A load testing device or the like having a structure in which cooling air does not leak, is provided. A load testing device includes: a resistance unit having a resistor and a resistor holding frame holding the resistor; a cooling unit having a cooling fan; and an insulating frame disposed between the resistance unit and the cooling unit. The insulating frame is coupled with the resistance unit. The insulating frame is coupled with the cooling unit. The insulating frame covers a side surface of a flow path of cooling air from the cooling unit to the resistance unit between the cooling unit and the resistance unit.

A thin film resistor is provided, and a resistance layer of the thin film resistor is a patternized mesh. The mesh density of the mesh resistance layer increases from center to both ends of the film resistor. The temperature peak is shifted from the center to both ends of the film resistor. Therefore, the heat can be quickly dissipated via the electrodes.

The present invention relates to a circuit protection device including: a device comprising a heating element configured to comprise a body and a pair of electrodes formed on the body, and a pair of lead wires connected, respectively, to the pair of electrodes; and a case having an independent accommodating space formed therein to accommodate at least the heating element, wherein the case includes at least one heat insulating layer disposed in the vicinity of the accommodating space.

A load testing device or the like having a structure in which cooling air does not leak, is provided. A load testing device includes: a resistance unit having a resistor and a resistor holding frame holding the resistor; a cooling unit having a cooling fan; and an insulating frame disposed between the resistance unit and the cooling unit. The insulating frame is coupled with the resistance unit. The insulating frame is coupled with the cooling unit. The insulating frame covers a side surface of a flow path of cooling air from the cooling unit to the resistance unit between the cooling unit and the resistance unit.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

A chip resistor includes a main body having opposite first and second surfaces and a peripheral surface connected between the first and second surfaces, and first and second electrode units oppositely and separately disposed on the peripheral surface. The main body includes a resistance layer having opposite top and bottom surfaces, a metallic heat dissipation layer disposed on the top surface of the resistance layer, a metallic heat conductive layer disposed on the bottom surface of the resistance layer, and an insulating unit interposed between the resistance layer and the metallic heat dissipation layer, and between the resistance layer and the metallic heat conductive layer.

A chip resistor includes a main body having opposite first and second surfaces and a peripheral surface connected between the first and second surfaces, and first and second electrode units oppositely and separately disposed on the peripheral surface. The main body includes a resistance layer having opposite top and bottom surfaces, a metallic heat dissipation layer disposed on the top surface of the resistance layer, a metallic heat conductive layer disposed on the bottom surface of the resistance layer, and an insulating unit interposed between the resistance layer and the metallic heat dissipation layer, and between the resistance layer and the metallic heat conductive layer.

The present invention relates to a circuit protection device including: a device comprising a heating element configured to comprise a body and a pair of electrodes formed on the body, and a pair of lead wires connected, respectively, to the pair of electrodes; and a case having an independent accommodating space formed therein to accommodate at least the heating element, wherein the case includes at least one heat insulating layer disposed in the vicinity of the accommodating space.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.