A method for forming electrodes assemblies, used for producing secondary lithium batteries, comprises the steps of feeding two separator strips with continuous feed motions, inserting between the two strips a succession of anodes at reciprocal distances that progressively increase, arranging a succession of cathodes, either all on an outer side of a strip, or alternating a cathode on an outer side of a strip and a cathode on an outer side of the other strip, such that on each single anode a single cathode is superimposed with the interposition of one of the two strips; strips, cathodes and anodes are then laminated together, the laminated product is wound in a single winding direction and the wound product is separated from the rest of the laminated product to enable a subsequent electrodes assembly to be formed.

A method for manufacturing a capacitor includes a step of forming a case integrated with a terminal unit designed to be connected with an external terminal, and a step of housing a capacitor element in the case so that the terminal unit is electrically connected to the capacitor element. The step of forming the case includes heating a metal mold to a temperature less than or equal to a glass transition temperature of a thermoplastic resin that is a material for the case. The metal mold internally has a mold part that is a hollow part having a shape of the case. And the step of forming the case further includes, after the heating of the metal mold and inserting the terminal unit into the mold part, injecting the thermoplastic resin in a molten state into the mold part of the metal mold.

A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass. A glass-free conductive paste including a nickel powder, a metal powder, such as tin, having a melting point of lower than about 500° C., and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. The ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. The thermosetting resin is thermally decomposed or burned such that little or none remains, and the nickel powder and metal powder having a melting point of lower than about 500° C. are sintered to form a unified sintered metal body.

A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass is provided. A glass-free conductive paste including a copper-containing metal powder and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, the thermosetting resin is thermally decomposed or burned and thus the thermosetting resin does not remain, and the metal powder is sintered to form a unified sintered metal body.

A multilayer ceramic capacitor includes a glass component of an underlying electrode layer including Zr and Ba, and in a cross-section of the multilayer ceramic capacitor, a Zr/Ba atomic number ratio is not less than about 0.03 and not greater than about 0.15. The underlying electrode layer has a glass-occupied area ratio of not less than about 18% in the cross-section of the multilayer ceramic capacitor. In a SEM image in the cross-section of the multilayer ceramic capacitor, the glass component on an imaginary line α, which is parallel or substantially parallel to the surface of the surface layer of the underlying electrode layer about 3 μm inside of the surface layer of the underlying electrode layer, is not greater than about 0.92 μm.

Disclosed is an electrode leading-out method and packaging method for a tantalum electrolytic capacitor. The electrode leading-out method includes the following steps: S1, fabricating an insulating protective layer outside an electrode body of the tantalum electrolytic capacitor; S2, exposing a cathode leading-out part on a cathode pre-leading-out part, and exposing a tantalum core leading-out end in an area where a terminal of a tantalum core is located; S3, depositing a metal layer on each of the cathode leading-out part and the tantalum core leading-out end which are exposed; and S4, fabricating an outer electrode for mounting on each of the metal layer of the cathode leading-out part and the metal layer of the tantalum core leading-out end so as to respectively lead out a cathode and an anode.

Disclosed are a dielectric ceramic includes a plurality of crystal grain bulks including a ceramic, and a grain boundary between the plurality of crystal grain bulks, wherein a dopant is segregated in the grain boundary.

An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).

An apparatus for manufacturing electrical energy storage devices, comprising a path for feeding material with intermittent feed and two machining stations arranged one after the other in the feed path, in which each machining station is movable on a linear guide at the command of a motor to vary its position along the feed path and enable the mutual distance between the two machining stations to be adjusted in function of the step of intermittent feed of the material, so that the apparatus is adaptable to the change in product size.

A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.