A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

An ultracapacitor that is capable of exhibiting good properties even after being subjected to high temperatures, such as experienced during solder reflow, is provided. The ultracapacitor contains a housing having sidewalls that extend in a direction generally perpendicular to a base. An interior cavity is defined between an inner surface of the base and the sidewalls within which an electrode assembly can be positioned. To attach the electrode assembly, first and second conductive members are disposed on the inner surface of the base. The electrode assembly likewise contains first and second leads that extend outwardly therefrom and are electrically connected to the first and second conductive members, respectively. The first and second conductive members are, in turn, electrically connected to first and second external terminations, respectively, which are provided on an outer surface of the base.

A chassis includes a receiving case. The receiving case includes a first base, a second base, and a cover. The first base includes two first side walls. One of the two first side walls includes a first sliding portion. One of the two first side walls includes a multi-segment positioning portion. The second base includes two second side walls. One of the two second side walls includes a second sliding portion. One of the two second side walls includes a multi-segment alignment portion. The cover is pivoted on the first base. The first sliding portion is connected to the second sliding portion, and the multi-segment positioning portion of the first base is adapted to be engaged with the multi-segment alignment portion of the second base, so that the second base is slidably disposed on the first base. The receiving case is adapted to accommodate electronic elements.

A chassis includes a receiving case. The receiving case includes a first base, a second base, and a cover. The first base includes two first side walls. One of the two first side walls includes a first sliding portion. One of the two first side walls includes a multi-segment positioning portion. The second base includes two second side walls. One of the two second side walls includes a second sliding portion. One of the two second side walls includes a multi-segment alignment portion. The cover is pivoted on the first base. The first sliding portion is connected to the second sliding portion, and the multi-segment positioning portion of the first base is adapted to be engaged with the multi-segment alignment portion of the second base, so that the second base is slidably disposed on the first base. The receiving case is adapted to accommodate electronic elements.

A capacitor manufacturing method is disclosed herein that includes a process for the isolation of electrode tabs attached to the capacitors' electrodes from other elements in the capacitor. An isolation patch or layer may be deposited over the tabs by a machine or a device after the tab is attached and before the electrodes are wound into a cylindrical internal element of a capacitor. The device may coat the tabs and surrounding regions with an isolating material. Electrode tabs may be provided with an isolating material pre-deposited at least in part over the tabs.

A housing part for an electrical device, which is an electrical storage device, a sensor housing, a battery, a microbattery, or a capacitor, the housing part including: a feedthrough, the housing part or a base body which is a part of the housing part including the feedthrough, the feedthrough having at least one opening, the at least one opening having a wall with a reduced enclosure length EL.sub.red, the at least one opening configured for receiving a conductive material or a conductor in a glass material or a glass-ceramic material, the reduced enclosure length EL.sub.red being in a range of 0.05 mm to 0.6 mm, 0.1 mm to 0.5 mm, 0.1 mm to 0.4 mm, or 0.15 mm to 0.2 mm.

A housing part for an electrical device, which is an electrical storage device, a sensor housing, a battery, a microbattery, or a capacitor, the housing part including: a feedthrough, the housing part or a base body which is a part of the housing part including the feedthrough, the feedthrough having at least one opening, the at least one opening having a wall with a reduced enclosure length EL.sub.red, the at least one opening configured for receiving a conductive material or a conductor in a glass material or a glass-ceramic material, the reduced enclosure length EL.sub.red being in a range of 0.05 mm to 0.6 mm, 0.1 mm to 0.5 mm, 0.1 mm to 0.4 mm, or 0.15 mm to 0.2 mm.

An electrochemical apparatus includes an electrode assembly, a packaging film, and a first tab, where the first tab is electrically connected to the electrode assembly, the packaging film includes a first packaging film and a second packaging film which are located at two sides of the first tab, the first packaging film includes a first sealing zone, the second packaging film includes a second sealing zone, and the first sealing zone and the second sealing zone are bonded to seal the electrode assembly. The first sealing zone includes a first region and a second region, the first region covers a projection of the first tab on the first sealing zone, the second region connects to the first region, and a width of the second region is less than that of the first region.

An outer packaging for electrical storage devices is composed of a laminate provided with at least a substrate layer, a barrier layer, an adhesive layer, and a thermally adhesive resin layer in this order, wherein the peak melting temperature for the thermally adhesive resin layer is observed at 130° C. or lower, the peak melting temperature for the adhesive layer is observed at 135° C. or higher, the resin constituting the thermally adhesive resin layer has a polyolefin skeleton, and the resin constituting the adhesive layer has a polyolefin skeleton

A power system adapted for supplying power in a high temperature environment is disclosed. The power system includes a rechargeable energy storage that is operable in a temperature range of between about seventy degrees Celsius and about two hundred and fifty degrees Celsius coupled to a circuit for at least one of supplying power from the energy storage and charging the energy storage; wherein the energy storage is configured to store between about one one hundredth (0.01) of a joule and about one hundred megajoules of energy, and to provide peak power of between about one one hundredth (0.01) of a watt and about one hundred megawatts, for at least two charge-discharge cycles. Methods of use and fabrication are provided. Embodiments of additional features of the power supply are included.