Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

A resistor includes a resistor main body, and a resin portion covering the resistor main body. The resin portion includes a radiation fin.

A resistor includes an elongated cylindrical body having nodes and elongated members. The elongated members interconnect the nodes to form openings between the nodes and the elongated members for the flow therethrough of a cooling fluid. The body is configured to receive electric current from a powered system and to conduct and provide electric resistance to the electric current to dissipate at least part of the electric current as heat from the body. The body may be coupled with at least one other resistor of the powered system in one or more of a parallel or series arrangement in an electric circuit.

A resistor includes an elongated cylindrical body having nodes and elongated members. The elongated members interconnect the nodes to form openings between the nodes and the elongated members for the flow therethrough of a cooling fluid. The body is configured to receive electric current from a powered system and to conduct and provide electric resistance to the electric current to dissipate at least part of the electric current as heat from the body. The body may be coupled with at least one other resistor of the powered system in one or more of a parallel or series arrangement in an electric circuit.

A discharge apparatus for discharging energy includes a control board, a carrier board, a connecting device, and a discharge resistor. The control board is designed to control an electrical appliance for a vehicle. The carrier board has an electrically conductive interface. The connecting device is electrically conductive and is formed so as to electrically connect the interface to the control board. The discharge resistor is arranged in or on the carrier board and is electrically connected to the interface. In addition, the discharge resistor is designed to discharge the energy when the interface is electrically connected to the control board.

A discharge apparatus for discharging energy includes a control board, a carrier board, a connecting device, and a discharge resistor. The control board is designed to control an electrical appliance for a vehicle. The carrier board has an electrically conductive interface. The connecting device is electrically conductive and is formed so as to electrically connect the interface to the control board. The discharge resistor is arranged in or on the carrier board and is electrically connected to the interface. In addition, the discharge resistor is designed to discharge the energy when the interface is electrically connected to the control board.

A PTC heating element and an electric heating device containing such a PTC heating element are disclosed. The PTC heating element comprises two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween which is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers. The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element. The metallization provided on the other main side surface is assigned to only the other potential for energizing the PTC element. The metallization of the one main side surface of the PTC element and the metallization of the other main side surface of the PTC element are formed in such a way that the current path (P) through the PTC element is extended relative to the thickness (D) of the PTC element.

A PTC heating element and an electric heating device containing such a PTC heating element are disclosed. The PTC heating element comprises two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween which is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers. The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element. The metallization provided on the other main side surface is assigned to only the other potential for energizing the PTC element. The metallization of the one main side surface of the PTC element and the metallization of the other main side surface of the PTC element are formed in such a way that the current path (P) through the PTC element is extended relative to the thickness (D) of the PTC element.