A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.

An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, or a thermal-setting electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, or a thermal-setting electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

The present disclosure relates to a condenser core configured for surrounding an electrical conductor. The condenser core includes an insulation material and a plurality of electrically conducting capacitive layers for modifying electrical fields formed by a current flowing in the electrical conductor. At least one of the electrically conducting capacitive layers includes a first foil and a second foil. Each of the first and second foils of an outermost capacitive layer is connected with a grounding arrangement for grounding the foils.

An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.