A logging system and method for operating a logging system are typically used in a wellbore. The logging system may include a logging instrument including a rechargeable energy storage and logging electronics, and a cable configured to trickle charge the rechargeable energy storage. The rechargeable energy storage may include an ultracapacitor. The rechargeable energy storage may be trickle charged through the cable from a remote power source.

An apparatus for assembling a capacitor assembly and a method for assembling the capacitor assembly using the same according to the present disclosure includes: a processing module mechanically, electrically coupling a capacitor to a bracket to assemble to a capacitor assembly, a test module testing whether the assembled capacitor assembly normally operates, and a conveyor module in which the capacitor assembly is arranged to sequentially perform the processing and test processes while moving in one direction, and it is possible to precisely detect whether the capacitor assembly is defective through two or more tests, and if many mechanical defects occur, it is possible to reduce the possibility of occurrence of the mechanical defect by controlling and adjusting some of the processing modules and improve productivity.

A capacitor structure and a power converter are provided. The capacitor structure includes a parallel cell combination, and the parallel cell combination includes a plurality of cells and a plurality of current collectors. In the parallel cell combination: the cells are connected in parallel, and the poles connected in parallel are respectively connected with other devices through corresponding confluence points. Same poles of two adjacent cells are connected through a corresponding current collector, and the current-carrying specifications of each current collector is lower than the current-carrying requirements of a confluence point of a corresponding pole. That is to say, a conductor that implements the parallel connection of the cells is no longer a whole copper plate, but the individual current collectors, thus realizing the reduction of the cost of the conductor material.

A capacitor structure and a power converter are provided. The capacitor structure includes a parallel cell combination, and the parallel cell combination includes a plurality of cells and a plurality of current collectors. In the parallel cell combination: the cells are connected in parallel, and the poles connected in parallel are respectively connected with other devices through corresponding confluence points. Same poles of two adjacent cells are connected through a corresponding current collector, and the current-carrying specifications of each current collector is lower than the current-carrying requirements of a confluence point of a corresponding pole. That is to say, a conductor that implements the parallel connection of the cells is no longer a whole copper plate, but the individual current collectors, thus realizing the reduction of the cost of the conductor material.

A polymerization process includes contacting an olefin or a mixture of the olefin and one or more copolymerizable comonomers under polymerization conditions with a catalyst composition and forming a polymer with a total ash content of less than 15 ppm. The catalyst composition includes one or more polymerization catalysts; and a mixed external electron donor comprising a selectivity control agent comprising at least one silicon-containing compound containing at least one C1-C10 alkoxy group bonded to a silicon atom.

A polymerization process includes contacting an olefin or a mixture of the olefin and one or more copolymerizable comonomers under polymerization conditions with a catalyst composition and forming a polymer with a total ash content of less than 15 ppm. The catalyst composition includes one or more polymerization catalysts; and a mixed external electron donor comprising a selectivity control agent comprising at least one silicon-containing compound containing at least one C1-C10 alkoxy group bonded to a silicon atom.

A capacitor includes a capacitor element, a case that houses the capacitor element and contains a resin, a metal plate insert molded in the case, and a filler resin filled in the case. The metal plate includes a main plate portion and a covered portion disposed along a perimeter of the main plate portion. The main plate portion has an outer surface exposed outwardly from an opening of the case. The covered portion has an outer surface covered by a peripheral portion of the case, the peripheral portion being disposed around the opening.

A capacitor includes a capacitor element, a case that houses the capacitor element and contains a resin, a metal plate insert molded in the case, and a filler resin filled in the case. The metal plate includes a main plate portion and a covered portion disposed along a perimeter of the main plate portion. The main plate portion has an outer surface exposed outwardly from an opening of the case. The covered portion has an outer surface covered by a peripheral portion of the case, the peripheral portion being disposed around the opening.

A capacitor module includes a capacitor element, a plurality of connection terminals for electrically connecting the capacitor element to a semiconductor module and a power supply that are another equipment, and an exterior coating that includes a resin film having electrical insulating property and wraps the capacitor element except the plurality of connection terminals.

A capacitor that includes an insulating substrate; a capacitance forming portion including a metal porous body, a dielectric film, and a conductive film; and a sealing portion that seals the capacitance forming portion. The capacitance forming portion is on a first main surface of the insulating substrate. A first external connection line including a first via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the metal porous body; and a second external connection line including a second via conductor penetrating the insulating substrate from the first main surface side toward the second main surface side is connected to the conductive film. When viewed in a normal direction of the first main surface, the first via conductor and the second via conductor are both in a region where the capacitance forming portion is disposed.