A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

A wiring board includes an insulating layer having a first surface and a second surface, which are opposite to each other, upper wiring patterns on the first surface of the insulating layer, lower wiring patterns on the second surface of the insulating layer, intermediate wiring patterns, which are disposed in the insulating layer and are electrically connected to the upper wiring patterns and the lower wiring patterns, and a capacitor wire connected to corresponding wiring patterns of the upper wiring patterns, the lower wiring patterns, and the intermediate wiring patterns. The capacitor wire includes a core electrode line having a wire shape, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line.

A wiring board includes an insulating layer having a first surface and a second surface, which are opposite to each other, upper wiring patterns on the first surface of the insulating layer, lower wiring patterns on the second surface of the insulating layer, intermediate wiring patterns, which are disposed in the insulating layer and are electrically connected to the upper wiring patterns and the lower wiring patterns, and a capacitor wire connected to corresponding wiring patterns of the upper wiring patterns, the lower wiring patterns, and the intermediate wiring patterns. The capacitor wire includes a core electrode line having a wire shape, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line.

A method for the assembly of a metal part and a ceramic part, including the following steps: supplying a solid ceramic part of the alumina type; supplying a solid metal part, the metal being selected from platinum and tantalum, or an alloy including a majority of one of these metals; depositing at least one layer, called interface layer, on at least one of the solid parts, the interface layer containing magnesium oxide; bringing into contact the solid metal part and the solid ceramic part such that the interface layer is located between the solid parts; and hot densification under pressure of the solid parts brought into contact, to create a close bond between the solid parts and form a spinel from the interface layer. An electrical device, such as a capacitive sensor having a sensitive part produced according to the present method, is also provided.

A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

A filter device, method of manufacture and use thereof. The filter device comprises a foil-wound inductor formed by a first conductive foil strip having a first terminal and a second terminal, the first conductive foil strip wound around a core to form a plurality of winding layers such that the first terminal is proximate the core and the second terminal is located at the outermost winding layer, and a continuous dielectric insulating layer between the plurality of layers of the first conductive foil strip; and, a tunable capacitor formed by a second conductive foil strip at least partially encircling the outermost layer of the foil-wound inductor and a dielectric insulating layer disposed therebetween, the second conductive foil strip having a portion that can be trimmed to alter a capacitance between the second conductive foil strip and the first or second terminal of the foil-wound inductor. When used in a circuit, the tunable capacitor can be trimmed to compensate for parasitic capacitance associated with the foil-wound inductor.

The invention relates to a voltage division device, comprising a core region with a capacitor arrangement arranged in the core region and an electrical resistor arranged in the core region, a first electrode of the capacitor arrangement with a coupling member for the connection with a voltage-carrying element, a second electrode of the capacitor arrangement with a grounding member for the connection with a grounding element, and wherein the first electrode and the second electrode are connected in an electrically conductive manner via the electrical resistor, wherein the first electrode and the second electrode comprise multiple electrically conductive, substantially finger-shaped or rod-shaped modulation elements. The invention further relates to an arrangement of such a voltage division device on a connecting part of switchgear of a power grid.

The invention relates to a voltage division device, comprising a core region with a capacitor arrangement arranged in the core region and an electrical resistor arranged in the core region, a first electrode of the capacitor arrangement with a coupling member for the connection with a voltage-carrying element, a second electrode of the capacitor arrangement with a grounding member for the connection with a grounding element, and wherein the first electrode and the second electrode are connected in an electrically conductive manner via the electrical resistor, wherein the first electrode and the second electrode comprise multiple electrically conductive, substantially finger-shaped or rod-shaped modulation elements. The invention further relates to an arrangement of such a voltage division device on a connecting part of switchgear of a power grid.