameter value.