A resistor device has a resistor body, a first electrode assembly and a second electrode assembly. The resistor body has a resistor layer. The first electrode assembly has two first electrodes symmetrically distributed on both sides of the resistor layer, wherein the first electrodes are electrically connected to the resistor layer. The second electrode assembly has two second electrodes symmetrically distributed on both sides of the resistor layer, wherein the second electrodes are electrically connected to the resistor layer, and positions which the first electrode and the second electrode located on the same side of the resistor layer are connected to the resistor layer have an equipotential. The resistor device does not generate voltage drop through voltammetry detection, improves the accuracy of resistance value precision measurement of the voltammetry detection, and thus can be applied to precision circuits that have high requirements on resistance value precision.

A resistor device has a resistor body, a first electrode assembly and a second electrode assembly. The resistor body has a resistor layer. The first electrode assembly has two first electrodes symmetrically distributed on both sides of the resistor layer, wherein the first electrodes are electrically connected to the resistor layer. The second electrode assembly has two second electrodes symmetrically distributed on both sides of the resistor layer, wherein the second electrodes are electrically connected to the resistor layer, and positions which the first electrode and the second electrode located on the same side of the resistor layer are connected to the resistor layer have an equipotential. The resistor device does not generate voltage drop through voltammetry detection, improves the accuracy of resistance value precision measurement of the voltammetry detection, and thus can be applied to precision circuits that have high requirements on resistance value precision.

A current detection device (30) includes a resistance element (5), and a pair of electrodes (6, 7). The current detection device (30) has a projecting portion (11). The projecting portion (11) has a portion of the resistance element (5) and portions of the pair of electrodes (6, 7). The electrodes (6, 7) have first wall portions (66b, 67b) forming a portion of the projecting portion (11), and second wall portions (66a, 67a) forming the portion of the projecting portion (11). The electrodes (6, 7) have detection areas (66, 67) demarcated by the first wall portion (66b, 67b), the second wall portion (66a, 67a), a leading end portion (66c, 67c), and a contact surface (6a, 7a). The electrodes (6, 7) have voltage detecting portions (20, 21). The voltage detecting portions (20, 21) are arranged in the detection areas (66, 67) with a gap between the leading end portions (66c, 67c).

A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.

A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.

A chip resistor comprises an insulating substrate (component body) on which a resistor is formed, a connection terminal (front electrodes, end face electrodes, and back electrodes) formed at both end portions of the insulating substrate, an under layer formed by electrolytic plating to cover the connection terminal, a barrier layer formed by electrolytic plating to cover the under layer, and an external connection layer which is mainly composed of tin and formed on a surface of the barrier layer, wherein the barrier layer is made of alloy plating mainly composed of nickel and containing 3% to 15% of phosphorus, and the under layer is formed of a copper plated layer that is at least either more malleable or more ductile than the barrier layer.

The mounting area for an electronic component and a resistor for current detection is reduced. A current detection resistor for detecting current includes a plate-like resistive body, and a first electrode and an opposite second electrode which are stacked in a thickness direction of the resistive body and are disposed so as to sandwich the resistive body. The first electrode has a groove portion.

A resistance heater may include a polymer positive temperature coefficient (PPTC) material, arranged in a ring shape that defines a heater body; and an electrode assembly, comprising two or more electrodes arranged in contact with the heater body at two or more locations, wherein PPTC material comprises: a polymer matrix, the polymer matrix defining a PPTC body; and a conductive filler component, disposed in the polymer matrix.

A resistor assembly including at least two connector elements and at least one strip-like or plate-like resistor element arranged between the connector elements. The resistor element has an upper side, a lower side and two longitudinal sides parallel to each other. The at least one resistor element is of a material of which the electrical conductivity is lower than the electrical conductivity of the material of the connector elements. The resistor element has, on at least its upper side or at least its lower side, at least one shaped element as a positioning aid.

A chip resistor includes an insulated substrate having a rectangular parallelepiped shape, a first front electrode and a second front electrode created on both longitudinal ends of the insulated substrate, and a resistive element making a connection between the first and second front electrodes. The resistive element is formed in a meandering shape with a first region and a second region continuing in series via a jointing section between a pair of connecting portions. Moreover, in the first region, a first trimming groove for rough adjustment is formed to elongate a current path of the resistive element. In the second region, a second trimming groove is formed for fine adjustment extending in a direction angled with respect to a straight line along a direction in which the first trimming groove extends.