A frequency-dependent resistance element includes an element assembly composed of a sintered magnetic material and a coil conductor embedded in the element assembly. The sintered magnetic material is composed of a primary component containing Fe, Zn, Ni, and Cu and a secondary component containing Co. In the primary component, on a percent by mole basis, the Fe content is 46.79 to 47.69, the Zn content is 12.60 to 24.84, and the Ni content is 19.21 to 32.36 in terms of Fe.sub.2O.sub.3, ZnO, and NiO, respectively. The molar ratio (Ni:Zn) of Ni to Zn is (1X):X, where X is from about 0.28 to about 0.56. The content of Co in terms of Co.sub.3O.sub.4 is 1.0 to 10.0 parts by mass relative to 100 parts by mass of the primary component containing Fe, Zn, Ni, and Cu in terms of Fe.sub.2O.sub.3, ZnO, NiO, and CuO, respectively.

A method of making a carbon nanotube heater assembly for a large area requiring ice protection includes using a connection material to join first and second carbon nanotube heaters. The assembly includes a carrier material and an encapsulating material surrounding the carbon nanotube heaters and connection material.

A method of making a carbon nanotube heater assembly for a large area requiring ice protection includes using a connection material to join first and second carbon nanotube heaters. The assembly includes a carrier material and an encapsulating material surrounding the carbon nanotube heaters and connection material.

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO.sub.2, TiN, TiNO and TiSiON.

A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO.sub.2, TiN, TiNO and TiSiON.

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.