The invention is to provide a chip resistor suitable for lowering an initial resistance value. A chip resistor 1 according to the present invention is provided with: an insulating substrate 2; a pair of front electrodes 3 which are provided on a front surface of the insulating substrate 2 so as to face each other with a predetermined interval therebetween; a resistive element 4 which is provided so as to bridge the front electrodes 3; a pair of auxiliary electrodes 5 which are provided so as to cover the front electrodes 3 and overlap end portions of the resistive element 4; and the like. The chip resistor 1 is configured such that: the front electrodes 3 are formed of a material which contains 1 to 5 wt % Pd and the balance Ag; and the auxiliary electrodes 5 are formed of a material which contains 15 to 30 wt % Pd and a metal material (e.g. Au) lower in resistivity than Pd and the balance Ag.

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

The invention relates to a composite material strip for producing an electric component, in particular a resistor, in particular a low-resistance current-measuring resistor, comprising a first material strip (4) made of a copper-containing material, in particular a copper-containing conductor material, for later forming a first connection part of the electric component and comprising a second material strip (3) for later forming a second connection part of the electric component. The first material strip (4) and the second material strip (3) are electrically and mechanically connected together along a longitudinal seam, wherein the second material strip (3) consists of an aluminum-containing material, in particular an aluminum-containing conductor material. The invention further relates to a corresponding production method and to a corresponding component.

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

Embodiments of the present disclosure disclose a variable resistance and a manufacturing method thereof, and the variable resistance is a variable resistance with continually adjustable resistance value. This variable resistance comprises: an elastic insulation envelope and conductive particles filled in the elastic insulation envelope. The manufacturing method of the variable resistance comprises: filling conductive particles into an elastic insulation envelope with an opening; and sealing the opening of the elastic insulation envelope.

Embodiments of the present disclosure disclose a variable resistance and a manufacturing method thereof, and the variable resistance is a variable resistance with continually adjustable resistance value. This variable resistance comprises: an elastic insulation envelope and conductive particles filled in the elastic insulation envelope. The manufacturing method of the variable resistance comprises: filling conductive particles into an elastic insulation envelope with an opening; and sealing the opening of the elastic insulation envelope.