A multilayer ceramic electronic component has a dimension in a longitudinal direction of no less than about 0.12 mm and no more than about 0.27 mm, a dimension in a width direction of no less than about 0.06 mm and no more than about 0.14 mm, and a dimension in a lamination direction of no less than about 0.06 mm and no more than about 0.14 mm, for example. Each of a first outer electrode and a second outer electrode includes an underlying electrode layer disposed on a surface of a multilayer body, a nickel-plated layer covering the underlying electrode layer, and a tin-plated layer covering the nickel-plated layer. The nickel-plated layer in each of the first outer electrode and second outer electrode has surface roughness of no less than about 3 μm and no more than about 6 μm, for example.

In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.

In a manufacturing method for a thermistor element (3) including: a thermistor portion (49) which is a sintered body formed from a thermistor material; and a pair of electrode wires (25) which are embedded in the thermistor portion (49) and at least one end portion of each of the electrode wires projects at an outer side of the thermistor portion (49), the resistance value of the thermistor element (3) is adjusted by performing a removal processing of removing a part of the thermistor portion (49).

Systems and methods for monitoring the temperature of a liquid are disclosed herein. Systems can include a thermistor in contact with a liquid coolant and circuitry configured to measure a temperature of the thermistor by applying a nominal current through the thermistor and detecting a voltage drop across the thermistor. The circuitry may be further configured to apply a current pulse greater than the nominal current through the thermistor, detect a transient thermistor response to the current pulse, and compare the detected transient thermistor response to an expected transient response. The circuitry may be capable of determining if the thermistor is immersed in a fluid or at least partially located within a fluid-free region based on comparing the detected transient thermistor response to the expected transient response.

A sintered electroconductive oxide having a perovskite oxide type crystal structure represented by a compositional formula: M1.sub.aM2.sub.bMn.sub.cAl.sub.dCr.sub.eO.sub.f wherein M1 represents at least one element selected from group 3 elements; and M2 represents at least one element selected from among Mg, Ca, Sr and Ba, wherein element M1 predominantly includes at least one element selected from Nd, Pr and Sm, and a, b, c, d, e and f satisfy the following relationships: 0.6005≦a<1.000, 0<b≦0.400, 0≦c<0.150, 0.400≦d<0.950, 0.050<e≦0.600, 0.50<e/(c+e)≦1.00, and 2.80≦f≦3.30. Also disclosed is a thermistor element including a thermistor portion which is formed of the sintered electroconductive oxide as well as a temperature sensor employing the thermistor element.

A method for manufacturing a sheet of positive temperature coefficient (PTC) material includes providing a PTC material, grinding the PTC material into a powder, and inserting the ground PTC material into a press. The ground PTC material is compressed within the press until the PTC material defines a planar shape. The PTC material is then removed from the press to thereby provide a PTC sheet.

An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.

An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess.

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.