A relay terminal includes an upper conductive and lower conductive plate, each having a plate surface intersecting with the Y direction, and a coupling part that couples the upper conductive plate and the lower conductive plate to each other. The coupling part is provided on one end in the Z direction of a combination of the upper conductive plate and the lower conductive plate, such that the coupling part connects both to a middle portion in the X direction of the upper conductive plate and to a middle portion in the X direction of the lower conductive plate. First and second pairs of contact parts are formed on the plate surfaces in end sides in the X direction of the upper and lower conductive plates, each contact part having a curved surface.

A solid state relay (SSR) module may include a first solid state switch configured to establish and break an electrical connection between an input terminal and an output terminal. The module includes an electronic controller configured to turn the first solid state switch on or off and a top cover formed of an electrically insulative thermoplastic material. The power circuit board is disposed within a cavity in the top cover. The top cover defines openings through which the input and output terminals extend. The module also includes a thermally conductive bottom cover in thermal communication with the first solid state switch, a compliant thermal interface paste disposed between the bottom cover and the first solid state switch, and a resilient thermal interface pad attached to the bottom cover by an adhesive layer on the resilient thermal interface pad.

A solid state relay (SSR) module may include a first solid state switch configured to establish and break an electrical connection between an input terminal and an output terminal. The module includes an electronic controller configured to turn the first solid state switch on or off and a top cover formed of an electrically insulative thermoplastic material. The power circuit board is disposed within a cavity in the top cover. The top cover defines openings through which the input and output terminals extend. The module also includes a thermally conductive bottom cover in thermal communication with the first solid state switch, a compliant thermal interface paste disposed between the bottom cover and the first solid state switch, and a resilient thermal interface pad attached to the bottom cover by an adhesive layer on the resilient thermal interface pad.

A relay (100) is provided. The relay (100) includes an insulating housing (10) defining an accommodating cavity (11) therein; two binding posts (12) disposed to the insulating housing (10), each having an end extending into the accommodating cavity (11); an insulating plate (20) disposed within the accommodating cavity (11), movable between a first position and a second position, and having two connecting contacts (21) disposed on a first side of the insulating plate (20) facing the binding posts (12); a fuse (30) disposed between the two connecting contacts (21); a mounting base (40) connected to the insulating housing (10); and a push rod (41) movably disposed to the mounting base (40) and connected to the insulating plate (20), in which when the insulating plate (20) is located at the first position, the two connecting contacts (21) abut against the two binding posts (12) respectively, and when the insulating plate (20) is located at the second position, the two connecting contacts (21) detach from the two binding posts (12) respectively.

A relay (100) is provided. The relay (100) includes an insulating housing (10) defining an accommodating cavity (11) therein; two binding posts (12) disposed to the insulating housing (10), each having an end extending into the accommodating cavity (11); an insulating plate (20) disposed within the accommodating cavity (11), movable between a first position and a second position, and having two connecting contacts (21) disposed on a first side of the insulating plate (20) facing the binding posts (12); a fuse (30) disposed between the two connecting contacts (21); a mounting base (40) connected to the insulating housing (10); and a push rod (41) movably disposed to the mounting base (40) and connected to the insulating plate (20), in which when the insulating plate (20) is located at the first position, the two connecting contacts (21) abut against the two binding posts (12) respectively, and when the insulating plate (20) is located at the second position, the two connecting contacts (21) detach from the two binding posts (12) respectively.

A relay control circuit includes a relay module, a drive module, and a control module. The relay module comprises a plurality of relays and an auxiliary diagnostic unit electrically coupled to the relays. The drive module comprises a drive chip electrically coupled to the relays. The control module comprises a control unit electrically coupled to the drive chip and the auxiliary diagnostic unit. Each of the drive chip and the auxiliary diagnostic unit detects an operating state of each relay, and outputs the operating state of each relay to the control unit. When the operating state of each relay detected by the drive chip or the operating state of each relay detected by the auxiliary diagnostic unit indicates any relay fails, the control unit controls the drive chip to stop operating, and each relay is turned off.

A relay control circuit includes a relay module, a drive module, and a control module. The relay module comprises a plurality of relays and an auxiliary diagnostic unit electrically coupled to the relays. The drive module comprises a drive chip electrically coupled to the relays. The control module comprises a control unit electrically coupled to the drive chip and the auxiliary diagnostic unit. Each of the drive chip and the auxiliary diagnostic unit detects an operating state of each relay, and outputs the operating state of each relay to the control unit. When the operating state of each relay detected by the drive chip or the operating state of each relay detected by the auxiliary diagnostic unit indicates any relay fails, the control unit controls the drive chip to stop operating, and each relay is turned off.

An electronic component including a component main body and a plurality of lead terminals is inserted and accommodated in a housing member, the lead terminals are brought into contact with a plurality of terminal fittings held in the housing member. The lead terminals are formed such that at least one of the number of lead terminals on each side surface before and after the reversing, a distance between the contact portion and the side surface of the component main body facing the contact portion, and a width dimension in a direction perpendicular to the extending direction of the contact portion differs, when the component main body is rotated at 180 degrees to reverse the positions of the pair of opposite side surfaces of the component main body. Accordingly, it is possible to prevent improper assembly of an electronic component.

An electronic component including a component main body and a plurality of lead terminals is inserted and accommodated in a housing member, the lead terminals are brought into contact with a plurality of terminal fittings held in the housing member. The lead terminals are formed such that at least one of the number of lead terminals on each side surface before and after the reversing, a distance between the contact portion and the side surface of the component main body facing the contact portion, and a width dimension in a direction perpendicular to the extending direction of the contact portion differs, when the component main body is rotated at 180 degrees to reverse the positions of the pair of opposite side surfaces of the component main body. Accordingly, it is possible to prevent improper assembly of an electronic component.

A power distribution device has a resin part covering a portion of a power line and a portion of a signal line and having a switch adjacent to one surface of the resin part, and a cooling part disposed adjacent to a back surface of the resin part opposite to the one surface. The power line and the signal line each have, inside the resin part, a laid-out portion extending in a planar direction orthogonal to an arrangement direction in which the one surface and the back surface are arranged, and a led-out portion extending from the laid-out portion toward the one surface. The laid-out portion of the power line and the laid-out portion of the signal line are located in a projection area of the cooling unit projected in the arrangement direction, and are separated from each other and arranged in the arrangement direction.